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    sumitomo epoxy

    Abstract: sumitomo EME-7351LS EME7351LS EME7351UT Compound EME-7351
    Text: TO: ALL PERICOM CUSTOMERS SUBJECT: Sumitomo Epoxy Mold Compound Issue – EME7351UT Pericom’s current plastic encapsulated, Surface Mount Technology SMT packaged peripheral leaded products do not utilize Sumitomo’s EME7351UT mold compound. This epoxy uses a Particled Phosphorus Flame Retardant Agent, which was found by some


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    EME7351UT EME7351UT EME7351US. EME7351LS sumitomo epoxy sumitomo EME-7351LS Compound EME-7351 PDF

    EME-7351

    Abstract: 140C 8361H JESD22 sumitomo silver epoxy
    Text: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4


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    EME-7351 EME-7351 8361H JESD22-A112 CY7C199-ZC 140C 8361H JESD22 sumitomo silver epoxy PDF

    8361H

    Abstract: EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344
    Text: Cypress Semiconductor Reflow Qualification Report QTP# 99344 VERSION 2.0 November, 2000 235°°C Solder Reflow Profile TSOP Package Family All assembly sites for these packages CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


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    ZS444N 44-lead 619919886Q CY7C199-ZC 30C/60 CY7C1021-ZSC CY62128-ZC 8361H EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344 PDF

    a13 sot23-5

    Abstract: sine wave generator using LM358 EME-7351 A14* marking sot23-5 SOT23 M7 simple LM324 COMPARATOR CIRCUIT a13 marking sot23 Analog devices marking Information PACKAGE SOIC eme marking sot23 LMV321M5
    Text: t s e all r o t a r a p m o C & SPRING p m Sm SI SC7 NGLE 0-5/ SOT +IN 1 23-5 Op A in D l r o W e h t s ’ e s On thi for V- 2 LMV821 LMV358 LMV393 LMV822 LMV324 LMV339 LMV824 A UT O • Rail-to-Rail Output 50% Smaller than SOT-23 Supply Operation build an we


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    LMV821 LMV358 LMV393 LMV822 LMV324 LMV339 OT-23 a13 sot23-5 sine wave generator using LM358 EME-7351 A14* marking sot23-5 SOT23 M7 simple LM324 COMPARATOR CIRCUIT a13 marking sot23 Analog devices marking Information PACKAGE SOIC eme marking sot23 LMV321M5 PDF

    Ablebond 84-1*SR4

    Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
    Text: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:


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    PI6CV857A Ablebond 84-1*SR4 z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4 PDF

    EME-7351

    Abstract: Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
    Text: Cypress Semiconductor Qualification Report QTP# 97351 VERSION 1.0 January, 1998 32 Ld TSOP Package - Sumitomo EME 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME-7351/S351 Mold Compound QTP# 97351, V. 1.0


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    EME-7351/S351 EME-7351 30C/60 CY7C109-ZC Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C PDF

    EME-7351

    Abstract: JESD22 140C EME-7351LS
    Text: Cypress Semiconductor Qualification Report QTP# 98191/92VERSION 1.0 August, 1998 32 Ld TSOP Type I Package Gateway Electronics, Philippines Cypress Semiconductor Assembly: Gateway Electronic, Philippines Package: TSOP, Type I QTP# 98191/92, V. 1.0 Page 2 of 4


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    98191/92VERSION EME-7351LS JESD22-A112 30C/60 7C109GC-GWZC 619804698L 619804698L1 EME-7351 JESD22 140C EME-7351LS PDF

    EME-7351

    Abstract: Compound sumitomo epoxy
    Text: Cypress Semiconductor Package Qualification Report QTP# 99112 VERSION 1.0 April, 2000 32 Lead 400mil SOJ Package Level 2 Omedata CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Cypress Semiconductor Package: 32 Lead (400mil) SOJ


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    400mil) 32Lead EME7351 CY7C109-VC CY7C109-VIB 85C/60 EME-7351 Compound sumitomo epoxy PDF

