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    DUAL IN LINE PACKAGE Search Results

    DUAL IN LINE PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    26LS29/BEA Rochester Electronics LLC Rochester Manufactured 26LS29, Line Driver, 16 CDIP Package, SMD spec. Visit Rochester Electronics LLC Buy
    26LS31/BEA Rochester Electronics LLC Rochester Manufactured 26LS31, Line Driver, 16 CDIP Package, SMD spec. Visit Rochester Electronics LLC Buy
    26LS32B/BEA Rochester Electronics LLC Rochester Manufactured 26LS32B, Line Driver, 16 CDIP Package, SMD spec. Visit Rochester Electronics LLC Buy
    26LS33/BEA Rochester Electronics LLC Rochester Manufactured 26LS33, Line Driver, 16 CDIP Package, SMD spec. Visit Rochester Electronics LLC Buy
    26LS32/BEA Rochester Electronics LLC Rochester Manufactured 26LS32, Line Driver, 16 CDIP Package, SMD spec. Visit Rochester Electronics LLC Buy

    DUAL IN LINE PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ceramic package

    Abstract: CERDIP Package J08A J14A J16A J18A J20A J22A J24A J24AQ
    Text: Ceramic Dual-in-Line Package Cerdip 8 Lead Ceramic Dual-in-Line Package NS Package Number J08A 2000 National Semiconductor Corporation MS101109 www.national.com Ceramic Dual-in-Line Package (Cerdip) August 1999 Ceramic Dual-in-Line Package (Cerdip) 14 Lead Ceramic Dual-in-Line Package


    Original     		PDF MS101109 ceramic package CERDIP Package J08A J14A J16A J18A J20A J22A J24A J24AQ

    N22B

    Abstract: mdip N14A N16A N16E N16G N18A N22A N24A NATIONAL SEMICONDUCTOR N16A
    Text: Molded Dual-in-Line Package MDIP 8 Lead (0.300” Wide) Molded Dual-in-Line Package NS Package Number N08E 14 Lead (0.300” Wide) Molded Dual-in-Line Package NS Package Number N14A 2000 National Semiconductor Corporation MS101164 www.national.com Molded Dual-in-Line Package (MDIP)


    Original     		PDF MS101164 N22B mdip N14A N16A N16E N16G N18A N22A N24A NATIONAL SEMICONDUCTOR N16A

    SIP 400B

    Abstract: 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1
    Text: CHAPTER 2 THROUGH HOLE PACKAGES 2.1 LINEUP OF THROUGH HOLE PACKAGES 2.2 LIST OF THROUGH HOLE PACKAGES 1 Plastic DIP (Dual In-line Package) (2) Ceramic DIP (Dual In-line Package) (3) Plastic SIP (Single In-line Package) (4) Plastic V-DIP (Vertical Dual In-line Package)


    Original     		PDF follow100A7-1 X280RF-100A-2 X280RF-100A1-1 X280RF-100A2-1 X280RF-100A3-1 X280RF-100A4 X280RF-100A5 X364RF-100A-1 X179RP-100A X447RP-50A SIP 400B 24-Pin Plastic DIP Shrink Zig-Zag In-line Package 600A CERAMIC PIN GRID ARRAY 120 pins PGA data sheet pin count P20V-254A-2 P64E-70-A-1

    D24K

    Abstract: d28j D14D D24H D08C D16C D18A D20A D20B D24C
    Text: Ceramic Sidebrazed Dual-in-Line Packages SB 8 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D08C 14 Lead Ceramic Sidebrazed Dual-in-Line Package NS Package Number D14D 2000 National Semiconductor Corporation MS101104 www.national.com


    Original     		PDF MS101104 D24K d28j D14D D24H D08C D16C D18A D20A D20B D24C

    CD4093

    Abstract: CD4093 applications cd4093 harris cd4093 Data SCHS115B
    Text: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package


    Original     		PDF SCHS115B CD4093 14-lead 14-lead CD4093 applications cd4093 harris cd4093 Data SCHS115B

    CD4093

    Abstract: CD4093B CD4093 CIRCUITS CD4093 applications cd4093be SCHS115B cd4093 application CD4093 soic
    Text: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package


    Original     		PDF SCHS115B CD4093 14-lead 14-lead CD4093BPW CD4093BM96 CD4093BNSR CD4093BPWR CD4093B CD4093 CIRCUITS CD4093 applications cd4093be SCHS115B cd4093 application CD4093 soic

    cd4093

    Abstract: CD4093B CD4093BE CD4093 CIRCUITS cd4093 Data CD4093 applications CD4093BE harris CD4093 Types cd4093 harris cd4093 application
    Text: Data sheet acquired from Harris Semiconductor SCHS115B – Revised March 2002 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), small-outline 14-lead dual-in-line package


    Original     		PDF SCHS115B CD4093 14-lead 14-lead PCD4093BF3A CD4093BM CD4093BM96 CD4093BNSR CD4093B CD4093BE CD4093 CIRCUITS cd4093 Data CD4093 applications CD4093BE harris CD4093 Types cd4093 harris cd4093 application

