Untitled
Abstract: No abstract text available
Text: 64-FBGA-0606 SAMSUNG SEMICONDUCTOR, INC.
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64-FBGA-0606
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Untitled
Abstract: No abstract text available
Text: 180-FBGA-1010 SAMSUNG SEMICONDUCTOR, INC.
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180-FBGA-1010
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PDF
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280-FBGA-1616
Abstract: No abstract text available
Text: 280-FBGA-1616 SAMSUNG SEMICONDUCTOR, INC.
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280-FBGA-1616
280-FBGA-1616
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PDF
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1313
Abstract: No abstract text available
Text: 180-FBGA-1313 SAMSUNG SEMICONDUCTOR, INC.
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180-FBGA-1313
1313
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PDF
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0808
Abstract: No abstract text available
Text: 64-FBGA-0808 SAMSUNG SEMICONDUCTOR, INC.
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64-FBGA-0808
0808
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PDF
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160-FBGA-1212
Abstract: 160FBGA-1
Text: 160-FBGA-1212 SAMSUNG SEMICONDUCTOR, INC.
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160-FBGA-1212
160-FBGA-1212
160FBGA-1
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PDF
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Untitled
Abstract: No abstract text available
Text: 144-FBGA-1010 SAMSUNG SEMICONDUCTOR, INC.
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144-FBGA-1010
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Untitled
Abstract: No abstract text available
Text: 88-FBGA-0707 SAMSUNG SEMICONDUCTOR, INC.
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88-FBGA-0707
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PDF
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Untitled
Abstract: No abstract text available
Text: DDR400 SDRAM 512Mb B-die FBGA x4, x8, x16 DDR SDRAM 512Mb B-die DDR400 SDRAM Specification 60Ball FBGA Revision 1.2 November, 2004 Revision 1.2 November, 2004 DDR400 SDRAM 512Mb B-die FBGA (x4, x8, x16) DDR SDRAM 512Mb B-die Revision History Revision 0.0 (September, 2003)
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DDR400
512Mb
60Ball
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PDF
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thermal analysis on pcb
Abstract: analysis Thermal Datasheet
Text: 105-FBGA-0808 SAMSUNG SEMICONDUCTOR, INC. 105-FBGA-0808 Thermal Analysis Electrical Analysis R N E O D I N T U LA U M I S ❑ PCB layer standard 4layers. SAMSUNG SEMICONDUCTOR, INC.
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105-FBGA-0808
thermal analysis on pcb
analysis
Thermal Datasheet
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PDF
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K4H510438B-ZC
Abstract: No abstract text available
Text: DDR400 SDRAM 512Mb B-die FBGA x4, x8, x16 DDR SDRAM 512Mb B-die DDR400 SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant) Revision 1.1 March, 2004 Revision 1.1 March, 2004 DDR400 SDRAM 512Mb B-die FBGA (x4, x8, x16) DDR SDRAM 512Mb B-die Revision History
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DDR400
512Mb
200MHz
K4H510438B-ZC
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PDF
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thermal analysis on pcb
Abstract: 0808 128-FBGA-0808
Text: 128-FBGA-0808 SAMSUNG SEMICONDUCTOR, INC. 128-FBGA-0808 Thermal Analysis Electrical Analysis R N E O D I N T U LA U M I S ❑ PCB layer standard 4layers. SAMSUNG SEMICONDUCTOR, INC.
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Original
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128-FBGA-0808
thermal analysis on pcb
0808
128-FBGA-0808
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PDF
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thermal analysis on pcb
Abstract: 49-FBGA-0606
Text: 49-FBGA-0606 SAMSUNG SEMICONDUCTOR, INC. 49-FBGA-0606 Thermal Analysis Electrical Analysis R N E O D I N T U LA U M I S ❑ PCB layer standard 4layers. SAMSUNG SEMICONDUCTOR, INC.
