CLKIN32
Abstract: No abstract text available
Text: CYUSB302x SD3 USB and Mass Storage Peripheral Controller Features • ■ ■ ■ ■ Latest-generation storage support ❐ SD3.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master ■ Independent power domains for core and I/O ■
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CYUSB302x
SDR50
DDR50
CLKIN32
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CYUSB202X
Abstract: No abstract text available
Text: CYUSB202X SD2 USB and Mass Storage Peripheral Controller Features • ■ ■ ❐ ❐ Latest-generation storage support ❐ SD2.0/SDXC – UHS1 SDR50 / DDR50 Master ❐ eMMC 4.4 Master ❐ SDIO 3.0 Master Ultra low-power in core power-down mode ❐ Less than 60 µA with VBATT on and 20 µA with VBATT off
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CYUSB202X
SDR50
DDR50
CYUSB202X
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emmc controller
Abstract: Sandisk iNAND micron emmc eMMC Sandisk eMMC Sandisk iNAND eMMC 8GB eMMC SLC emmc code emmc sector size Sandisk NAND Flash memory controller ecc
Text: Micron e-MMC Embedded Memory Simplifies High-Capacity Storage for Mobile and Embedded Systems Summary This white paper addresses the various functions NAND designers face today. It also discusses the ways that e-MMC embedded memory can provide the necessary NAND Flash functions in an easy-to-use BGA
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XAM3359AZCZ100
Abstract: No abstract text available
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual
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d2516ec
Abstract: KE4CN2H5A kingston memory schematic
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision C.1 May 22, 2014 Author: Gerald Coley [email protected] Contributing Editor: Robert P J Day Page 1 of 126 Rev C.1 REF: BBONEBLK_SRM BeagleBone Black System
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lpddr4
Abstract: emmc pcb layout
Text: REF: BBONEBLK_SRM BeagleBone Black System Reference Manual BeagleBone Black System Reference Manual Revision A5.2 April 11, 2013 Author: Gerald Coley Contributing Editor: Robert P J Day Page 1 of 108 Rev A5.2 REF: BBONEBLK_SRM BeagleBone Black System Reference Manual
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35RAPC
Abstract: Sandisk emmc FBGA169 ADSP-BF518
Text: ADSP-BF518F EZ-Board Evaluation System Manual TM Revision 1.1, June 2009 Part Number 82-000217-01 Analog Devices, Inc. One Technology Way Norwood, Mass. 02062-9106 Copyright Information 2009 Analog Devices, Inc., ALL RIGHTS RESERVED. This document may not be reproduced in any form without prior, express written
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ADSP-BF518F
35RAPC
Sandisk emmc
FBGA169
ADSP-BF518
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sandisk emmc 4.5
Abstract: sandisk eMMC 4.41 emmc controller sandisk emmc emmc 4.41 spec emmc spec circuit diagram sandisk 64 mb hitachi eMMC eMMC 4.51 sandisk micro sdhc
Text: TMS320C5535/34/33/32 Ultra-Low Power DSP Technical Reference Manual Literature Number: SPRUH87 August 2011 2 Copyright 2011, Texas Instruments Incorporated SPRUH87 – August 2011 Submit Documentation Feedback Contents . 33
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TMS320C5535/34/33/32
SPRUH87
sandisk emmc 4.5
sandisk eMMC 4.41
emmc controller
sandisk emmc
emmc 4.41 spec
emmc spec
circuit diagram sandisk 64 mb
hitachi eMMC
eMMC 4.51
sandisk micro sdhc
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SDIN7DP2-4G
Abstract: TWL6037 Sandisk eMMC OMAP5432 OMAP5430 SDIN7DP2 IN248 IN255 SN75LVCP412
Text: OMAP5432 ES2.0 EVM System Reference Manual Texas Instruments Revision 0.4 March 1, 2013 DOC-21163 OMAP5432 ES2.0 EVM System Reference Manual Preface Read This First About This Manual This manual should be used by software and hardware developers of applications based on the
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OMAP5432
DOC-21163
750-2628-2XX-SCH)
EVM5432
750-2628-213-EBOM)
SDIN7DP2-4G
TWL6037
Sandisk eMMC
OMAP5430
SDIN7DP2
IN248
IN255
SN75LVCP412
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Untitled
