bellcore GR-78
Abstract: J-STD-006 SAC305
Text: Lead Free Solder SAC305 Page 1 of 2 Lead Free Solder Sn96 SAC 305 4900 96.3% tin, 0.7% copper and 3% silver M.G. Chemicals no clean Lead-Free Solder was designed with Sn/Ag/Cu (Tin/Silver/Copper) alloys as a lead-free alternative for the standard Tin and Lead solder.
|
Original
|
SAC305
J-Std-006
J-Std-006
4900-35G
4900-112G
4900-227G
4900-454G
com/products/4900
bellcore GR-78
J-STD-006 SAC305
|
PDF
|
SAC405
Abstract: NC266 Flux for solder wire Sn 96 SN100C IPC-TM650 J-STD-004 SAC305 TM650 177E-09 solder paste SAC305 .032
Text: Glow Core No-Clean Cored Wire Solder Features: - Excellent Wetting - Wide Process Window - Cleanable with Saponifier - Lead-Free Compatible Description: Glow Core is a no-clean, resin-based flux cored wire solder designed to offer excellent wetting characteristics and
|
Original
|
ISO9001
45-micron
SAC405
NC266
Flux for solder wire Sn 96
SN100C
IPC-TM650
J-STD-004
SAC305
TM650
177E-09
solder paste SAC305 .032
|
PDF
|
TS0300
Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Text: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
|
Original
|
|
PDF
|
ECF564A
Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Text: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output
|
Original
|
|
PDF
|
ROSIN FLUX TYPE ROL1
Abstract: IPC-J-STD-004 IPC-J-STD-004A ROSIN FLUX TYPE ROL0 J-STD-006 - ROL0 J-STD-006 SAC305 SAC405 bonding capillary led sac305 th hole design ipc insertion requirement
Text: Soldering and Handling of High Brightness Through Holes LED Lamps Application Note 5334 Introduction LED is well known of its long useful life compare to conventional incandescent bulb. If LED is not being properly handled, it will significantly shorten its useful life and
|
Original
|
AV02-0399EN
ROSIN FLUX TYPE ROL1
IPC-J-STD-004
IPC-J-STD-004A
ROSIN FLUX TYPE ROL0
J-STD-006 - ROL0
J-STD-006 SAC305
SAC405
bonding capillary led
sac305
th hole design ipc insertion requirement
|
PDF
|
Alpha WS609 solder
Abstract: mountaingate Kester steam aging system solder paste alpha WS609 ALS245 LS245 TL082 Dissolve Oxygen free energy matsua saw
Text: PALLADIUM LEAD FINISH USER'S MANUAL DOUGLAS W. ROMM INTRODUCTION Texas Instruments has introduced a revolutionary new lead finish into the Semiconductor industry. This plating technology consists of a copper base metal plated with nickel and palladium. The palladium acts as
|
Original
|
|
PDF
|
Alpha WS609 solder
Abstract: Kester steam aging system solder paste alpha WS609 7406D mountaingate kester solder paste WS609 TL082 s05d SHINKO WS609
Text: PALLADIUM LEAD FINISH USER'S MANUAL DOUGLAS W. ROMM INTRODUCTION Texas Instruments has introduced a revolutionary new lead finish into the Semiconductor industry. This plating technology consists of a copper base metal plated with nickel and palladium. The palladium acts as
|
Original
|
|
PDF
|
flux ef 2202
Abstract: ipc 610D ipc 610 Class 3 pin protrusion ipc 610 non-wetting IPC-A610D ipc 610 Class 3 IPC-A-610D ipc 610 AN017 IPC-A-610-D
Text: Application Note AN:017 RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations By Ankur Patel, Associate Product Line Engineer Introduction Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 3 Pin/Lead Protrusion 4 Board Cleaning 4 Solder Joint Inspection
|
Original
|
IPC-A-610
flux ef 2202
ipc 610D
ipc 610 Class 3 pin protrusion
ipc 610 non-wetting
IPC-A610D
ipc 610 Class 3
IPC-A-610D
ipc 610
AN017
IPC-A-610-D
|
PDF
|
ipc 610 Class 3 pin protrusion
Abstract: flux ef 2202 ipc 610D ipc 610 Class 3 IPC-A-610D ipc 610 non-wetting IPCA610D ipc 610 IPC-A-610-D IPC-A610D
Text: Application Note AN:017 RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations By Ankur Patel, Associate Product Line Engineer Introduction Contents Page Introduction 1 Wave Soldering 1 Hand Soldering 3 Pin/Lead Protrusion 4 Board Cleaning 4 Solder Joint Inspection
|
Original
|
IPC-A-610
ipc 610 Class 3 pin protrusion
flux ef 2202
ipc 610D
ipc 610 Class 3
IPC-A-610D
ipc 610 non-wetting
IPCA610D
ipc 610
IPC-A-610-D
IPC-A610D
|
PDF
|
senju M705-221BM5-42-11
Abstract: casting JIS B 0405 ET-7403 PTC thermistor 4.7k ptc thermistor 330ohm senju m705 solder wire pth posistor PRF15BA471QB1RC PRF15BB471QB1RC PRF18BD471QB1RB
