Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    HEAT SINK OF SCR Search Results

    HEAT SINK OF SCR Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    P104 Coilcraft Inc Silicon Controlled Rectifier, Visit Coilcraft Inc
    UE36C2620005011 Amphenol Communications Solutions 1x2 QSFP-DD cage with open top and heat sink clip, no heat sink Visit Amphenol Communications Solutions
    U77E112J2001 Amphenol Communications Solutions SFP CAGE WITH HEAT SINK Visit Amphenol Communications Solutions
    U79A1113001 Amphenol Communications Solutions XFP CAGE WITHOUT HEAT SINK Visit Amphenol Communications Solutions
    U79A1212D01 Amphenol Communications Solutions XFP CAGE WITH HEAT SINK Visit Amphenol Communications Solutions

    HEAT SINK OF SCR Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Heat Sink SQ50x34 TECHNICAL DATA Heat Sink for DPSS Laser Modules SQ50x34 is a heat sink designed for DPSS laser modules of 12mm diameter. Made of black anodized aluminium it features very good thermal conductivity. The heat sink’s ground plate comes with five M4


    Original
    SQ50x34 SQ50x34 50x50x34 PDF

    pcb board of miniskiip 2

    Abstract: miniskiip board MiniSKiiP 1 Package MiniSKiiP MiniSKiiP Package SEMIKRON BOARD Wacker silicone paste p 12 wacker rubber Wacker Silicones
    Text: MiniSKiiP Assembly Instructions 1. Preparation, surface specification 1.2 Heat sink ≤ 20 µm Heat sink > 10 µm ≤ 6,3 µm Fig. 1: Heat sink surface specification ♦ Heat sink must be free from grease and particles ♦ unevenness of heat sink mounting area must be ≤ 20 µm


    Original
    PDF

    COHS-50

    Abstract: heat sink DOWNLIGHT
    Text: Data sheet Heat Sink for COINlight-OSTAR COHS Highlights ¾ Accessory part for for optimised heat dissipation of COINlight-OSTAR® ¾ Improved life time of the module ¾ Easy mounting by screwing the heat sink on the module ¾ Small diameter adapted to the compact


    Original
    COHS-50 COHS-50 CO06A) heat sink DOWNLIGHT PDF

    heat sink

    Abstract: din 84
    Text: Data sheet Heat Sink for COINlight-OSTAR COHS Highlights ¾ Accessory part for for optimised heat dissipation of COINlight-OSTAR® ¾ Improved life time of the module ¾ Easy mounting by screwing the heat sink on the module ¾ Small diameter adapted to the compact


    Original
    COHS-50 COHS-50 CO06A CO06A) heat sink din 84 PDF

    wacker silicone paste

    Abstract: silicone paste p 12 IEC 326-3 Wacker Silicones P-12 Wacker Silicones pcb board of miniskiip 2 Wacker miniskiip board SEMIKRON BOARD wacker rubber
    Text: MiniSKiiP - Technical Explanations Assembly Instructions 1 Preparation, surface specification To obtain the maximum thermal conductivity of the module, heat sink and module must fulfil the following specifications. 1.1 Heat sink ≤ 20 µm Heat sink > 10 µm


    Original
    PDF

    G3PA-210B-VD

    Abstract: G3PA-210BL-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-420B-VD g3pa220bv
    Text: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink Downsizing achieved through optimum design of heat sink. Mounting possible via screws or via DIN rail. Dense mounting possible for linking terminals. (Except for G3PA-260B-VD.)


    Original
    G3PA-260B-VD. G3PA-420B-VD/-430B-VD G3PA-210B-VD K94-E1-3 06-949-6115/Fax: 0397-1M G3PA-210B-VD G3PA-210BL-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-420B-VD g3pa220bv PDF

    G32A-A20-VD

    Abstract: G32A-A10-VD G3PA-240B-VD G32A-A40-VD G32A-A60-VD G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD
    Text: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink Downsizing achieved through optimum design of heat sink. Mounting possible via screws or via DIN rail. Dense mounting possible for linking terminals. (Except for G3PA-260B-VD.)


