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    DPS32 Price and Stock

    Omega Engineering DPS3207-TC

    TEMPERATURE/PROCESS SCANNER, 7-C
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    DigiKey DPS3207-TC Bulk 1
    • 1 $1446.36
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    Omega Engineering DPS3207-TC-3

    TEMPERATURE/PROCESS SCANNER, 7-C
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DPS3207-TC-3 Bulk 1
    • 1 $1774.08
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    Avnet Americas DPS3207-TC-3 Bulk 3 Weeks 1
    • 1 $1443.7922
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    Newark DPS3207-TC-3 Bulk 1
    • 1 $1443.79
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    Omega Engineering DPS3204-S-2-5

    TEMPERATURE/PROCESS SCANNER, 4-C
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DPS3204-S-2-5 Bulk 1
    • 1 $1294.86
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    Newark DPS3204-S-2-5 Bulk 1 1
    • 1 $1021.3
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    • 10000 $1021.3
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    Omega Engineering DPS3204-S-1-5

    1/8 DIN 4 & 7-CHANNEL TEMPERATURE OR PROCESS SCANNER WITH OPTIONAL OUTPUTS - Bulk (Alt: DPS3204-S-1-5)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas DPS3204-S-1-5 Bulk 3 Weeks 1
    • 1 $1037.2004
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    Newark DPS3204-S-1-5 Bulk 1
    • 1 $1037.2
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    • 100 $1037.2
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    Omega Engineering DPS3207-TH

    1/8 DIN 4 & 7-CHANNEL TEMPERATURE OR PROCESS SCANNER WITH OPTIONAL OUTPUTS - Bulk (Alt: DPS3207-TH)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas DPS3207-TH Bulk 3 Weeks 1
    • 1 $1153.3726
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    Newark DPS3207-TH Bulk 1
    • 1 $1153.37
    • 10 $1153.37
    • 100 $1153.37
    • 1000 $1153.37
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    DPS32 Datasheets (7)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DPS32KX32Y5 DPAC Technologies M-densus High Density Memory Scan PDF
    DPS32KX32Y5-12C DPAC Technologies 1 Megabit High Speed SRAM Scan PDF
    DPS32KX32Y5-12CI DPAC Technologies 1 Megabit High Speed SRAM Scan PDF
    DPS32KX32Y5-15C DPAC Technologies 1 Megabit High Speed SRAM Scan PDF
    DPS32KX32Y5-15CI DPAC Technologies 1 Megabit High Speed SRAM Scan PDF
    DPS32KX32Y5-20C DPAC Technologies 1 Megabit High Speed SRAM Scan PDF
    DPS32KX32Y5-20CI DPAC Technologies 1 Megabit High Speed SRAM Scan PDF

    DPS32 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    DPD72PG1

    Abstract: 23L206 AA2876A 34n20 DPD72 AA2876 DPS32PG1 270AN Anaheim Automation
    Text: DPD72PG1 DPS32PG1 DPL Anaheim Automation Driver Packs with pulse generator incorporate a bilevel driver, matching power supply and pulse generator. The AA2876 Pulse Generator is used in the DPS32PG1 and DPD72PG1 units while the DPL has its Pulse Generator built into its circuitry. There are


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    DPD72PG1 DPS32PG1 AA2876 DPS32PG1 DPD72PG1 DPD72PG1, 23L206 23L306 AA2876A 34n20 DPD72 270AN Anaheim Automation PDF

    Untitled

    Abstract: No abstract text available
    Text: □PM . Dense-Pac Microsystems Inc. DPS32M8A ^ HICH SPEED 32K X 8 CMOS SRAM MONOLITHIC ADVANCED INFORMATION DESCRIPTION: The DPS32M8A is a 32K X 8 CMOS Static Random Access Memory SRAM . The memory utilizes asynchronous circuitry and may be maintained in any


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    DPS32M8A DPS32M8A DPS32M 30A001-10 PDF

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    Abstract: No abstract text available
    Text: 1 Megabit CMOS SRAM D EN SE-PA C DPS3232V M I C R O S Y S Ï li M S DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs are


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    DPS3232V 66-pin 128Kx32 256Kx32, DPS3232V 12SKX8, 64KX16 PDF

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    Abstract: No abstract text available
    Text: □PM DPS32M8A Dense-Pac Microsystems, Inc. O H IG H SPEED 32K X 8 C M O S S R A M M O N O L IT H IC ADVANCED INFORMATION D ESCRIPTIO N: The D P S 3 2 M 8 A is a 32K X 8 C M O S Static Random A c ce ss M e m o ry SR A M . The m em ory utilizes asynchronous circuitry and may be maintained in any


