Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DYNEX POWER Search Results

    DYNEX POWER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4164K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4207F Toshiba Electronic Devices & Storage Corporation Intelligent power device 600V (High voltage PWM DC brushless motor driver) Visit Toshiba Electronic Devices & Storage Corporation

    DYNEX POWER Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Silicon Power Cube

    Abstract: water cooled thyristor assembly firing circuit for thyristor based three phase thyristor testing Bipolar Static Induction Transistor crowbar electrical engineering projects Ignitron thyristor inverter designing firing circuit Dynex Semiconductor
    Text: Power Assembly Complete Solutions www.dynexsemi.com  Power Assembly Complete Solutions Dynex Semiconductor in Lincoln has 40 years experience in power electronics Dynex Semiconductor Dynex is one of the foremost suppliers of power semiconductor components and subsystems. Our products


    Original     		PDF LF5556-2. LF5377-1. Silicon Power Cube water cooled thyristor assembly firing circuit for thyristor based three phase thyristor testing Bipolar Static Induction Transistor crowbar electrical engineering projects Ignitron thyristor inverter designing firing circuit Dynex Semiconductor

    water cooled thyristor assembly

    Abstract: Silicon Power Cube igbt firing circuit for single phase induction motor IGBT heatsink cleaning dynex DYNEX Thyristor static induction Thyristor Ignitron inverter, water cooling system DYNEX PULSED THYRISTOR
    Text: Power Assembly Complete Solutions www.dynexsemi.com  Power Assembly Complete Solutions Dynex Semiconductor in Lincoln has 40 years experience in power electronics Dynex Semiconductor Dynex is one of the foremost suppliers of power semiconductor components and subsystems. Our products


    Original     		PDF LF5556-2. LF5377-1. water cooled thyristor assembly Silicon Power Cube igbt firing circuit for single phase induction motor IGBT heatsink cleaning dynex DYNEX Thyristor static induction Thyristor Ignitron inverter, water cooling system DYNEX PULSED THYRISTOR

    DYNEX

    Abstract: Dynex Semiconductor IGBT heatsink cleaning igbt firing circuit for single phase induction motor 3phase thyristor firing circuit water cooled thyristor assembly DYNEX POWER lf537
    Text: Power Assembly Complete Solutions www.dynexsemi.com 1 Power Assembly Complete Solutions Dynex Semiconductor in Lincoln has 40 years experience in power electronics Dynex Semiconductor Dynex is one of the foremost suppliers of power semiconductor components and subsystems. Our products are


    Original     		PDF LF5556-2. LF5377-1. DYNEX Dynex Semiconductor IGBT heatsink cleaning igbt firing circuit for single phase induction motor 3phase thyristor firing circuit water cooled thyristor assembly DYNEX POWER lf537

    2sd315ai

    Abstract: 2sc0108t bi-directional switch IGBT driver 2SC0435T 2SD106AI 2SD106Ai-17 2sc0108 2sc0435 CT-Concept igbt trafo drivers
    Text: AN 5946 Driving Dynex High Power IGBT modules with Concept Gate Drives Application Note AN5946-2.0 September 2009 LN26854 Author: Dinesh Chamund Introduction Dynex Semiconductor manufactures a variety of IGBT modules ranging from 1200V to 6500V and 100A to 2400A.


    Original     		PDF AN5946-2 LN26854 2sd315ai 2sc0108t bi-directional switch IGBT driver 2SC0435T 2SD106AI 2SD106Ai-17 2sc0108 2sc0435 CT-Concept igbt trafo drivers

    plc based automatic car parking system

    Abstract: denso map sensor Denso radar common rail denso 1 928 403 095 bosch denso ford visteon Bosch radar BOSCH 1 928 403 192 ic mitsubishi 4271 denso mass air flow
    Text: 2000 Annual Report 1 Business Overview Dynex is a research based technology company focused on the supply of products and services in the field of power semiconductors and microwave sensors. Dynex continues to do business in other areas related to the semiconductor and integrated circuit markets.


