Untitled
Abstract: No abstract text available
Text: PROCESS CPD31X Schottky Rectifier 10 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size 85 x 85 MILS Die Thickness 5.9 MILS ± 0.8 MILS Anode Bonding Pad Area 78 x 78 MILS Top Side Metalization Al/Ni/Au – 30,000Å/4,000Å/1,500Å Back Side Metalization
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CPD31X
CSHD10-60
17-October
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CPD31X
Abstract: No abstract text available
Text: CPD31X Schottky Rectifier Die 10 Amp, 60 Volt w w w. c e n t r a l s e m i . c o m The CPD31X Schottky die is optimized for alternative energy applications. The 6 mil thick die provides an ultra low profile that is readily attached via standard die attach methods.
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CPD31X
CPD31X
CPD31X-WN:
CPD31X-WR:
17-October
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Untitled
Abstract: No abstract text available
Text: CPD31X Schottky Diode Chip 145 Adams Avenue, Hauppauge, NY 11788 USA Tel: 631 435-1110 Fax: (631) 435-1824 w w w . c e n t r a l s e m i . c o m The CPD31X Schottky die is optimized for alternative energy applications. The 6 mil thick die provides an ultra low profile that is readily attached via standard die attach methods.
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CPD31X
CPD31X
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Untitled
Abstract: No abstract text available
Text: CPD31X Schottky Diode Chip w w w. c e n t r a l s e m i . c o m The CPD31X Schottky die is optimized for alternative energy applications. The 6 mil thick die provides an ultra low profile that is readily attached via standard die attach methods. Parametrically, the device is extremely energy efficient as a result of low forward and reverse
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CPD31X
CPD31X
CPD31X-WN:
CPD31X-WR:
11-August
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