EIA AND EIAJ TRAY STANDARDS Search Results

EIA AND EIAJ TRAY STANDARDS Result Highlights (5)

Part	Manufacturer	Description
TB67H481FTG	Toshiba Electronic Devices & Storage Corporation	Stepping and Brushed Motor Driver /Bipolar Type / Vout(V)=50 / Iout(A)=3.0 / IN input type / VQFN32
TLP3406SRH4	Toshiba Electronic Devices & Storage Corporation	Photorelay (MOSFET output, 1-form-a), 30 V/0.9 A, 300 Vrms, S-VSON16T
TLP5702H	Toshiba Electronic Devices & Storage Corporation	Photocoupler (Gate Driver Coupler), High-Topr / IGBT driver, 5000 Vrms, SO6L
TLP3407SRA	Toshiba Electronic Devices & Storage Corporation	Photorelay (MOSFET output, 1-form-a), 60 V/1 A, 500 Vrms, S-VSON4T
TLP3407SRH	Toshiba Electronic Devices & Storage Corporation	Photorelay (MOSFET output, 1-form-a), 60 V/1 A, 500 Vrms, S-VSON4T

EIA AND EIAJ TRAY STANDARDS Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
smd transistor M7A Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747 Text: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages	Original	PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747	PDF
EIA and EIAJ tape standards Abstract: TR3000MT TR-3000MT EIA and EIAJ standards Text: TAPE AND REEL EQUIPMENT REEL-TECH TR-3000MT • ■ ■ ■ ■ ■ ■ ■ Dual pick-and-place probes 3400 UPH tray-to-tape Continuous operation 8-inch high stack of JEDEC trays Easy PC control Quick, accurate changeovers Mark, implied lead and pin #1 Vision	Original	TR-3000MT TR-3000MT EIA and EIAJ tape standards TR3000MT EIA and EIAJ standards	PDF
NEC A39A Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B Text: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES	Original	C10943XJ6V0IF00 IEI-635, IEI-1213) ED-7411 NEC A39A NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B	PDF
sop package tray Abstract: 29754* intel weight of SOP package SOP JEDEC tray Text: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.	Original		PDF
EIA and EIAJ standards 783 Abstract: EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label Text: Application Report SZZA021B – September 2001 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare	Original	SZZA021B EIA and EIAJ standards 783 EIA standards 783 EIA 783 eia783 EIA-783 ic shipping tray tsop Shipping Trays SZZA021B tray matrix bga ti packing label	PDF
EIA and EIAJ standards 783 Abstract: JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP Text: Application Report SZZA021A – January 2000 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear and Logic ABSTRACT The Texas Instruments TI Semiconductor Group uses three packing methodologies to	Original	SZZA021A EIA and EIAJ standards 783 JEDEC tray standard dimension abstract for water level indicator EIA-481-x EIA standards 783 EIA 783 JEDEC Matrix Tray outlines QFP Shipping Trays EIA-783 EIA 481 TSSOP	PDF
26c32at Abstract: 26c32a 26C32AM 26c32 Text: DS26C32AT/DS26C32AM Quad Differential Line Receiver General Description Features The DS26C32A is a quad differential line receiver designed to meet the RS-422, RS-423, and Federal Standards 1020 and 1030 for balanced and unbalanced digital data transmission, while retaining the low power characteristics of CMOS.	Original	DS26C32AT/DS26C32AM DS26C32A RS-422, RS-423, pr32ATM DS26C32ATN 26c32at 26c32a 26C32AM 26c32	PDF
IC Package Names and Code Designations Abstract: data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408 Text: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages	Original	10-001A IC Package Names and Code Designations data sheet IC 7408 7404 not gate ic MSP 044 THERMISTOR enplas otq-100-0.5 IC 7404 7406 IC51-1004-809 ic 7404 datasheet HLP40R ic 7408	PDF
IC51-128 Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005 Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials	Original		PDF
HT 1200-4 Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher	Original	March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing	PDF
HT 1200-4 Abstract: YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341 Text: Hitachi Semiconductor Package Data Book ADE–410–001B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional	Original	March/97 HT 1200-4 YAMAICHI ic234 PT740 AB TSSOP YAMAICHI SOCKET FP-20-0.65-01 IC51-1444-1354-7 PT817 Enplas drawings IC51-2084-1052-11 IC 7418 IC51-0242-1341	PDF
PT740 AB Abstract: diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48 Text: Hitachi Semiconductor Package Data Book ADE–410–001G 8th Edition September/2000 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher	Original	September/2000 PT740 AB diode AE 84A KS74 FP64E hitachi FET EDR-7316 Hitachi DSAUTAZ006 IC51-2084-1052 OTS-48	PDF
Untitled Abstract: No abstract text available Text: DS26C32AT/DS26C32AM Quad Differential Line Receiver General Description Features The DS26C32A is a quad differential line receiver designed to meet the RS-422, RS-423, and Federal Standards 1020 and 1030 for balanced and unbalanced digital data transmission, while retaining the low power characteristics of CMOS.	Original	DS26C32AT/DS26C32AM DS26C32A RS-422, RS-423, 23-Mar-2009] ISO/TS16949	PDF
JEDEC Matrix Tray outlines Abstract: ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783 Text: Application Report SZZA021C − September 2005 Semiconductor Packing Methodology Cles Troxtell, Bobby O’Donley, Ray Purdom, and Edgar Zuniga Standard Linear & Logic ABSTRACT The Texas Instruments Semiconductor Group uses three packing methodologies to prepare	Original	SZZA021C JEDEC Matrix Tray outlines ti packing label dck3 QFP Shipping Trays tray bga 64 EIA-468 label location EIA standards 783 EIA-481-x dbv4 EIA-783	PDF