Abstract: No abstract text available
Text: Embedded Solutions for Transportation and Industrial Markets www.men.de/products/15CC10C.html CC10C – Rugged COM Express VITA 59 RCE with ARM® i.MX 6 n Freescale ARM® i.MX 6 Series n Quad-core processor n Comprehensive usage of i.MX 6 I/O n Configurable FPGA I/O with 140 pins
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de/products/15CC10C
CC10C
CC10C
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Manufacturer ID list eMMC
Abstract: emmc 4.41 spec finder type 81.11
Text: Intel Atom Processor Z2760 Datasheet October 2012 Revision 1.0 Document Number: 328104-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
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Z2760
Z2760
Manufacturer ID list eMMC
emmc 4.41 spec
finder type 81.11
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toshiba emmc 4.4
Abstract: micron emmc micron emmc 4.4 toshiba emmc micron emmc 4.3 TCD1304DG micron eMMC 100 ball BGA eMMC intel eMMC eMMC 4.4
Text: Freescale Semiconductor Application Note Document Number: AN4198 Rev. 0, 09/2010 Architectural Differences between the i.MX23, i.MX25, and i.MX28 by Multimedia Applications Division Freescale Semiconductor, Inc. Austin, TX 1 Introduction This application note describes the key architectural
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AN4198
32-bit
ARM926EJ-S
ARM11
toshiba emmc 4.4
micron emmc
micron emmc 4.4
toshiba emmc
micron emmc 4.3
TCD1304DG
micron eMMC 100 ball BGA
eMMC intel
eMMC
eMMC 4.4
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emmc spi bridge
Abstract: MMC version 4.2 SEC2410 emmc firmware emmc footprint emmc 4.43 EMMC HOST CONTROLLER SmartCard Writer usb flash drive circuit diagram usb sdxc
Text: SEC2410/SEC4410 HS Endpoint Processor with USB 2.0, Smart Card, & FMC for Secure Token & Storage PRODUCT FEATURES Data Brief General Description Hardware Features The SMSC SEC2410/SEC4410 are USB 2.0 compliant, hi-speed bulk-only mass storage class peripheral
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SEC2410/SEC4410
SEC2410/SEC4410
GPIO10/
SEC4410
64-Pin
emmc spi bridge
MMC version 4.2
SEC2410
emmc firmware
emmc footprint
emmc 4.43
EMMC HOST CONTROLLER
SmartCard Writer
usb flash drive circuit diagram
usb sdxc
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OV5642
Abstract: sony IMX 322 cmos DA9053 Atheros AR6003 AR6003 SII9022 ov5642 omnivision HSD100PXN1-A00-C11 SiI9022 HDMI transmitter wi-fi schematic miniPCIe
Text: MCIMX53SMD Board Hardware User’s Guide IMX53SMDHUG Rev. 0 9/2011 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road
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MCIMX53SMD
IMX53SMDHUG
CH370
OV5642
sony IMX 322 cmos
DA9053
Atheros AR6003
AR6003
SII9022
ov5642 omnivision
HSD100PXN1-A00-C11
SiI9022 HDMI transmitter
wi-fi schematic miniPCIe
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LQFP100 tray dimension
Abstract: Increment Encoder interface with STM32F4
Text: STM32F411xC STM32F411xE ARM Cortex®-M4 32b MCU+FPU, 125 DMIPS, 512KB Flash, 128KB RAM, USB OTG FS, 11 TIMs, 1 ADC, 13 comm. interfaces Datasheet - preliminary data Features FBGA • Dynamic Efficiency Line ® ® – Core: ARM 32-bit Cortex -M4 CPU with
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STM32F411xC
STM32F411xE
512KB
128KB
32-bit
4-to-26
DocID026289
LQFP100 tray dimension
Increment Encoder interface with STM32F4
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SMD MARKING CODE sdp
Abstract: sama5d35
Text: ARM-based Embedded MPU SAMA5D3 Series SUMMARY DATASHEET Description The Atmel SAMA5D3 series is a high-performance, power-efficient embedded MPU based on the ARM Cortex®-A5 processor, achieving 536 MHz with power consumption levels below 0.5 mW in low-power mode. The device features a floating
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SCIMX538DZK1C
Abstract: samsung eMMC 4.5 MCIMX535 emmc pcb layout lpddr2 pcb layout LPDDR2 PoP samsung* lpddr2* pop package N7U2 Freescale i.MX53 Quick Start Board AMBA AXI
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch
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IMX53CEC