    Original
    G3PA-260B-VD. G3PA-210B-VD G3PA-220B-VD G3PA-430B-VD, G3PA-430B-VD-2 K094-E1-3A G32A-A20-VD G32A-A10-VD G3PA-240B-VD G32A-A40-VD G32A-A60-VD G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD PDF

    G32A-A20-VD

    Abstract: G32A-A420 G3PA-220B-VD G32A-A10-VD G32A-A430 G3PA-210B-VD DC5-24 G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-420B-VD
    Text: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink Downsizing achieved through optimum design of heat sink. Mounting possible via screws or via DIN rail. Close mounting possible for linking terminals. (Except for G3PA-260B-VD.)


    Original
    G3PA-260B-VD. G3PA-210B-VD G3PA-220B-VD G3PA-430B-VD, G3PA-430B-VD-2 K094-E1-3B G32A-A20-VD G32A-A420 G3PA-220B-VD G32A-A10-VD G32A-A430 G3PA-210B-VD DC5-24 G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-420B-VD PDF

    J137

    Abstract: nissei capacitor nissei capacitors capacitor list nissei datasheet G32A-A20-VD G32A-A430 capacitor list nissei G3PA-220B-VD i2t graph phototriac
    Text: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. (Except for


    Original
    G3PA-260B-VD, G3PA-450B-VD-2. G3PA-210B-VD G3PA-220B-VD K094-E1-04 J137 nissei capacitor nissei capacitors capacitor list nissei datasheet G32A-A20-VD G32A-A430 capacitor list nissei G3PA-220B-VD i2t graph phototriac PDF

    miniskiip board

    Abstract: MiniSKiiP
    Text: Assembly of MiniSKiiP Heat sink Thermal paste MiniSKiiP power module Your printed circuit board Pressure part Screw 13.06.2006 11


    Original
    PDF

    G3PB-225B-2H-VD

    Abstract: G3PB525B2NVD
    Text: Solid State Contactors New Heat Sink Construction G3PB-2N/-3N Refer to Safety Precautions for All Solid State Relays. Space and working time saved with new heat sink construction. Series now includes 480-VAC models to allow use in a greater range of applications.


    Original
    480-VAC G3PB-225B-2H-VD G3PB525B2NVD PDF

    iec 62314

    Abstract: No abstract text available
    Text: Solid State Relays with Built-in Heat Sink - RSC Features • Slim design allows for compact DIN rail or panel mounting • Built-in heat sink maximizes current output capability • Epoxy-free design & improved thermal impedance • Choice of 20A, 30A and 45A models


    Original
    100k-cycle UL508 80-280V 80-260V 0-140V 800-262-IDEC iec 62314 PDF

    Untitled

    Abstract: No abstract text available
    Text: TÜV Rheinland Breakdown voltage 2,500V Slim profile SSR with heat sink mountable on DIN rail AQ-K (Breakdown voltage 4,000V) AQ-K RELAYS FEATURES APPLICATIONS 1. Combined with heat sink for vertical profile Helps to save space on control panel 2. Dielectric voltage of 2,500V or


    Original
    890inch 205inch RS485 AKT4H111100 ASCTB85E 201201-T PDF

    Untitled

    Abstract: No abstract text available
    Text: l a on i ss ion e of lut r P So Enclosures & Components Cooling elements as front or rear panel in the 19-inch technology Heat Sink Front Panels System Platforms Backplanes Enclosures & Components Cabinets Rotary Switches Da t a sheet Heat Sink Front Panels


    Original
    19-inch 81-062-xx PDF

    panasonic varistor

    Abstract: AQK1211 AQK1231 AQK2211 AQK2231
    Text: TÜV Rheinland Breakdown voltage 2,500V Slim profile with heat sink mountable on DIN rail AQ-K (Breakdown voltage 4,000V) AQ-K RELAYS FEATURES APPLICATIONS 1. Combined with heat sink for vertical profile Helps to save space on control panel 2. Dielectric voltage of 2,500V or


