Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-C01 EIAJ code : ∗DIP024-G-0600-2 Lead pitch 100mil Row spacing 600mil Sealing method Cerdip 24-pin ceramic DIP DIP-24C-C01 24-pin ceramic DIP (DIP-24C-C01) +1.02 +.040 31.78 –0.33 1.251–.013 R0.64(.025) REF
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DIP-24C-C01
DIP024-G-0600-2
100mil
600mil
24-pin
DIP-24C-C01)
D24008SC-3-4
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24-Pin Plastic DIP
Abstract: DIP024-P-0600-1
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M02 EIAJ code :∗DIP024-P-0600-1 24-pin plastic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Plastic mold DIP-24P-M02 24-pin plastic DIP (DIP-24P-M02) +0.20 +.008
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PDF
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DIP-24P-M02
DIP024-P-0600-1
24-pin
DIP-24P-M02)
D24015S-2C-3
24-Pin Plastic DIP
DIP024-P-0600-1
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DIP-24C-C04
Abstract: No abstract text available
Text: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-C04 EIAJ code :∗DIP024-G-0300-1 24-pin ceramic SK-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Cerdip DIP-24C-C04 24-pin ceramic SK-DIP (DIP-24C-C04) 0.69
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PDF
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DIP-24C-C04
DIP024-G-0300-1
24-pin
DIP-24C-C04)
D24016SC-3-3
DIP-24C-C04
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-A07 EIAJ code : ∗DIP024-C-0600-4 24-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-24C-A07 24-pin ceramic DIP (DIP-24C-A07) 30.48±0.36 (1.200±.014) R1.27(.050) REF +0.25
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PDF
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DIP-24C-A07
DIP024-C-0600-4
100mil
600mil
24-pin
DIP-24C-A07)
D24021SC-1-3
24021SC-1-3
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24-Pin Ceramic DIP
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-A06 EIAJ code : ∗DIP024-C-0600-3 24-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-24C-A06 24-pin ceramic DIP (DIP-24C-A06) 30.48±0.36 (1.200±.014) R0.64(.025) REF 14.99±0.25
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Original
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PDF
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DIP-24C-A06
DIP024-C-0600-3
100mil
600mil
24-pin
DIP-24C-A06)
D24028SC-2-3
24-Pin Ceramic DIP
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DIP024-P-0600-1
Abstract: 24-Pin Plastic DIP
Text: DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M02 EIAJ code : ∗DIP024-P-0600-1 24-pin plastic DIP Lead pitch 100mil Row spacing 600mil Sealing method Plastic mold DIP-24P-M02 24-pin plastic DIP (DIP-24P-M02) +.008 +0.20 30.20 –0.30 1.189 –.012 INDEX-1
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PDF
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DIP-24P-M02
DIP024-P-0600-1
100mil
600mil
24-pin
DIP-24P-M02)
D24015S-2C-3
DIP024-P-0600-1
24-Pin Plastic DIP
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DIP024-C-0400-1
Abstract: 24-Pin Ceramic DIP
Text: SLIM DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-A05 EIAJ code : ∗DIP024-C-0400-1 24-pin ceramic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Metal seal DIP-24C-A05 24-pin ceramic SL-DIP (DIP-24C-A05) 30.48±0.36 (1.200±.014) R1.27(.050)
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Original
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PDF
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DIP-24C-A05
DIP024-C-0400-1
100mil
400mil
24-pin
DIP-24C-A05)
D24027SC-2-3
DIP024-C-0400-1
24-Pin Ceramic DIP
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dip 24 dimension
Abstract: No abstract text available
Text: SHRINK DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 Lead pitch 70mil Row spacing 300mil Sealing method Plastic mold 24-pin plastic SH-DIP DIP-24P-M05 24-pin plastic SH-DIP (DIP-24P-M05) +0.20 22.05 –0.30 .868 +.008 –.012
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PDF
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DIP-24P-M05
SDIP024-P-0300-1
70mil
300mil
24-pin
DIP-24P-M05)
D24034S-3C-2
dip 24 dimension