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    DPS32M8A 28-Pin 32-Pad 30AOOM PDF

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    Abstract: No abstract text available
    Text: T Dense-Pac Microsystems, Inc. DPS32M8A H IG H SP E E D 3 2 K X 8 C M O S S R A M M O N O L IT H IC O ADVANCED INFORMATION DESCRIPTION: The D P S 3 2 M 8 A is a 3 2 K X 8 C M O S Static Random A c c e s s M e m o r y S R A M . T h e m e m o ry utilizes


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    DPS32M8A PS32M 28-Pin 32-Pad 30A001-10 PDF

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    Abstract: No abstract text available
    Text: / □PM Dense-Pac Microsystems, Inc. DPS32X16A r o H I G H S P E E D 3 2 K X 16 C M O S S R A M P G A M O D U L E PRELIMINARY D E S C R IP T IO N : The D P S 3 2 X 1 6 A is a 40-pin Pin Grid Array P G A consisting of two 3 2 K X 8 S R A M devices in ceramic


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    PS32X 40-pin 150ns 30A05001 PDF

    twilight

    Abstract: No abstract text available
    Text: □PM Dense-Pac Microsystems, Inc. DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE O DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 3 2 K X8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceram ic substrate w ith m atching thermal


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    DPS3232V DPS3232V 66-pin 128KX32 256KX32 S3232 100ns 120ns 150ns twilight PDF

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    Abstract: No abstract text available
    Text: DPS32X16A □PM Dense-Pac Microsystems, Inc. O H IG H SPEED 3 2 K X 16 C M O S S R A M P G A M O D U L E PRELIM INARY DESCRIPTIO N: The DPS32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 S R A M devices in ceramic LCC packages surface mounted on a co-fired ceramic


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    DPS32X16A DPS32X16A 40-pin 150ns Ope55 100ns 120ns 32KX16 30A050-01 PDF

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    Abstract: No abstract text available
    Text: □PM DPS32M8A Dense-Pac Microsystems. Inc. HIGH SPEED 32K X 8 CM OS SRAM MONOLITHIC ADVANCED INFORMATION DESCRIPTION: The DPS32M8A is a 32K X 8 CM OS Static Random Access Memory SRAM . The memory utilizes asynchronous circuitry and may be maintained in any


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    DPS32M8A DPS32M8A PS32M PDF

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    Abstract: No abstract text available
    Text: D FN SF-P A C m,rc li o s y s r Jr: .vi 3 /k -D & u u s High Density Memory Device 1 Megabit High Speed SRAM DPS32KX32Y5 PRELIMINARY D ESCR IPTIO N : The DPS32KX32Y5 a 32K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of


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    DPS32KX32Y5 DPS32KX32Y5 128Kx& 30A192 PDF

    "32K x 32" SRAM

    Abstract: DPS32KX32Y5
    Text: DENSE-PAC 1 Megabit High Speed SRAM /H - ~ D c n S tiS H/gft Density Memory Device m icrosystem s dps32KX32Y5 PRELIMINARY DESCRIPTION: The DPS32KX32Y5 a 32K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of


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    DPS32KX32Y5 DPS32KX32Y5 128Kx8 30A192-06 "32K x 32" SRAM PDF

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    Abstract: No abstract text available
    Text: D E N S E -P A C M 1 C R O S Y S T e Ms /H - T c n S k S ¡-j¡gh Density Memory Device 1 Megabit High Speed SRAM dps32KX32Y5 PRELIMINARY DESCRIPTION: The DPS32KX32Y5 a 32K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of


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    dps32KX32Y5 DPS32KX32Y5 30A192-06 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V DESCRIPTION: The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchi ng thermal coeffi cients. The LCCs


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    DPS3232V DPS3232V 66-pin 128Kx32 256Kx32, 128KX8, 64KX16 32KX32 30A014-10 275T415 PDF

    32Kx4

    Abstract: No abstract text available
    Text: □P M DPS32X16A Dense-Pac Microsystems, Inc. O H IG H SPEED 32K X 16 C M O S S R A M P G A M O D U L E PRELIMINARY DESCRIPTION: The DPS32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 SR A M devices in ceramic LCC packages surface mounted on a co-fired ceramic


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    DPS32X16A DPS32X16A 40-pin 150ns A0-A14 30A05001 32Kx4 PDF