    Original     		PDF LF5442-1 plc based automatic car parking system denso map sensor Denso radar common rail denso 1 928 403 095 bosch denso ford visteon Bosch radar BOSCH 1 928 403 192 ic mitsubishi 4271 denso mass air flow

    Gate Turn-off Thyristor

    Abstract: SG1000R23 westcode cross reference SG1000EX23 SG600EX21 SG700ex22 SG800EX21 equivalent FG2000DV90 fg2000dv-90da DG406BP18
    Text: Gate Turn-off Thyristor Cross Reference Gate Turn-off Thyristor Cross Reference DS5549-2.0 September 2003 ABB - DYNEX ITQRM µF Cs µ ABB Part Number Voltage Maximum CSG 1501-25A01 2500 1500 3 Dynex Nearest Equivalent Part Number DG406BP25 CSG 2001-25A01


    Original     		PDF DS5549-2 1501-25A01 DG406BP25 2001-25A01 DG646BH25 2003-45A01 DG648BH45 2501-25A01 3001-25A01 Gate Turn-off Thyristor SG1000R23 westcode cross reference SG1000EX23 SG600EX21 SG700ex22 SG800EX21 equivalent FG2000DV90 fg2000dv-90da DG406BP18

    GEC 44 3A

    Abstract: l 0315 MA7001 MAX7001
    Text: MA7001 MA7001 Radiation Hard 512x9 Bit FIFO Replaces January 2000 version, DS3519-5.0 The MA7001 512 x 9 FIFO is manufactured using Dynex Semiconductor's CMOS-SOS high performance, radiation hard, 3µm technology. The Dynex Semiconductor Silicon-on-Sapphire process


    Original     		PDF MA7001 512x9 DS3519-5 MA7001 1015n/cm2, GEC 44 3A l 0315 MAX7001

    MA7001

    Abstract: MAX7001 GEC 44 3A
    Text: MA7001 MA7001 Radiation Hard 512x9 Bit FIFO Replaces June 1999 version, DS3519-4.0 The MA7001 512 x 9 FIFO is manufactured using Dynex Semiconductor's CMOS-SOS high performance, radiation hard, 3µm technology. The Dynex Semiconductor Silicon-on-Sapphire process


    Original     		PDF MA7001 512x9 DS3519-4 MA7001 1015n/cm2, MAX7001 GEC 44 3A

    MA7001

    Abstract: l 0315
    Text: MA7001 MA7001 Radiation Hard 512x9 Bit FIFO Replaces January 2000 version, DS3519-5.0 The MA7001 512 x 9 FIFO is manufactured using Dynex Semiconductor's CMOS-SOS high performance, radiation hard, 3µm technology. The Dynex Semiconductor Silicon-on-Sapphire process


    Original     		PDF MA7001 512x9 DS3519-5 MA7001 1015n/cm2, l 0315

    SG600EX21

    Abstract: SG600R21 FG2000DV-90 FG2000DV90 westcode cross reference SG1000R23 SG1000EX23 FG1000AH SG700EX22 DG406BP18
    Text: Gate Turn-off Thyristor Cross Reference DS5549 Gate Turn-off Thyristor Cross Reference DS5549-1.1 May 2002 ABB - DYNEX ITQRM µF Cs µ ABB Part Number Voltage Maximum CSG 1501-25A01 2500 1500 3 Dynex Nearest Equivalent Part Number DG406BP25 CSG 2001-25A01


    Original     		PDF DS5549 DS5549-1 1501-25A01 DG406BP25 2001-25A01 DG646BH25 2003-45A01 DG648BH45 2501-25A01 SG600EX21 SG600R21 FG2000DV-90 FG2000DV90 westcode cross reference SG1000R23 SG1000EX23 FG1000AH SG700EX22 DG406BP18