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-C03 EIAJ code : ∗DIP024-G-0600-3 Lead pitch 100mil Row spacing 600mil Sealing method Cerdip 24-pin ceramic DIP DIP-24C-C03 24-pin ceramic DIP (DIP-24C-C03) +1.02 +.040 31.78 –0.33 1.251–.013 R0.64(.025) REF
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Original
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PDF
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DIP-24C-C03
DIP024-G-0600-3
100mil
600mil
24-pin
DIP-24C-C03)
D24014SC-2-3
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Untitled
Abstract: No abstract text available
Text: SKINNY DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M03 EIAJ code : ∗DIP024-P-0300-1 24-pin plastic SK-DIP Lead pitch 100mil Row spacing 300mil Sealing method Plastic mold DIP-24P-M03 24-pin plastic SK-DIP (DIP-24P-M03) +0.20 29.72 –0.30 1.170 +.008 –.012
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PDF
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DIP-24P-M03
DIP024-P-0300-1
100mil
300mil
24-pin
DIP-24P-M03)
D24017S-3C-2
|
Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-A04 EIAJ code :∗DIP024-C-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A04 24-pin ceramic DIP (DIP-24C-A04) 30.48 ± 0.36
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Original
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PDF
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DIP-24C-A04
DIP024-C-0600-2
24-pin
DIP-24C-A04)
D24013SC-2-3
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DIP-24P-M04
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M04 EIAJ code : ∗DIP024-P-0400-1 24-pin plastic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Plastic mold DIP-24P-M04 24-pin plastic SL-DIP (DIP-24P-M04) +0.20 30.28 –0.30 +.008 1.192 –.012
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Original
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PDF
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DIP-24P-M04
DIP024-P-0400-1
100mil
400mil
24-pin
DIP-24P-M04)
D24025S-3C-3
DIP-24P-M04
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2972
Abstract: DIP-24P-M03
Text: SKINNY DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M03 EIAJ code :∗DIP024-P-0300-1 24-pin plastic SK-DIP Lead pitch 100 mil Row spacing 300 mil Sealing method Plastic mold DIP-24P-M03 24-pin plastic SK-DIP (DIP-24P-M03)
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Original
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PDF
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DIP-24P-M03
DIP024-P-0300-1
24-pin
DIP-24P-M03)
D24017S-3C-2
2972
DIP-24P-M03
|
Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-A07 EIAJ code :∗DIP024-C-0600-4 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A07 24-pin ceramic DIP (DIP-24C-A07) 30.48±0.36 (1.200±.014)
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Original
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PDF
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DIP-24C-A07
DIP024-C-0600-4
24-pin
DIP-24C-A07)
D24021SC-1-3
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|
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Untitled
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-C05 EIAJ code : ∗DIP024-G-0400-1 24-pin ceramic SL-DIP Lead pitch 100mil Row spacing 400mil Sealing method Cerdip DIP-24C-C05 24-pin ceramic SL-DIP (DIP-24C-C05) +0.69 30.30 –0.33 +.027 1.193 –.013 R0.64(.025)
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Original
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PDF
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DIP-24C-C05
DIP024-G-0400-1
100mil
400mil
24-pin
DIP-24C-C05)
D24020SC-3-3
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Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-A06 EIAJ code :∗DIP024-C-0600-3 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A06 24-pin ceramic DIP (DIP-24C-A06) 30.48±0.36 (1.200±.014)
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Original
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PDF
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DIP-24C-A06
DIP024-C-0600-3
24-pin
DIP-24C-A06)
D24028SC-2-3
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24cc01
Abstract: DIP-24C-C
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-C01 EIAJ code :∗DIP024-G-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-24C-C01 24-pin ceramic DIP (DIP-24C-C01) +1.02 +.040 31.78 –0.33 1.251 –.013
