Untitled
Abstract: No abstract text available
Text: Thermal Data DPAK & PPAK 3 leads 5 leads PACKAGE MATERIAL LIST item # material thickness leadframe copper 0.5 mm slug high thermal conductivity Cu 0.5 mm die attach soft solder glu 15-50 µm molding compound epoxy resin 2.23-2.35 mm Thermal Resistance & Maximum Power Dissipation vs P.C.B. Copper Area
|
Original
|
|
PDF
|
diode sm4007 -MELF
Abstract: SMA Package diode schottky 1000V 2a TVS diode MELF FLYBACK CLAMPING DIODE Schottky melf diode sm4007 SM4007 Diode 3A 440V TVS Diode cross
Text: Application Note Comparison between Melf and SMA package Comparison between Melf and SMA package Melf package cross section SMA package (cross section) Build with massive copper plugs (Nickel Build in copper leadframe technology plated) * Superior thermal resistance due to massive * Leadframe technology has got higher thermal
|
Original
|
A/1000V
SM4007
10K/W
30K/W
SM2000
A/2000V
SM54xx
SK34SMA
diode sm4007 -MELF
SMA Package
diode schottky 1000V 2a
TVS diode MELF
FLYBACK CLAMPING DIODE
Schottky melf
diode sm4007
SM4007 Diode
3A 440V
TVS Diode cross
|
PDF
|
TQFP 64 PACKAGE rth
Abstract: 10X10
Text: Thermal Data TQFP 10x10 44,64 leads 64 leads 44 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach epoxy glue silver filled
|
Original
|
10x10
063W/cm
10x10
TQFP 64 PACKAGE rth
|
PDF
|
MO-048
Abstract: MULTIWATT die TH17023
Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach
|
Original
|
MO-048
063W/cm
TH17023
175x195
MO-048
MULTIWATT die
|
PDF
|
MO-048
Abstract: MULTIWATT die CMC 15 EPOXY RESIN
Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach
|
Original
|
MO-048
063W/cm
TH17023
175x195
MO-048
MULTIWATT die
CMC 15
EPOXY RESIN
|
PDF
|
MO-048
Abstract: No abstract text available
Text: Thermal Data MULTIWATT Family 8,11,15 leads JEDEC MO-048 8 leads 11 leads 15 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach
|
Original
|
MO-048
063W/cm
TH17023
175x195
MO-048
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 3 leads 5 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder
|
Original
|
O-220,
063W/cm
O-220
120x130
TH17023
175x195
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Thermal Data D2PAK 3 leads PACKAGE MATERIAL LIST item # material thickness leadframe copper 0.5 mm slug high thermal conductivity Cu 0.5 mm die attach soft solder glu 15-50 µm molding compound epoxy resin 2.23-2.35 mm Charts enclosed : 1) Thermal Resistance and Maximum Power Dissipated
|
Original
|
|
PDF
|
heat sink to220
Abstract: TH17023
Text: Thermal Data TO-220, PENTAWATT, HEPTAWATT 3,5,7 leads 5 leads 3 leads 7 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.5 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach sof solder
|
Original
|
O-220,
063W/cm
O-220
120x130
TH17023
175x195
heat sink to220
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Thermal Data D2PAK 3 leads PACKAGE MATERIAL LIST item # material thickness leadframe copper 0.5 mm slug high thermal conductivity Cu 0.5 mm die attach soft solder glu 15-50 µm molding compound epoxy resin 2.23-2.35 mm Charts enclosed : 1) Thermal Resistance and Maximum Power Dissipated
|
Original
|
|
PDF
|
MO-166
Abstract: heat slug for JEDEC MO-166 Power SO20
Text: Thermal Data POWER SO-20 Family 20, 36 leads JEDEC MO-166 20 leads 36 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.27 mm 3.9 W/cm°C die attach soft solder
|
Original
|
SO-20
MO-166
063W/cm
MO-166
heat slug for JEDEC
MO-166 Power SO20
|
PDF
|
TQFP 64 PACKAGE rth
Abstract: conductivity w502
Text: Thermal Data TQFP 10x10 44,64 leads 44 leads 64 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.15 mm 3.9 W/cm°C slug high thermal conductivity Cu 0.5 mm 3.9 W/cm°C die attach silver glue 10-40 µm 0.01 W/cm°C
|
Original
|
10x10
063W/cm
TQFP 64 PACKAGE rth
conductivity
w502
|
PDF
|
FLEXIWATT25
Abstract: Flexiwatt
Text: Thermal Data FLEXIWATT 25 leads 25 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.38 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C
|
Original
|
063W/cm
FLEXIWATT25
FLEXIWATT25
Flexiwatt
|
PDF
|
Flexiwatt25 thermal data
Abstract: flexiwatt25
Text: Thermal Data FLEXIWATT 25 leads 25 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C slug high thermal conductivity Cu 1.5 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.5 W/cm°C
|
Original
|
063W/cm
FLEXIWATT25
Flexiwatt25 thermal data
flexiwatt25
|
PDF
|
|
|
Alloy 42
Abstract: No abstract text available
Text: AN815 Vishay Siliconix Single-Channel LITTLE FOOTR SC-70 6-Pin MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance Michael Speed INTRODUCTION pins as drain leads, which helps to reduce on-resistance and junction-to-ambient thermal resistance.