    Untitled

    Abstract: No abstract text available
    Text: 1 Megabit CMOS SRAM D EN SEFAC M I C R O S Y S ï If MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs


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    DPS3232V-35I-TI DPS3232V-35I-TI 66-pin 64KX32 PDF

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    Abstract: No abstract text available
    Text: DPS3232V Dense-Pac Microsystems, Inc. ^ 32K X 32 CMOS SRAM VERSAPAC MODULE DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceramic LCC packages surface m o u n te d on a co-fired c e ra m ic s u b s tra te w ith m a tc h in g th e rm a l


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    DPS3232V DPS3232V 66-pin 128KX32 256KX32 30A014-10 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1 Megabit CMOS SRAM MICROSYSTEMS DPS3232V D E SC R IP T IO N : The DPS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matching thermal coefficients. The LCCs


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    DPS3232V 66-pin 128Kx32 256Kx32, DPS3232V 12SKX8. 64KX16 30A014-10 PDF

    DP645

    Abstract: vlt 2800 AJJ 610 Dense-Pac Microsystems DPS41288-120M DPS41288-70I vlt 2800 application dps41288-150m C18045 E148
    Text: Q Ì %C3 DPS32KX 8 BASED CMOS SRAM FAMILY DESCRIPTION: The DPS32K X 8 fam ily consists of asynchronous Static Random A ccess Memories SRAMs , com plete with memory interface logic and on-board capacitors, available in the organizations and packages described


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    DPS32KX DPS32K DPS45128 DPS45129 DPS4648 DPS4968 DPS41288 DPS96122 DP645 vlt 2800 AJJ 610 Dense-Pac Microsystems DPS41288-120M DPS41288-70I vlt 2800 application dps41288-150m C18045 E148 PDF

    DPS3232V

    Abstract: No abstract text available
    Text: 1 Megabit CM O S SRAM D EN SE-PA C M ÍC R O S Y SÏ \r, MS DPS3232V-35I-TI DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs


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    DPS3232V-35I-TI DPS3232V-35I-TI 66-pin 128KX8, 64KX32 32KX32 A014-1 DPS3232V PDF

    Untitled

    Abstract: No abstract text available
    Text: □PM D P S 3 2 X 16A Dense-Pac Microsystems, Inc. ^ H IG H S PEED 32K X 16 C M O S S R A M P G A M O D U L E PRELIMINARY D ESC R IPT IO N : The DPS32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 SR A M devices in ceramic LCC packages surface mounted on a co-fired ceramic


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    DPS32X16A 40-pin 150ns 100ns 120ns 32KX16 PDF

    S32M8

    Abstract: No abstract text available
    Text: T Dense-Pac Microsystems, Inc. ^ DPS32M8A H IG H SPEED 32K X 8 C M O S SRAM M O N O LIT H IC ADVANCED INFORMATION D ES C R IP T IO N : The D PS32M 8A is a 32K X 8 C M O S Static Random A c c e ss M em ory SRA M . The m em ory utilizes asynchronous circuitry and may be maintained in any


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    DPS32M8A PS32M 30A00M0 S32M8 PDF

    Untitled

    Abstract: No abstract text available
    Text: □PM DPS3232V 32K X 32 CMOS SRAM VERSAPAC MODULE Dense-Pac Microsystems, Inc. ^ DESCRIPTION: The DPS3232V is a 66-pin Pin G rid Array PGA consisting o f fo u r 32K X 8 SRAM devices in ceram ic LCC packages surface m o u n te d on a co-fired c e r a m ic s u b s tra te w ith m a tc h in g th e rm a l


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    DPS3232V DPS3232V 66-pin 128KX32 256KX32 PDF

    Untitled

    Abstract: No abstract text available
    Text: 1 Megabit CMOS SRAM DENSE-PAC DPS3232V-35I-TI MÍCRü S Y ST hMS DESCRIPTION: The DPS3232V-35I-TI is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matchingthermal coefficients. The LCCs


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    DPS3232V-35I-TI DPS3232V-35I-TI 66-pin 128KX8, 30A014-15 PDF

    Untitled

    Abstract: No abstract text available
    Text: 1 Megabit CMOS SRAM PENSE-PAC MICROSYSTEMS DPS3232V D E SC R IP TIO N : The D PS3232V is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 SRAM devices in ceramic L C C packages surface mounted on a co-fired ceramic substratewith matching thermal coefficients. The LCCs


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    DPS3232V 66-pin 128Kx32 256Kx32, 30A014-10 DD0121fl PDF