EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Search Results

EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES		National Semiconductor	External Lead Finish for Hermetic Packages		Original	PDF

EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
ceramic pin grid array package lead finish gold Abstract: 40 lead ceramic flatpack ceramic pin grid array package lead finish EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES 85# Tin Plate gold plate MIL-M38510 lead finish National Semiconductor 16 Pin Dip Text: External Lead Finish for Hermetic Packages For hermetic packages, National Semiconductor offers three primary lead finishes: solder dip, gold plate and tin plate. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The	Original	Mil-M-38510. ceramic pin grid array package lead finish gold 40 lead ceramic flatpack ceramic pin grid array package lead finish EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES 85# Tin Plate gold plate MIL-M38510 lead finish National Semiconductor 16 Pin Dip	PDF
CERAMIC QUAD FLATPACK CQFP Abstract: No abstract text available Text: Cypress Semiconductor Qualification Report QTP# 97061 VERSION 1.0 November, 1997 160-pins Ceramic Quad Flatpack CQFP Golden Altos Assembly Cypress Semiconductor Assembly: Golden Altos, USA Package: 160-pins CQFP QTP# 97304, V. 1.0 Page 2 of 4 August, 1997	Original	160-pins 160-pin 7C375DT-GAUMB CERAMIC QUAD FLATPACK CQFP	PDF
CERAMIC QUAD FLATPACK CQFP Abstract: 8361H CY7C37512P208B-UM Text: Cypress Semiconductor Assembly Site Transfer Qualification Report QTP# 003102 VERSION 1.0 December, 2000 160/208-pin Ceramic Quad Flatpack CQFP Alphatec, Bangkok CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069	Original	160/208-pin 160/208-lead 160-lead 7C375DT-GAUMB CERAMIC QUAD FLATPACK CQFP 8361H CY7C37512P208B-UM	PDF
INCOMING RAW MATERIAL INSPECTION procedure Abstract: 5962-8867001LA MIL-STD-883 Method 2010 Mil-Std-883 Wire Bond Pull Method 2011 Sample form for INCOMING Inspection of RAW MATERIAL CY7C122 PALC22V10 plate INCOMING RAW MATERIAL INSPECTION procedure outgoing raw material inspection procedure visual inspection of raw materials Text: fax id: 8509 Quality, Reliability, and Process Flows Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality	Original		PDF
HP 450 optocoupler Abstract: HP 3700 optocoupler coil gold detector optocoupler with schmitt trigger input SMD MARKING CODE sg Optocoupler HP 3700 smd diode marking sG RX-2 -G s smd optocoupler marking 1 HCPL-3700 Text: HERMETIC/HI-REL OPTOCOUPLERS H AC/DC to Logic Interface Hermetically Sealed Optocouplers Technical Data HCPL-576X* 5962 8947701 *See matrix for available extensions Features Applications Description • Dual Marked with Device Part Number and DESC Standard Military Drawing	Original	HCPL-576X* MIL-STD-1772 QML-38534, HCPL-3700 MIL-PRF-38534 MIL-PRF-38534. HP 450 optocoupler HP 3700 optocoupler coil gold detector optocoupler with schmitt trigger input SMD MARKING CODE sg Optocoupler HP 3700 smd diode marking sG RX-2 -G s smd optocoupler marking 1	PDF
5962-8867001LA cypress Abstract: INCOMING RAW MATERIAL INSPECTION procedure PALC22V10-25PI 5962-8867001LA Mil-Std-883 Wire Bond Pull Method 2011 cypress part marking CY7C122 PALC22V10 visual inspection of raw materials MIL-STD-883 Method 2010 Text: Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality and reliability. If you, the user, are not satisfied with every	Original		PDF
MIL-STD-883-5005 Abstract: phil QMI2419 CY27H010-WMB EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES CY7C199-DMB Cypress Semiconductor Qualification Report Text: Cypress Semiconductor Qualification Report QTP# 98366 VERSION 1.0 September, 1999 16 Lead to 40 Lead Cerdip - Commercial and Military Amertron Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7068 Cypress Semiconductor	Original	16-40ld Y7C199-DMB CY27H010-WMB CY7C199-DMB MIL-STD-883-5005 phil QMI2419 CY27H010-WMB EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES CY7C199-DMB Cypress Semiconductor Qualification Report	PDF
Alumina ceramic AI203 Abstract: ausi die attach gold metal detectors AI203 gold melting furnace pressure low die attach spot welding schematics ausi die attach thin silicon die Dissolve Oxygen ceramic pin grid array package wire bond Text: Alumina & Leaded Molded Technology 3 3.1 Introduction The packaging technologies used to manufacture or assemble three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity	Original		PDF
gold metal detectors Abstract: epoxy adhesive paste cte table 28 pin ic base socket round pin type lead spot welding schematics soft solder die bonding electrical three phase schematic riser DIAGRAM CERAMIC PIN GRID ARRAY wire lead frame ausi die attach thin silicon die soft solder wire dispensing 10 k ntc thermistor Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity	Original		PDF
Untitled Abstract: No abstract text available Text: Cypress Semiconductor Package Qualification Report QTP# 001601 VERSION 1.0 October, 2000 32-pin Windowed Rectangular Leadless Chip Carrier LCC Alphatec, Bangkok CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069	Original	32-pin CY7C277 Q32RCA CY7C277-QMB	PDF
Ultrasonic Cleaning Transducer Abstract: Ultrasonic welding circuit diagram gold metal detectors ultrasonic transducer cleaning bath Ultrasonic nozzle schematic ultrasonic motion detector gold detectors circuit INCOMING RAW MATERIAL INSPECTION soft solder wire dispensing soft solder die bonding Text: CHAPTER 3 IC ASSEMBLY TECHNOLOGY INTRODUCTION The material and process technology steps used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter The package families described in Chapter 1 provide the functional specialization and diversity required by our customers Material and construction attributes of individual family	Original		PDF
solid solubility Abstract: chemical control process block diagram Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity	Original		PDF
DIODE SMD MARKING CODE 736 Abstract: opto HP 2630 datasheet smd transistor marking HP HP 2601 OPTO DATASHEET HP 2630 SMD MARKING CODE 813 6N134 HP 2601 optocoupler opto HP 2630 HP 2630 optocoupler Text: H Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers 6N134* 81028 HCPL-563X HCPL-663X Technical Data HCPL-665X 5962-90855 HCPL-560X *See matrix for available extensions. Features • Dual Marked with Device Part Number and DESC Drawing Number	Original	6N134* HCPL-563X HCPL-663X HCPL-665X HCPL-560X MIL-PRF-38534 QML-38534, 6N137, HCPL-2601, HCPL2630/-31 DIODE SMD MARKING CODE 736 opto HP 2630 datasheet smd transistor marking HP HP 2601 OPTO DATASHEET HP 2630 SMD MARKING CODE 813 6N134 HP 2601 optocoupler opto HP 2630 HP 2630 optocoupler	PDF
CD4536BE Abstract: No abstract text available Text: Data sheet acquired from Harris Semiconductor SCHS083A – Revised March 2002 The CD4536B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline package (NSR suffix), and in chip form (H	Original	SCHS083A CD4536B 16-lead SDYV001, CD4536BE CD4536BF3A CD4536BPWR	PDF