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Original
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PDF
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DIP-24C-C01
DIP024-G-0600-2
24-pin
DIP-24C-C01)
D24008SC-3-4
24cc01
DIP-24C-C
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SDIP024
Abstract: No abstract text available
Text: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN PLASTIC DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 24-pin plastic SH-DIP Lead pitch 70 mil Row spacing 300 mil Sealing method Plastic mold DIP-24P-M05 24-pin plastic SH-DIP (DIP-24P-M05) +0.20
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Original
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PDF
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DIP-24P-M05
SDIP024-P-0300-1
24-pin
DIP-24P-M05)
D24034S-3C-2
SDIP024
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24-Pin Ceramic DIP
Abstract: DIP-24C-C04
Text: SKINNY DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-C04 EIAJ code : ∗DIP024-G-0300-1 24-pin ceramic SK-DIP Lead pitch 100mil Row spacing 400mil Sealing method Cerdip DIP-24C-C04 24-pin ceramic SK-DIP (DIP-24C-C04) 0.69 .027 30.30 +– 0.33 (1.193 +– .013
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Original
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PDF
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DIP-24C-C04
DIP024-G-0300-1
100mil
400mil
24-pin
DIP-24C-C04)
D24016SC-3-3
30024C-C04
24-Pin Ceramic DIP
DIP-24C-C04
|
DIP-24C-C03
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-C03 EIAJ code :∗DIP024-G-0600-3 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-24C-C03 24-pin ceramic DIP (DIP-24C-C03) +1.02 +.040 31.78 –0.33 1.251 –.013
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Original
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PDF
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DIP-24C-C03
DIP024-G-0600-3
24-pin
DIP-24C-C03)
D24014SC-2-3
DIP-24C-C03
|
DIP024-C-0400-1
Abstract: No abstract text available
Text: SLIM DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC DIP-24C-C05 EIAJ code :∗DIP024-C-0400-1 24-pin ceramic SL-DIP Lead pitch 100 mil Row spacing 400 mil Sealing method Cerdip DIP-24C-C05 24-pin ceramic SL-DIP (DIP-24C-C05) +0.69 30.30 –0.33
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Original
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PDF
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DIP-24C-C05
DIP024-C-0400-1
24-pin
DIP-24C-C05)
D24020SC-3-3
DIP024-C-0400-1
|
Untitled
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE 24 PIN CERAMIC DIP-24C-A04 EIAJ code : ∗DIP024-C-0600-2 24-pin ceramic DIP Lead pitch 100mil Row spacing 600mil Sealing method Metal seal DIP-24C-A04 24-pin ceramic DIP (DIP-24C-A04) 30.48 ± 0.36 (1.200 ± .014) R1.27 (.050) REF 14.94 ± 0.25
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Original
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PDF
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DIP-24C-A04
DIP024-C-0600-2
100mil
600mil
24-pin
DIP-24C-A04)
D24013SC-2-3
|
24-Pin Ceramic DIP
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-C03 EIAJ code :∗DIP024-G-0600-3 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Cerdip DIP-24C-C03 24-pin ceramic DIP
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Original
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PDF
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DIP-24C-C03
DIP024-G-0600-3
24-pin
DIP-24C-C03)
D24014SC-2-3
24-Pin Ceramic DIP
|
dip 24 dimension
Abstract: No abstract text available
Text: DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 24 PIN CERAMIC To Top / Package Lineup / Package Index DIP-24C-A04 EIAJ code :∗DIP024-C-0600-2 24-pin ceramic DIP Lead pitch 100 mil Row spacing 600 mil Sealing method Metal seal DIP-24C-A04 24-pin ceramic DIP
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Original
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PDF
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DIP-24C-A04
DIP024-C-0600-2
24-pin
DIP-24C-A04)
D24013SC-2-3
dip 24 dimension
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