|
Original
|
AN815
SC-70
Si14xxEDH
Si19xxEDH
Si15xxEDH
15-Jan-01
Alloy 42
|
PDF
|
MF202
Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical
|
Original
|
16-pin
MF202
160P6)
152P6T)
135S8)
42Alloy)
leadframe materials
QFP PACKAGE thermal resistance
POWER QFP
MITSUBISHI INTEGRATED CIRCUIT PACKAGES
|
PDF
|
Untitled
Abstract: No abstract text available
Text: VISHAY SILICONIX www.vishay.com Power MOSFETs Application Note AN917 Dual-Channel LITTLE FOOT 6-Pin SC-70 MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance 175 °C Rated Part INTRODUCTION The new dual 6-pin SC-70 package with a copper leadframe
|
Original
|
AN917
SC-70
laySx15xxEEH
SC70-6
15-Apr-13
|
PDF
|
AN816
Abstract: Dual N-Channel mosfet sot-363 SC70-6 sc-70 package pcb layout
Text: AN816 Vishay Siliconix Dual-Channel LITTLE FOOTR 6-Pin SC-70 MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance INTRODUCTION 87 mil 26 (mil) The new dual 6-pin SC-70 package with a copper leadframe enables improved on-resistance values and enhanced
|
Original
|
AN816
SC-70
Si19xxEDH
Si15xxEDH
12-Dec-03
SC70-6
AN816
Dual N-Channel mosfet sot-363
sc-70 package pcb layout
|
PDF
|
TQFP 14X14
Abstract: No abstract text available
Text: Thermal Data TQFP 14x14 44, 80,100 leads 44 to 100 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 3.9 W/cm°C die attach epoxy glue silver filled 10-40 µm 0.01 W/cm°C molding compound epoxy resin
|
Original
|
14x14
063W/cm
14x14
TQFP 14X14
|
PDF
|
Alloy 42
Abstract: AN815 sc-70 package pcb layout SC70-6 Si19xxEDH
Text: AN815 Vishay Siliconix Single-Channel LITTLE FOOTR SC-70 6-Pin MOSFET Copper Leadframe Version Recommended Pad Pattern and Thermal Performance INTRODUCTION EVALUATION BOARDS Ċ SINGLE SC70-6 The new single 6-pin SC-70 package with a copper leadframe enables improved on-resistance values and enhanced
|
Original
|
AN815
SC-70
SC70-6
Si14xxEDH
Si19xxEDH
Si15xxEDH
12-Dec-03
Alloy 42
AN815
sc-70 package pcb layout
SC70-6
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Thermal Data SO 16 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.20 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.65 mm 0.0063W/cm°C Charts enclosed :
|
Original
|
063W/cm
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Thermal Data MINIDIP 8 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.4 mm 3.9 W/cm°C die attach soft solder tin / lead 15-50 µm 0.2 W/cm°C molding compound epoxy resin 3 mm 0.0063W/cm°C Charts enclosed :
|
Original
|
063W/cm
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Thermal Data SDIP 30 30 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Charts enclosed :
|
Original
|
063W/cm
160x80
80x80
80x160
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Thermal Data SDIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.3 mm 0.0063W/cm°C Leadframe options:
|
Original
|
063W/cm
160x80
80x80
80x160
|
PDF
|