MO-78 Abstract: No abstract text available Text: OMR9601 1 M Rad Si , ULTRA LOW DROPOUT POSITIVE LINEAR REGULATOR +3.3Vin to +2.5V Output at 3.0A In Hermetic Packages FEATURES • Total dose and low dose capability to 1M Rad (Si) allows use in space applications • Ultra low dropout voltage of 0.4V @ 3A out significantly reduces power consumption	Original	OMR9601 MO-078AA O-258) OMR9601 MIL-STD-883, MIL-PRF-38534 MIL-PRF-38534 MIL-STD-883 MO-78	PDF
KC700 Abstract: KC-700 Cypress CROSS Text: Cypress Semiconductor Package Qualification Report QTP# 98369 VERSION 1.1 October, 2000 Ceramic Window Lid 68-lead, 84-lead and 100-lead Pin Grid Arrays Alphatec, Thailand Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director	Original	68-lead, 84-lead 100-lead 68/84/100-lead 68-lead CY7C346-RMB KC700 KC-700 Cypress CROSS	PDF
1N5907 JANTX Abstract: 1N5908 diode DO-202AA 1N5907 1N5907 JANTXV 1N5908 IEC61000-4-4 JANTXV1N5907 Text: 1N5907 and 1N5908 1500 WATT LOW VOLTAGE TRANSIENT VOLTAGE SUPPRESSOR SCOTTSDALE DIVISION APPEARANCE This pair of unidirectional low voltage Transient Voltage Suppressor TVS devices for the 1N5907 and 1N5908 JEDEC registrations with different packages have the same high Peak Pulse Power rating of 1500 W with	Original	1N5907 1N5908 1N5908 IEC61000-4-5 DO-13 DO-202AA) 1N5907 JANTX 1N5908 diode DO-202AA 1N5907 JANTXV IEC61000-4-4 JANTXV1N5907	PDF
HP 450 optocoupler Abstract: HP 3700 optocoupler 5962-8947701 coil gold detector HCPL-3700 HCPL-5760 HCPL-5761 HCPL-576K HCPL-576X coil gold detector circuit Text: H AC/DC to Logic Interface Hermetically Sealed Optocouplers Technical Data HCPL-576X* 5962 8947701 *See matrix for available extensions Features Applications Description • Dual Marked with Device Part Number and DESC Standard Military Drawing • Manufactured and Tested	Original	HCPL-576X* MIL-STD-1772 QML-38534, HCPL-3700 MIL-PRF-38534 MIL-PRF-38534. HP 450 optocoupler HP 3700 optocoupler 5962-8947701 coil gold detector HCPL-5760 HCPL-5761 HCPL-576K HCPL-576X coil gold detector circuit	PDF
MO-078AA Abstract: OMR9601 OMR9601SCH OMR9601SCK OMR9601SCP OMR9601SFH OMR9601SFK OMR9601SFP Text: OMR9601 1 M Rad Si , ULTRA LOW DROPOUT POSITIVE LINEAR REGULATOR +3.3Vin to +2.5V Output at 3.0A In Hermetic Packages FEATURES • Total dose and low dose capability to 1M Rad (Si) allows use in space applications • Ultra low dropout voltage of 0.4V @ 3A out significantly reduces power consumption	Original	OMR9601 MO-078AA O-258) OMR9601 MIL-STD-883, MIL-PRF-38534 MIL-STD-883 MO-078AA OMR9601SCH OMR9601SCK OMR9601SCP OMR9601SFH OMR9601SFK OMR9601SFP	PDF
Zener diode smd marking 18 Abstract: Zener diode smd marking code .18 coil gold detector Zener diode smd marking 36 diode Marking code v3 Zener diode smd marking 27 SMD CODE list smd diode marking sG SMD MARKING CODE sg smd optocoupler marking Text: HCPL-5760, HCPL-5761, HCPL-576K 5962-89477 AC/DC to Logic Interface Hermetically Sealed Optocouplers Data Sheet Description These devices are single channel, hermetically sealed, voltage/current threshold detection optocouplers. The products are capable of operation and storage	Original	HCPL-5760, HCPL-5761, HCPL-576K MIL-PRF-38534 QML-38534 MIL-PRF-38534. HCPL-5760/1/K 5968-9404E Zener diode smd marking 18 Zener diode smd marking code .18 coil gold detector Zener diode smd marking 36 diode Marking code v3 Zener diode smd marking 27 SMD CODE list smd diode marking sG SMD MARKING CODE sg smd optocoupler marking	PDF