    Original
    RS485 890inch 205inch AKT4H111100 panasonic varistor AQK1211 AQK1231 AQK2211 AQK2231 PDF

    torque of screw for pcb

    Abstract: bga socket dowel pin SG-BGA-6074
    Text: Top View without heatsink GHz BGA Socket - Direct mount, solderless Bottom View Holes tapped in backing plate for mounting socket base (x4). 63.245mm 1.91mm 63.245mm Side View 1 Side View (exploded) 42.5mm 2mm 7 1 Heat Sink Lid: Anodized 6061 Aluminum. Single piece construction. Bottom of heat sink has


    Original
    245mm 525mm torque of screw for pcb bga socket dowel pin SG-BGA-6074 PDF

    G3PB-245B-2N/2H-VD

    Abstract: No abstract text available
    Text: Solid State Contactors New Heat Sink Construction G3PB-2N/-3N CSM_G3PB-2N_-3N_DS_E_2_1 Space and working time saved with new heat sink construction. Series now includes 480-VAC models to allow use in a greater range of applications. • A comprehensive lineup that now includes 480-VAC models.


    Original
    480-VAC G3PB-245B-2N/2H-VD PDF

    1161A1

    Abstract: No abstract text available
    Text: TAP600 Series 600 Watt Heat Sinkable Planar Ohmite’s TAP600 delivers 600 watts of reliable power to a variety of power conditioning, power transmission, and power control applications. These resistors can be designed for liquid or air cooled heat sink systems.


    Original
    TAP600 1-866-9-OHMITE 1161A1 PDF

    Untitled

    Abstract: No abstract text available
    Text: TAP600 Series 600 Watt Heat Sinkable Planar Ohmite’s TAP600 delivers 600 watts of reliable power to a variety of power conditioning, power transmission, and power control applications. These resistors can be designed for liquid or air cooled heat sink systems.


    Original
    TAP600 1-866-9-OHMITE PDF

    179D

    Abstract: SN62
    Text: Application Note for the Mounting of High Power Flange Devices When mounting High Power Flange Devices in a circuit, there are several key issues that should be taken into account. Heat Sink Design: The heat sink the device is mounted to must be designed to maintain the temperature design while it is


    Original
    179Deg 179D SN62 PDF

    G3PA-210BL-VD

    Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
    Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.


    Original
    G3PA260B-VD G3PA-450B-VD-2. K094-E1-06 G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21 PDF

    G3PA-210BL-VD

    Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
    Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.


    Original
    G3PA260B-VD G3PA-450B-VD-2. G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21 PDF

    AC line snubber 3 phase 1000 amp

    Abstract: crydom 5942 HS202 H12D2425D d2425d HS301DR-HD6025 hd4850 crydom 240 9622
    Text: 1179-2012.qxp:QuarkCatalogTempNew 9/10/12 5:02 PM Page 1179 13 Heat Sinks and Solid State Relays RoHS HS301DR-D2425 HS201DR-D2450 HS053-D53TP50D Assemblies offer the advantage of eliminating the calculations and heat sink selection during the design phase of a project,


    Original
    HS501DR-D2425 HS501DR-HD6025 HS351DR-D2425 HS351DR-HD6025 HS301DR-D2425 HS301DR-HD6025 HS271DR-D2425 HS271DR-HD6025 HS251-D2450 HS251-HD6050 AC line snubber 3 phase 1000 amp crydom 5942 HS202 H12D2425D d2425d hd4850 crydom 240 9622 PDF

    Untitled

    Abstract: No abstract text available
    Text: INSTALLATION INSTRUCTIONS KDI TYPE PPT/PPR HIGH POWER TERMINATIONS AND RESISTORS 2. MOUNTING 1. HEAT SINK REQUIREMENTS: These Devices must be mounted on a Heat Sink of sufficient thermal dissipation to control the mounting flange of the part to a maximum temperature of


    OCR Scan
    PDF