26c32a Abstract: DS26C32 Text: DS26C32AT/DS26C32AM Quad Differential Line Receiver General Description Features The DS26C32A is a quad differential line receiver designed to meet the RS-422, RS-423, and Federal Standards 1020 and 1030 for balanced and unbalanced digital data transmission, while retaining the low power characteristics of CMOS.	Original	DS26C32AT/DS26C32AM DS26C32A RS-422, RS-423, prMWG/883 DS26C32AM 26c32a DS26C32	PDF
DS34C86 Abstract: DS34C86TN Text: DS34C86T Quad CMOS Differential Line Receiver General Description Features The DS34C86T is a quad differential line receiver designed to meet the RS-422, RS-423, and Federal Standards 1020 and 1030 for balanced and unbalanced digital data transmission, while retaining the low power characteristics of CMOS.	Original	DS34C86T RS-422, RS-423, receivDS3486. RS-422 5-Aug-2002] DS34C86 DS34C86TN	PDF
JEDEC Jc-11 free Abstract: Pub-95 TRANSISTOR Outlines JC11 JEP95 JEDEC diode Outlines IEC47D BGA OUTLINE DRAWING JEDEC bga case outline diode outlines Text: JEDEC Publication 95 Microelectronic Package Standard Application Report 1999 Printed in U.S.A. 0199 SZZA006 JEDEC Publication 95 Microelectronic Package Standard SZZA006 January 1999 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products	Original	SZZA006 5M-1994, JEDEC Jc-11 free Pub-95 TRANSISTOR Outlines JC11 JEP95 JEDEC diode Outlines IEC47D BGA OUTLINE DRAWING JEDEC bga case outline diode outlines	PDF
LGA 1156 PIN OUT diagram Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)	Original	DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram	PDF
109-5310 Abstract: 109-5103 Text: Product Specification 製品規格 108-5725 05APR06 Rev. C SOP ソケット（SOP SOCKET） 1. 適用範囲 1. 1.1 内容 1.1 Contents Scope : 本規格は SOP ソケットの製品性能試験方法、品質保 This specification covers the requirements for product	Original	05APR06 109-5310 109-5103	PDF
PT740 AB Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher	Original	ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A	PDF
land pattern for TSOP 2-44 Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions	Original		PDF
TSOP-48 pcb LAYOUT Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010 Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions	Original		PDF
PAL 007 pioneer Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56 Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions	Original		PDF
footprint jedec MS-026 TQFP Abstract: PL84 tube AS 108-120 x-ray tube datasheet 144 QFP body size drawing of a geometrical isometric sheet superior Natural gas engines x-ray tube datasheet 026 SMT, FPGA FINE PITCH BGA 456 BALL mo-047 texas Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.	Original	G46-88 footprint jedec MS-026 TQFP PL84 tube AS 108-120 x-ray tube datasheet 144 QFP body size drawing of a geometrical isometric sheet superior Natural gas engines x-ray tube datasheet 026 SMT, FPGA FINE PITCH BGA 456 BALL mo-047 texas	PDF

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EIA AND EIAJ TRAY STANDARDS Search Results

EIA AND EIAJ TRAY STANDARDS Result Highlights (5)

EIA AND EIAJ TRAY STANDARDS Datasheets Context Search

smd transistor M7A

EIA and EIAJ tape standards

NEC A39A

sop package tray

EIA and EIAJ standards 783

EIA and EIAJ standards 783

26c32at

IC Package Names and Code Designations

IC51-128

HT 1200-4

HT 1200-4

PT740 AB

Untitled

JEDEC Matrix Tray outlines

26c32a

DS34C86

JEDEC Jc-11 free

LGA 1156 PIN OUT diagram

109-5310

PT740 AB

land pattern for TSOP 2-44

TSOP-48 pcb LAYOUT

PAL 007 pioneer

footprint jedec MS-026 TQFP