    MTBF IGBT module

    Abstract: MTBF IGBT fit IEC60749 igbt failure AN5945-3 igbt qualification circuit igbt testing procedure ge traction motor igbt module testing IEC60068-2-14 vibration
    Text: AN 5945 IGBT Module Reliability Application Note AN5945-3 October 2009 LN26894 Authors: Dinesh Chamund, David Newcombe INTRODUCTION: Dynex Semiconductor products are used in a variety of power electronics systems such as power generation and distribution systems,


    Original     		PDF AN5945-3 LN26894 MTBF IGBT module MTBF IGBT fit IEC60749 igbt failure igbt qualification circuit igbt testing procedure ge traction motor igbt module testing IEC60068-2-14 vibration

    DS4385-4

    Abstract: air cooled heatsink
    Text: Type F - Water Cooled Heatsink Type F Water Cooled Heatsink Replaces January 2000 version, DS4385-3.0 DS4385-4.0 November 2002 FEATURES These heatsinks are designed for use in Dynex Semiconductor high current, high power assemblies such as single, three or six


    Original     		PDF DS4385-3 DS4385-4 air cooled heatsink

    air cooled heatsink

    Abstract: No abstract text available
    Text: Type P - Water Cooled Heatsink Type P Water Cooled Heatsink Replaces January 2000 version, DS4389-3.0 DS4389-4.0 November 2002 FEATURES These heatsinks are designed for use in Dynex Semiconductor high current, high power assemblies such as single, three or six


    Original     		PDF DS4389-3 DS4389-4 air cooled heatsink

    advantage and disadvantage of igbt

    Abstract: failure analysis IGBT Calculation of major IGBT operating parameters IEC60749-5 igbt failure fit IEC60749 MTBF IGBT fit IEC60068-2-14 IEC60068-2-27 IEC60068-2-6
    Text: AN 5945 IGBT Module Reliability Application Note AN5945-5 October 2010 LN27638 Authors: Dinesh Chamund, David Newcombe INTRODUCTION: Dynex Semiconductor products are used in a variety of power electronics systems such as power generation and distribution systems,


    Original     		PDF AN5945-5 LN27638 advantage and disadvantage of igbt failure analysis IGBT Calculation of major IGBT operating parameters IEC60749-5 igbt failure fit IEC60749 MTBF IGBT fit IEC60068-2-14 IEC60068-2-27 IEC60068-2-6

    air cooled heatsink

    Abstract: No abstract text available
    Text: Type M - Water Cooled Heatsink Type M Water Cooled Heatsink Replaces January 2000 version, DS4388-3.0 DS4388-4.0 November 2002 FEATURES These heatsinks are designed for use in Dynex Semiconductor high current, high power assemblies such as single, three or six


    Original     		PDF DS4388-3 DS4388-4 air cooled heatsink

    DS4386-3

    Abstract: air cooled heatsink DS4386-4 Dynex Semiconductor
    Text: Type K - Water Cooled Heatsink Type K Water Cooled Heatsink Replaces January 2000 version, DS4386-3.0 DS4386-4.0 November 2002 FEATURES These heatsinks are designed for use in Dynex Semiconductor high current, high power assemblies such as single, three or six


    Original     		PDF DS4386-3 DS4386-4 air cooled heatsink Dynex Semiconductor

    air cooled heatsink

    Abstract: No abstract text available
    Text: Type E - Water Cooled Heatsink Type E Water Cooled Heatsink Replaces January 2000 version, DS4510-2.0 DS4510-3.0 November 2002 FEATURES These heatsinks are designed for use in Dynex Semiconductor high current, high power assemblies such as single, three or six


    Original     		PDF DS4510-2 DS4510-3 air cooled heatsink

    IGBT cross reference semikron eupec

    Abstract: IGBT cross reference semikron 2MBI 200NB-120 IGBT Eupec 150Ne120 MG200J2YS50 mitsubishi MG100Q2YS51 MG400Q1US41 igbt mitsubishi FZ800R16KF4 MG200Q2YS40
    Text: IGBT Module Cross Reference DS5468 IGBT Module Cross Reference DS5468-2.0 October 2002 Manufacturer Dimensions Configuration Vces V Ic dc (A) Dynex Part No. FZ1200R33KF2 Module Part No. EUPEC 140x190 SINGLE 3300 1200 DIM1200ESM33 FZ1600R12KF4 EUPEC 140x130


