256-pin Plastic BGA 17 x 17
Abstract: EPM240 EPM3032A application altera EPM7032S epm7192 micro fineline BGA EPM7032AE EPM7064AE EPM7128AE EPM7256AE
Text: MAX CPLD Series Package & I/O Matrix MAX 3000A CPLDs EPM2210/G EPM3032A EPM3064A EPM3128A EPM3256A EPM3512A EPM7032B EPM7064B EPM7128B EPM7256B EPM7512B EPM7032AE EPM7064AE EPM7128AE EPM7256AE EPM7512AE EPM7032S EPM7064S EPM7128S EPM7160S EPM7192S EPM7256S
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7000AE
7000B
7000S
EPM3064A
EPM3128A
EPM3256A
EPM3512A
EPM7032B
EPM7064B
EPM7128B
256-pin Plastic BGA 17 x 17
EPM240
EPM3032A application
altera EPM7032S
epm7192
micro fineline BGA
EPM7032AE
EPM7064AE
EPM7128AE
EPM7256AE
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EPM2210
Abstract: h9 317 P7U10 EPM1270 EPM240 EPM570 F256 F324 EPM2210 324
Text: Dedicated Pin Information for the MAX II EPM2210 / EPM2210G Devices Version 1.2 Dedicated Pin IO/GCLK0 IO/GCLK1 IO/GCLK2 IO/GCLK3 IO/DEV_OE IO/DEV_CLRn TDI TMS TCK TDO GNDINT GNDIO VCCINT 1 VCCIO1 (2) VCCIO2 (2) VCCIO3 (2) VCCIO4 (2) No Connect (N.C.)
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EPM2210
EPM2210G
256-Pin
324-Pin
h9 317
P7U10
EPM1270
EPM240
EPM570
F256
F324
EPM2210 324
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micro fineline BGA
Abstract: EPM240Z EPM1270 EPM2210 EPM240 EPM240G EPM570 bga-100 0.5
Text: 1. Introduction MII51001-1.9 Introduction The MAX II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layer-metal-flash process, with densities from 240 to 2,210 logic elements LEs (128 to 2,210 equivalent macrocells) and non-volatile storage of 8 Kbits. MAX II devices
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MII51001-1
micro fineline BGA
EPM240Z
EPM1270
EPM2210
EPM240
EPM240G
EPM570
bga-100 0.5
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epm2210
Abstract: EPM1270 EPM240 EPM240G EPM570 BGA 212
Text: Chapter 1. Introduction MII51001-1.1 Introduction The MAX II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layer-metal-flash process, with densities from 240 to 2,210 logic elements LEs (128 to 2,210 equivalent macrocells) and non-volatile
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MII51001-1
EPM240
EPM570
EPM1270
EPM2210
EPM240G
EPM570G
EPM1270G
EPM2210G
epm2210
EPM1270
EPM240
EPM240G
EPM570
BGA 212
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epm2210
Abstract: EPM1270 EPM240 EPM240G EPM570 EPM2210 324
Text: Chapter 1. Introduction MII51001-1.0 Introduction The MAX II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layer-metal-flash process, with densities from 240 to 2,210 logic elements LEs (128 to 2,210 equivalent macrocells) and non-volatile
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MII51001-1
EPM240
EPM570
EPM1270
EPM2210
EPM240G
EPM570G
EPM1270G
EPM2210G
epm2210
EPM1270
EPM240
EPM240G
EPM570
EPM2210 324
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EPM240
Abstract: epm2210
Text: Chapter 1. Introduction MII51001-1.7 Introduction The MAX II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layer-metal-flash process, with densities from 240 to 2,210 logic elements LEs (128 to 2,210 equivalent macrocells) and non-volatile
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MII51001-1
EPM240
epm2210
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micro fineline BGA
Abstract: No abstract text available
Text: 1. Introduction MII51001-1.8 Introduction The MAX II family of instant-on, non-volatile CPLDs is based on a 0.18-µm, 6-layermetal-flash process, with densities from 240 to 2,210 logic elements LEs (128 to 2,210 equivalent macrocells) and non-volatile storage of 8 Kbits. MAX II devices offer high
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MII51001-1
micro fineline BGA
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EPM240T100C5N
Abstract: EPM2210GF324C3N EPM1270T144I5 EPM570F256C5N EPM570T144C5N EPM570F256C3 EPM1270T144I5N EPM1270T144C5N EPM1270GT144i5 epm240gt100c5n
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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EPM2210GF256C5N
EPM2210GF324C3
EPM2210G
EPM2210GF324C3N
EPM2210GF324C4
EPM2210GF324C4N
EPM2210GF324C5
EPM2210GF324C5N
EPM2210GF256I5
EPM2210GF256I5N
EPM240T100C5N
EPM1270T144I5
EPM570F256C5N
EPM570T144C5N
EPM570F256C3
EPM1270T144I5N
EPM1270T144C5N
EPM1270GT144i5
epm240gt100c5n
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EPM570T144C5
Abstract: EPM240T100C5 EPM570T100C3 EPM240T100 EPM570T100C5
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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EPM1270F256C3
EPM1270
EPM1270F256C4
EPM1270F256C5
EPM1270T144C3
EPM1270T144C4