Text: PDF catalog is downloaded from!CAUTION the website for of Murata Manufacturing co., ltd. Therefore, it’s specifications areinsubject to change or oursmoking productsand/or in it may be discontinued without advance notice. Please check with our • Please
|
Original
|
speci45
senju M705-221BM5-42-11
casting JIS B 0405
ET-7403
PTC thermistor 4.7k
ptc thermistor 330ohm
senju m705 solder wire
pth posistor
PRF15BA471QB1RC
PRF15BB471QB1RC
PRF18BD471QB1RB
|
PDF
|
thermistor ptc 15k ohm
Abstract: ET-7403 pth posistor BC components PTC SMD
Text: R90E7.pdf 05.3.30 catalog to prevent smoking and/or burning, Pleaseread readrating ratingand and!CAUTION !CAUTION for (forstorage, storage,operating, operating,rating, rating,soldering, soldering,mounting mountingand andhandling handling)ininthis thisPDF
|
Original
|
R90E7
thermistor ptc 15k ohm
ET-7403
pth posistor
BC components PTC SMD
|
PDF
|
J-STD-006 electronic grade solder alloys
Abstract: TC-527 ASTM B32 4662-SM QQ-S-571F kester 245 solder wire Kester sn62 tinning RV8NA nte semiconductors ceiling fan
Text: E L E C T R O N I C S, I N C. www.nteinc.com Kester Solder Wide range of solders and related materials from the leader in the industry. Products KESTER • Wire Solder • Bar Solder • Carded & Counter Display Products • Chemicals • Techform Products
|
Original
|
|
PDF
|
BGS67A
Abstract: philips if catv amplifier philips hybrid amplifier modules philips application catv
Text: Application Note BGS67A Application Note AN10201 Philips Semiconductors TPAN02_02W97 Philips Semiconductors BGS67A application note Application Note AN10201 Abstract The BGS67A is a high dynamic range hybrid amplifier designed for applications as a reverse amplifier in two-way CATV systems.
|
Original
|
BGS67A
AN10201
TPAN02
02W97
BGS67A
philips if catv amplifier
philips hybrid amplifier modules
philips application catv
|
PDF
|
Sn60A
Abstract: distillation method F-2100 F-2101 SN60 SN63 F2102 electric blanket
Text: Reflow Soldering Process Considerations for Surface Mount Application by Jim Bergenthal KEMET Electronics Corporation P. O. Box 5928 Greenville, SC 29606 Phone 864 963-6300 Fax (864) 963-6521 www.kemet.com F-2102A 7/95 Reprinted 10/97 saying about it. Methods of improving on the process, to balance these criticisms, are also dis-cussed.
|
Original
|
F-2102A
Sn60A
distillation method
F-2100
F-2101
SN60
SN63
F2102
electric blanket
|
PDF
|
|
|
84-1LMI epoxy adhesive
Abstract: TS0300W3 TS0500W3
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
|
OCR Scan
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
|
OCR Scan
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.
|
OCR Scan
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
|
OCR Scan
|
|
PDF
|
84-1LM
Abstract: ECF564A
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are com m only used in RF and microwave applications. Some of these chips are offered with
|
OCR Scan
|
|
PDF
|
ECF564A
Abstract: No abstract text available
Text: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
|
OCR Scan
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has
|
OCR Scan
|
|
PDF
|
Ablestik 84-1LMI
Abstract: mil-f-14256* rma h20E induction furnace circuit fiberglass laminate induction furnace circuit board
Text: APPLICATION NOTES APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has
|
OCR Scan
|
|
PDF
|
h20E
Abstract: induction furnace circuit induction furnace circuit board Ablestik 84-1LMI
Text: APPLICATION NOTES APPLICATION NOTE 002 - HYBRID COUPLER MOUNTING INSTRUCTIONS MOUNTING INSTRUCTIONS FOR PLANAR, PRETINNED AND EDGE CLIP STYLE COUPLERS This line of hybrid couplers is designed for surface mount applications using wrap-around metallization or edge clip leads. The planar style has
|
OCR Scan
|
|
PDF
|
CF-110VH-2A
Abstract: tamura CF-110VH-2A spud 002t p0.5 tensile strength Tamura kaken pud connector SPUD-002T-P0 SPUD-001T-P0 T-2-42353 JST PUD
Text: Page This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for m anufacturing, without our written and has to be returned to us. PRODUCT SPECIFICATION No. T-2-42353 R-2-42353 Customer: Revised: Title Subject.
|
OCR Scan
|
T-2-42353
R-2-42353)
66NYLON
UL94V-0
KRD-41914
EC4109-2
CF-110VH-2A
tamura CF-110VH-2A
spud 002t p0.5 tensile strength
Tamura kaken
pud connector
SPUD-002T-P0
SPUD-001T-P0
T-2-42353
JST PUD
|
PDF
|