    Original     		PDF DS5468 DS5468-2 FZ1200R33KF2 140x190 DIM1200ESM33 FZ1600R12KF4 140x130 DIM1600FSM12 FF400R12KF4 IGBT cross reference semikron eupec IGBT cross reference semikron 2MBI 200NB-120 IGBT Eupec 150Ne120 MG200J2YS50 mitsubishi MG100Q2YS51 MG400Q1US41 igbt mitsubishi FZ800R16KF4 MG200Q2YS40

    air cooled heatsink

    Abstract: Dynex
    Text: Type D - Water Cooled Heatsink Type D Water Cooled Heatsink Replaces January 2000 version, DS4384-3.0 DS4384-4.0 November 2002 FEATURES These heatsinks are designed for use in Dynex Semiconductor high current, high power assemblies such as single, three or six


    Original     		PDF DS4384-3 DS4384-4 air cooled heatsink Dynex

    air cooled heatsink

    Abstract: Heatsinks Dynex Semiconductor
    Text: Type L - Water Cooled Heatsink Type L Water Cooled Heatsink Replaces January 2000 version, DS4387-4.0 DS4387-5.0 November 2002 FEATURES These heatsinks are designed for use in Dynex Semiconductor high current, high power assemblies such as single, three or six


    Original     		PDF DS4387-4 DS4387-5 air cooled heatsink Heatsinks Dynex Semiconductor

    deionised water

    Abstract: DYNEX SEMICONDUCTOR
    Text: Type Y - Water Cooled Heatsink Type Y Water Cooled Heatsink Advance Information Replaces January 2000 version, DS4390-3.0 DS4390-4.0 November 2002 FEATURES These heatsinks are designed for use in Dynex Semiconductor high current, high power assemblies such as single, three or six


    Original     		PDF DS4390-3 DS4390-4 deionised water DYNEX SEMICONDUCTOR

    IGBT cross reference semikron eupec

    Abstract: 150Ne120 FZ800R16KF4 MG200J2YS50 mitsubishi IGBT cross reference semikron Eupec Power Semiconductors IGBT mitsubishi mg300j2ys50 MBM200GS12 FZ1600R12KF4 MG200Q2YS40
    Text: IGBT Module Cross Reference DS5468 IGBT Module Cross Reference DS5468-2.0 October 2002 Manufacturer Dimensions Configuration Vces V Ic dc (A) Dynex Part No. FZ1200R33KF2 Module Part No. EUPEC 140x190 SINGLE 3300 1200 DIM1200ESM33 FZ1600R12KF4 EUPEC 140x130


    Original     		PDF DS5468 DS5468-2 FZ1200R33KF2 140x190 DIM1200ESM33 FZ1600R12KF4 140x130 DIM1600FSM12 FF400R12KF4 IGBT cross reference semikron eupec 150Ne120 FZ800R16KF4 MG200J2YS50 mitsubishi IGBT cross reference semikron Eupec Power Semiconductors IGBT mitsubishi mg300j2ys50 MBM200GS12 FZ1600R12KF4 MG200Q2YS40

    Igbt wafer

    Abstract: dynex 600V 100A THYRISTORS IGBT 6500v
    Text: introduction Dynex Semiconductor in Lincoln has 40 years experience in power electronics rectifier diodes, fast turn-off thyristors, GTO thyristors and custom heatsink power assemblies. Dynex Semiconductor is one of the foremost suppliers of pow er se m ic o n d u c to r


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: power assemblies Power Assem bly Complete Solutions PACS Power Assembly Complete Solutions (PACS) is a design and build service which Dynex Semiconductor offers to customers who do not want to be involved in the thermal and mechanical design aspects of the power


    OCR Scan     		PDF MP02-W12 MP03-W3A MP04-W3A MP04-W3A MP02TT800-* MP03TT1250-* MP04TT1400-* MP04TT1550-*