    JEDEC JESD22-B116

    Abstract: SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184
    Text: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: G-0110-06 Product Affected: Date Effective: DATE: 12/14/2001 Package Family TSSOP, TQFP, TSOP March 15, 2002 Contact: Geoffrey Cortes Manager, Corporate Quality & Reliability


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    G-0110-06 EME-7351LP EME-S351LP 4-10h JEDEC JESD22-B116 SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184 PDF

    EME-6300

    Abstract: eme6600cs EME6600 EME6300 G700 eme-6600cs JESD22-A113 mp8000 EME-7351 MP-8000
    Text: MOISTURE SENSITIVITY CLASSIFICATION OF MICREL SURFACE MOUNT PACKAGES HOW TO USE THIS TABLE: PRODUCT AND PACKAGES CLASSIFIED LEVEL 3 REQUIRE BAKE AND DRY PACK WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 2 REQUIRE DRY PACK ONLY WITH APPROPRIATE WARNING LABEL


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    O-263 SC-70 MIC2529 MIC2527 SY69952 MIC5400 EME6300 150X150 EME-6300 eme6600cs EME6600 EME6300 G700 eme-6600cs JESD22-A113 mp8000 EME-7351 MP-8000 PDF

    MP 130B

    Abstract: sumitomo epoxy LPV324M MP 130B 02 cf 5097 nitto UV tape A193K NSC marking code PB eme-7351ls eme marking sot23
    Text: LPV321/358/324 Qualification Package 9µA Op Amp Family With 150kHz GBW NEW LPV FAMILY Part # Function Package LPV321 LPV358 LPV324 Single Dual Quad SC70-5, SOT23-5 SOIC, MSOP SOIC, TSSOP LPV Series LMV Series National’s Low-Power LPV300 Familiy IN SC70 Packaging


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    LPV321/358/324 150kHz LPV321 LPV358 LPV324 SC70-5, OT23-5 LPV300 150kHz LPV321/LPV358/LPV324 MP 130B sumitomo epoxy LPV324M MP 130B 02 cf 5097 nitto UV tape A193K NSC marking code PB eme-7351ls eme marking sot23 PDF

    TTL 7400 national semiconductor

    Abstract: sine wave generator using LM358 a13 marking sot23 eme marking sot23 lm358 sum LMV321 LMV321M5 LMV324 MAL LM393 LMV339
    Text: t s e l mal r o t a r a p m o C & SPRING p m S SI SC7 NGLE 0-5/ SOT +IN 1 23-5 Op A in D l r o the W s ’ e n s O thi for V- 2 Click Here For Web Info LMV321 LMV331 LMV821 LMV358 LMV393 LMV822 LMV324 LMV339 LMV824 1 SOT-23 + 8 V TB 6 IN B 7 OU A – + A - 2


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    LMV321 LMV331 LMV821 LMV358 LMV393 LMV822 LMV324 LMV339 OT-23 TTL 7400 national semiconductor sine wave generator using LM358 a13 marking sot23 eme marking sot23 lm358 sum LMV321M5 MAL LM393 LMV339 PDF

    QMI519

    Abstract: KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel
    Text: Date Created: 1/28/2004 Date Issued: 3/2/2004 PCN # 20040411 DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.


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    epax02 Ext686 MM74HCT00MTCX MM74HCT05MTC MM74HCT08MTCX MM74HCT14MTC MM74HCT240MTCX QMI519 KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel PDF

    leadframe C7025

    Abstract: Ablestik 84-1 EME7351T Ablestik 84-1 lmis-r4 74LCXR162245MTX Ablestik LMISR4 FSTUD16211MTDX Sumitomo 7351T Ablestik leadframe Cu C7025
    Text: Date Created: 4/21/2004 Date Issued: 5/3/2004 PCN # 20033907-B DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.


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    20033907-B epax02 6437211EXT 74VCXH16374MTDX 74VHC161284MTD FIN1108MTDX FIN1216MTD FIN1217MTDX FIN3383MTD FIN3385MTDX leadframe C7025 Ablestik 84-1 EME7351T Ablestik 84-1 lmis-r4 74LCXR162245MTX Ablestik LMISR4 FSTUD16211MTDX Sumitomo 7351T Ablestik leadframe Cu C7025 PDF