    CD4067 DATASHEET

    Abstract: cd4067 CD4097 ALL CD4067
    Text: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic


    Original     		PDF SCHS052A CD4067 CD4097 24-lead 24-lead CD4067 DATASHEET ALL CD4067

    CD4067BE

    Abstract: cd4067 cd4067 harris CD4097be
    Text: Data sheet acquired from Harris Semiconductor SCHS052A – Revised March 2002 The CD4067 and CD4097 are supplied in 24-lead dual-in-line welded-seal ceramic packages D suffix , 24-lead dual-in-line frit-seal ceramic packages (F suffix), 24-lead dual-in-line plastic


    Original     		PDF SCHS052A CD4067 CD4097 24-lead CD4067B, 16-Channel CD4067BNSR CD4067BE cd4067 harris CD4097be

    CD4093 applications

    Abstract: CD4093 cd4093 harris CD4093 Types OF CD4093
    Text: Data sheet acquired from Harris Semiconductor SCHS115A – Revised November 1999 The CD4093 types are supplied in a 14-lead hermetic dual-in-line ceramic package F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line plastic small-outline package (M), and in chip form


    Original     		PDF SCHS115A CD4093 14-lead 14-lead CD4093 applications cd4093 harris CD4093 Types OF CD4093

    CD40106B

    Abstract: No abstract text available
    Text: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96


    Original     		PDF SCHS097B CD40106B 14-lead 14-lead

    cd40106b

    Abstract: CD40106BE CD-40106BE
    Text: Data sheet acquired from Harris Semiconductor SCHS097B – Revised August 2002 The CD40106B types are supplied in 14-lead hermetic dual-in-line ceramic packages F suffix , 14-lead dual-in-line plastic package (E suffix), 14-lead dual-in-line surface-mount plastic packages (M and M96


    Original     		PDF SCHS097B CD40106B 14-lead CD40106BNSR CD40106BPW CD40106BPWR CD40106BE CD-40106BE

    ca0555

    Abstract: CA555
    Text: Nomenclature Guide CA Types CA3260 A T PART NUMBER CAXXXX ELECTRICAL OPTIONS A, B, C, Blank PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Metal-Seal SBDIP E: Dual-In-Line Plastic (PDIP) F: Ceramic Dual-In-Line Frit-Seal (CERDIP) J: Ceramic Leadless Chip Carrier (CLCC)


    Original     		PDF CA3260 CA555 CA0555. 1-888-INTERSIL ca0555

    Untitled

    Abstract: No abstract text available
    Text: Nomenclature Guide AD Types ADC0803LC PART NUMBER Converters AD, ADC 1 WM -T PACKAGE DESIGNATOR D: Ceramic Dual-In-Line Frit-Seal CERDIP or Ceramic Dual-In-Line Metal Seal (SBDIP) H: TO-52 Can N: Dual-In-Line Plastic (PDIP) WM: Small Outline Plastic (SOIC)


    Original     		PDF ADC0803LC 1-888-INTERSIL

    jwd-107-1

    Abstract: JWD-171-21 jwd.171.28 6 pin reed relay 12vdc JWD-107-5 jwd-171-10 JWD-171-27 JWD-171-14 jwd-172-7 JWS-117-18
    Text: Catalog 1308242 Issued 3-03 P&B JWD/JWS series Dual In-Line Package & Single In-Line Package Dry Reed Relays Features • • • • • File E29244 JWD has dual in-line package DIP configuration. (14-pin DIP) JWS has single in-line package (SIP) configuration.


    Original     		PDF E29244 14-pin LR81479 jwd-107-1 JWD-171-21 jwd.171.28 6 pin reed relay 12vdc JWD-107-5 jwd-171-10 JWD-171-27 JWD-171-14 jwd-172-7 JWS-117-18

    JWD-107-1

    Abstract: JWD-107-5 JWD-171-21 JWD-172-4 JWS-117-5 JWD-107-3 JWD-171-10 JWD-171-25 JWD-171-5 JWS-117-18
    Text: Catalog 1308242 Issued 3-03 P&B JWD/JWS series Dual In-Line Package & Single In-Line Package Dry Reed Relays Features • • • • • File E29244 JWD has dual in-line package DIP configuration. (14-pin DIP) JWS has single in-line package (SIP) configuration.