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49-FBGA-0606
thermal analysis on pcb
49-FBGA-0606
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PDF
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165-FBGA-15
Abstract: FBGA Samsung
Text: 165-FBGA-15.0X17.0 Dimensions in Millimeters TOP VIEW BOTTOM VIEW SAMSUNG SEMICONDUCTOR, INC.
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165-FBGA-15
FBGA Samsung
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Untitled
Abstract: No abstract text available
Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 184pin Registered Module based on 512Mb B-die x4, x8 with 1,125mil/1,200mil Height 60 FBGA with Pb-Free (RoHS compliant) Revision 1.2 Nov. 2004 Revision 1.2 November. 2004
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512MB,
DDR400
184pin
512Mb
125mil/1
200mil
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PDF
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M312L2920BG0-CCC
Abstract: M312L5720BG0-CCC M312L6523BG0-CCC M312L2920BG0 DDR400 M312L2923BG0-CCC
Text: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.0 November. 2003 Revision 1.0 November 2003 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM
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512MB,
DDR400
60FBGA)
184pin
512Mb
125mil/1
200mil
M312L2920BG0-CCC
M312L5720BG0-CCC
M312L6523BG0-CCC
M312L2920BG0
M312L2923BG0-CCC
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PDF
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FBGA1010
Abstract: 112FBGA
Text: 112-FBGA-1010 #A1 INDEX MARK 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L SAMSUNG SEMICONDUCTOR, INC.
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112-FBGA-1010
FBGA1010
112FBGA
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PDF
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M395T5163FB4
Abstract: No abstract text available
Text: Rev. 1.0, Jul. 2010 M395T2863FB4 M395T5663FB4 M395T5160FB4 M395T5163FB4 240pin Fully Buffered DIMM based on 1Gb F-die 60 FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
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M395T2863FB4
M395T5663FB4
M395T5160FB4
M395T5163FB4
240pin
128Mbx8
512Mx72
M395T5163FB4
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PDF
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M378T5663FB3
Abstract: No abstract text available
Text: Rev. 1.0, Jul. 2010 M378T2863FBS M378T5663FB3 M391T2863FB3 M391T5663FB3 240pin Unbuffered DIMM based on 1Gb F-die 60 & 84 FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
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M378T2863FBS
M378T5663FB3
M391T2863FB3
M391T5663FB3
240pin
K4T1G084QF
M378T5663FB3/M391T5663FB3
128Mbx8
128Mx72
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PDF
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Untitled
Abstract: No abstract text available
Text: K7J323682C K7J321882C Preliminary 1Mx36 & 2Mx18 DDR II SIO b2 SRAM 36Mb DDRII SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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K7J323682C
K7J321882C
1Mx36
2Mx18
11x15
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PDF
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K7R321882C
Abstract: No abstract text available
Text: K7R323682C K7R321882C K7R320982C Preliminary 1Mx36 & 2Mx18 & 4Mx9 QDRTM II b2 SRAM 36Mb QDRII SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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Original
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K7R323682C
K7R321882C
K7R320982C
1Mx36
2Mx18
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PDF
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K7R643682MF
Abstract: IR 10D 6g
Text: K7R643682M K7R641882M K7R640982M 2Mx36 & 4Mx18 & 8Mx9 QDRTM II b2 SRAM 72Mb QDRII SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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Original
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K7R643682M
K7R641882M
K7R640982M
2Mx36
4Mx18
K7R643682MF
IR 10D 6g
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PDF
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Untitled
Abstract: No abstract text available
Text: K7S3236T4C K7S3218T4C Preliminary 1Mx36 & 2Mx18 QDR TM II+ b4 SRAM 36Mb QDRII+ SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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Original
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K7S3236T4C
K7S3218T4C
1Mx36
2Mx18
11x15
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PDF
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Untitled
Abstract: No abstract text available
Text: K7K3236T2C K7K3218T2C Preliminary 1Mx36 & 2Mx18 DDRII+ CIO b2 SRAM 36Mb DDRII+ SRAM Specification 165 FBGA with Pb & Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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Original
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K7K3236T2C
K7K3218T2C
1Mx36
2Mx18
11x15
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PDF
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