EPM1270T144C5
EPM1270*
EPM570T144C5
EPM240T100C5
EPM570T100C3
EPM240T100
EPM570T100C5
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EPM240T100C5N
Abstract: EPM570T144C5N EPM1270T144I5 MAX7064 EPM240T100C5 EPM2210F256C4N EPM1270T144C5N 0x020A10DD EPM2210F256I5N 0x020A40DD
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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EPM2210F324C4
EPM2210F324C4N
EPM2210F324C5
EPM2210F324C5N
EPM2210F256I5N
EPM2210F324I5N
EPM2210
EPM2210
nsndv31/data/prod/PARM/VIP/ic/proglog/pld
EPM240T100C5N
EPM570T144C5N
EPM1270T144I5
MAX7064
EPM240T100C5
EPM2210F256C4N
EPM1270T144C5N
0x020A10DD
0x020A40DD
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CMOS handbook
Abstract: error 41 barrier EPM1270 EPM2210 EPM240 EPM240G EPM240Z EPM570 fbga Substrate design guidelines BGA PACKAGE OUTLINE
Text: Section II. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for MAX II devices. It contains the required printed circuit board PCB layout guidelines, device pin tables, and package specifications.
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EPM1270
Abstract: EPM2210 EPM240 EPM240G EPM570
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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EPM1270T144C5N
Abstract: EPM570T144C5N EPM1270F256I5N EPM240T100C4N EPM570T100I5N epm570t144 EPM570F256C5N EPM240T100C5 EPM2210F256C4N EPM570T100
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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nsndv31/data/prod/PARM/VIP/ic/proglog/pld
362/HTML/EPM2210
22-Sep-2005
EPM240T100I5
EPM240
EPM240T100I5N
EPM240T100I5
EPM1270T144C5N
EPM570T144C5N
EPM1270F256I5N
EPM240T100C4N
EPM570T100I5N
epm570t144
EPM570F256C5N
EPM240T100C5
EPM2210F256C4N
EPM570T100
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altera epm570 Date Code Formats
Abstract: HP LED handbook EPM1270 ieee 1532 linear handbook EPM2210 EPM240 EPM240G EPM240Z EPM570
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating
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EPM1270
Abstract: EPM2210 EPM240 EPM240G EPM570 full subtractor circuit using decoder MII51003-1
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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Untitled
Abstract: No abstract text available
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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Untitled
Abstract: No abstract text available
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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EPM240G
Abstract: EPM1270 EPM2210 EPM240 EPM570
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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ALTERA die identifier
Abstract: MAX2171 MII51005-2 Parallel Flash Loader
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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ALTERA PART MARKING EPM
Abstract: EPM1270 EPM2210 EPM240 EPM240G EPM570
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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EPM570GT100C4
EPM570GT100I5
ALTERA PART MARKING EPM
EPM1270
EPM2210
EPM240
EPM240G
EPM570
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Altera Max II EPM240
Abstract: No abstract text available
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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EPM570GT100C4
EPM570GT100I5
Altera Max II EPM240
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linear handbook
Abstract: EPM1270 EPM2210 EPM240 EPM240G EPM240Z EPM570 45This
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating
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PCN0515
Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently
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PCN0515
HC-100
UL-94
1x1011
PCN0515
sumitomo G770
G770* sumitomo
G770 mold compound
G770 sumitomo
Unbiased HAST 130, 85 RH, 100 Hrs
G770
G770* G770 mold compound Sumitomo 1000
thermal conductivity of sumitomo g770
G770 HC
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32 bit carry select adder code
Abstract: ieee 1532 micro fineline BGA tms 980 8 bit adder/subtractor using XOR 876 pin bga altera 1270 bga 529 programmable multi pulse waveform generator cpld variable resistor 47
Text: Section I. MAX II Device Family Data Sheet This section provides designers with the data sheet specifications for MAX II devices. The chapters contain feature definitions of the internal architecture, Joint Test Action Group JTAG and in-system programmability (ISP) information, DC operating conditions, AC timing
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