    Original     		PDF E29244 14-pin LR81479 JWD-107-1 JWD-107-5 JWD-171-21 JWD-172-4 JWS-117-5 JWD-107-3 JWD-171-10 JWD-171-25 JWD-171-5 JWS-117-18

    HN58C256 Series

    Abstract: HN58V1001 hm514270a hm62256a HM628512 HN58C1001 Series DP-32 HN27C4096A HN62442 HM658512
    Text: Package Information Contents Dual-in-line-Plastic Applicable Ics CERDIP Applicable Ics Zigzag-in-line Plastic Applicable Ics Flat Package Applicable Ics Chip Carrier Applicable Ics Package Information Dual-in-line Plastic Unit: mm • DP-18C 22.26 22.86 Max


    Original     		PDF DP-18C DP-20N DP-22N 16160A HM5118160A HM51W18160A CP-44 HN27C1024H HN27C4096 HN62444 HN58C256 Series HN58V1001 hm514270a hm62256a HM628512 HN58C1001 Series DP-32 HN27C4096A HN62442 HM658512

    oki cross

    Abstract: CERAMIC LEADLESS CHIP CARRIER CLCC
    Text: Nomenclature Guide 80C, 82CXXX Types M D TEMPERATURE RANGE C: 0°C to +70°C I: -40°C to +85°C M: -55°C to +125°C PACKAGE DESIGNATOR P: Dual-In-Line Plastic PDIP D: Ceramic Dual-In-Line Frit-Seal (CERDIP) or Ceramic Dual-In-Line Metal Seal (SBDIP) G: Ceramic Pin Grid Array (CPGA)


    Original     		PDF 82CXXX 80CXXX: 82CXXX: 80C86 10MHz 12MHz oki cross CERAMIC LEADLESS CHIP CARRIER CLCC

    PHILIPS OQ 0501

    Abstract: philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips
    Text: Philips Semiconductors Package information Package outlines INDEX DESCRIPTION NAME VERSION PAGE DIP dual in-line package plastic dual in-line package; 8 leads (300 mil) plastic dual in-line package; 14 leads (300 mil) SOT97-1 1327 SOT27-1 1328 DIP16 plastic dual in-line package; 16 leads (300 mil); long body


    OCR Scan     		PDF DIP14 DIP16 DIP18 DIP20 DIP24 DIP28 DIP40 LQFP32 PHILIPS OQ 0501 philips OQ 051 oq 0066 oq 0051 PHILIPS 036 M/HD 780 footprint jedec MS-026 TQFP mo-001 packages philips

    sot267

    Abstract: No abstract text available
    Text: Philips Semiconductors Package information Package outlines INDEX VERSION DESCRIPTION NAME PAGE DIP dual in-line package DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 ; SOT97 593 DIP16 plastic dual in-line package; 16 leads (300 mil); long body


    OCR Scan     		PDF DIP16 DIP20 DIP24 DIP28 DIP40 OT97-1 OT38-1 OT146-1 OT101-1; OT101B sot267

    ECL2530

    Abstract: ECL2500 ECL2531 EJB 10
    Text: TYPES ECL2530, ECL2531 DUAL LINE RECEIVER AND DUAL LINE DRIVER ECL INTEGRATED CIRCUITS tD -4 c < r - -a n in m w ECL2500 SERIES EMITTER-COUPLED-LOGIC ECL DUAL LINE RECEIVER AND DUAL LINE DRIVER FOR APPLICATION IN ULTRA-HIGH-SPEED D IG ITAL SYSTEMS -I m i p


    OCR Scan     		PDF ECL2530, ECL2531 ECL2500 16-PIN ECL2530 EJB 10

    DS87 amplifier

    Abstract: opamps
    Text: AT&T DATA SHEET LB1029BB/BC DUAL GENERAL-PURPOSE WIDEBAND OP-AMPS DESCRIPTION The LB1029BB and LB1029BC are dual general-purpose wideband op-amps. The LB1029BB is encapsulated in an 8-lead dual­ in-line plastic package and the LB1029BC is encapsulated in a 16-lead dual-in-line plastic package. These devices function as dual


    OCR Scan     		PDF LB1029BB/BC LB1029BB LB1029BC 16-lead 20-dB LB1029BB/BC-- DS87 amplifier opamps

    Untitled

    Abstract: No abstract text available
    Text: February 1993 Semiconductor DM54155/DM74155 Dual 2-Line to 4-Line Decoders/Demultiplexers General Description These TTL. circuits feature dual 1-line-to-4-line demultiplex­ ers with Individual strobes and common binary-address in­ puts in a single 16-pin package. When both sections are


    OCR Scan     		PDF DM54155/DM741 DM54155/DM74155 16-pin

    54LS155DMQB

    Abstract: 54LS155FMQB 54LS155LMQB DM54LS155J DM54LS155W DM74LS155M LS155 LS156
    Text: 54LS155/DM54LS155/DM74LS155, 54LS156/DM54LS156/DM74LS156 Dual 2-Line to 4-Line Decoders/Demultiplexers General Description Features These TTL circuits feature dual 1-line-to-4-line demultiplex­ ers with individual strobes and common binary-address in­ puts in a single 16-pin package. When both sections are


    OCR Scan     		PDF 54LS155/DM54LS155/DM74LS155, 54LS156/DM54LS156/DM74LS156 16-pin 54LS155DMQB 54LS155FMQB 54LS155LMQB DM54LS155J DM54LS155W DM74LS155M LS155 LS156