CD4521BE Abstract: CD4521B Text: Data sheet acquired from Harris Semiconductor SCHS078A - Revised March 2002 The CD4521B types are supplied in 16-lead hermetic dual-in-line ceramic packages D and F suffixes , 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline package (NSR suffix), and in chip form (H suffix).	Original	SCHS078A CD4521B 16-lead CD4521BNSR CD4521BPW CD4521BPWR CD4521BE	PDF
HCPL-3700 Abstract: HCPL-5760 HCPL-5761 HCPL-576K HCPL-576X Text: AC/DC to Logic Interface Hermetically Sealed Optocouplers Technical Data HCPL-576X* 5962-8947701 *See matrix for available extensions Features Applications Description • Dual Marked with Device Part Number and DSCC Standard Microcircuit Drawing • Manufactured and Tested	Original	HCPL-576X* MIL-PRF-38534 QML-38534, HCPL-3700 MIL-PRF-38534 MIL-PRF-38534. HCPL-5760/1/K 5968-0406E 5968-9404E HCPL-5760 HCPL-5761 HCPL-576K HCPL-576X	PDF
IC 2025 Abstract: No abstract text available Text: Hermetic Optocouplers Choose from Hewlett-Packard's broad line of high performance hermetic optocouplers to meet your military, aerospace, and high reliability applications. There are three ceramic package styles to choose from: 8 and 16 pin dual in-line packages, and a 20 terminal	OCR Scan	20-terminal MIL-H-38534 MIL-M-38510 IC 2025	PDF
gold detector IC Abstract: SMD 8PIN IC MARKING CODE 251 VU4R Optocoupler HP 3700 marking IRH pj 229 SMD diode DIODE PJ 257 Text: AC/DC to Logic Interface Hermetically Sealed Optocouplers Technical Data HCPL-576X* 5962 8947701 *See matrix for available extensions Features Applications Description • Dual Marked with Device Part Number and DESC Standard Military Drawing • Manufactured and Tested	OCR Scan	HCPL-576X* MIL-STD-1772 QML-38534, HCPL-3700 MIL-PRF-38534 MIL-PRF-38534. gold detector IC SMD 8PIN IC MARKING CODE 251 VU4R Optocoupler HP 3700 marking IRH pj 229 SMD diode DIODE PJ 257	PDF

Privacy Settings

EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Search Results

EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Result Highlights (5)

EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Datasheets (1)

EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES Datasheets Context Search

ceramic pin grid array package lead finish gold

CERAMIC QUAD FLATPACK CQFP

CERAMIC QUAD FLATPACK CQFP

INCOMING RAW MATERIAL INSPECTION procedure

HP 450 optocoupler

5962-8867001LA cypress

MIL-STD-883-5005

Alumina ceramic AI203

gold metal detectors

Untitled

Ultrasonic Cleaning Transducer

solid solubility

DIODE SMD MARKING CODE 736

CD4536BE

MO-78

KC700

1N5907 JANTX

HP 450 optocoupler

MO-078AA

Zener diode smd marking 18

CD4521BE

HCPL-3700

IC 2025

gold detector IC