MCIMX53xD
MX53xD
SCIMX538DZK1C
samsung eMMC 4.5
MCIMX535
emmc pcb layout
lpddr2 pcb layout
LPDDR2 PoP
samsung* lpddr2* pop package
N7U2
Freescale i.MX53 Quick Start Board
AMBA AXI
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MCIMX535
Abstract: MCIMX535DVV1C MCIMX535DVV IMX53CEC mc33902 tepbga-2 MCIMX538DZK1C H.263 *IMX53 emmc pcb layout
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4, 11/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch
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IMX53CEC
MCIMX53xD
MX53xD
MCIMX535
MCIMX535DVV1C
MCIMX535DVV
mc33902
tepbga-2
MCIMX538DZK1C
H.263
*IMX53
emmc pcb layout
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eMMC "thermal impedance"
Abstract: PCIMX535DVV1C emmc Card connector 062N n78c 4.712 eMMC PoP emmc pcb layout 100KPD diode 4.7-16
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 2, 5/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm
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IMX53CEC
MCIMX53xD
MX53xD
DDR2/LVDDR2-800,
eMMC "thermal impedance"
PCIMX535DVV1C
emmc Card connector
062N
n78c
4.712
eMMC PoP
emmc pcb layout
100KPD
diode 4.7-16
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lpddr2 spec
Abstract: tablet mid SAMSUNG RF MODULATORS MLC nand 2012 emmc DDR3 pcb layout MCIMX535DVV1C emmc 4.5 samsung samsung eMMC 5.1 H 204 TK1 SCIMX
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 5, 12/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch
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IMX53CEC
MCIMX53xD
MX53xD
lpddr2 spec
tablet mid
SAMSUNG RF MODULATORS
MLC nand 2012
emmc DDR3 pcb layout
MCIMX535DVV1C
emmc 4.5 samsung
samsung eMMC 5.1
H 204 TK1
SCIMX
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SCIMX
Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 4.1, 2/2012 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch
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MCIMX53xD
MX53xD
SCIMX
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MCIMX535
Abstract: emmc DDR3 pcb layout samsung eMMC 4.5 eMMC 4.4 eMMC rja rjc emmc Pin assignment samsung NAND Flash DIE i.mx53 samsung eMMC 5.0 SCIMX
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53CEC Rev. 6, 03/2013 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch
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IMX53CEC
MCIMX53xD
MX53xD
MCIMX535
emmc DDR3 pcb layout
samsung eMMC 4.5
eMMC 4.4
eMMC rja rjc
emmc Pin assignment
samsung NAND Flash DIE
i.mx53
samsung eMMC 5.0
SCIMX
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pin vga CRT pinout
Abstract: samsung* lpddr2 LPDDR2-800 i.MX53 PCIMX535DVV1C emmc DDR pcb layout Samsung eMMC 4.41 LPDDR2 PoP JESD209-2 flexcan2
Text: Freescale Semiconductor Data Sheet: Advance Information Document Number: IMX53CEC Rev. 3, 7/2011 MCIMX53xD i.MX53xD Applications Processors for Consumer Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Case FC-PBGA PoP 12 x 12 mm
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IMX53CEC
MCIMX53xD
MX53xD
pin vga CRT pinout
samsung* lpddr2
LPDDR2-800
i.MX53
PCIMX535DVV1C
emmc DDR pcb layout
Samsung eMMC 4.41
LPDDR2 PoP
JESD209-2
flexcan2
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samsung EMMC user guide
Abstract: eMMC 4.4 Jedec lpddr2 emmc 4.4 standard jedec ARM cortex A9 neon SIMD imx53 Freescale i.MX53 Quick Start Board H.264 encoder cortex a8 schema tv sony SAMSUNG NAND FLASH TRANSLATION LAYER SOFTWARE
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: IMX53IEC Rev. 6, 03/2013 MCIMX53xC i.MX53 Applications Processors for Industrial Products Package Information Plastic Package Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch Silicon Version 2.1 Ordering Information
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IMX53IEC
MCIMX53xC
DDR2/LVDDR2-800,
LPDDR2-800,
DDR3-800
samsung EMMC user guide
eMMC 4.4
Jedec lpddr2
emmc 4.4 standard jedec
ARM cortex A9 neon SIMD
imx53
Freescale i.MX53 Quick Start Board
H.264 encoder cortex a8
schema tv sony
SAMSUNG NAND FLASH TRANSLATION LAYER SOFTWARE
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