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    HERMETIC PACKAGES PCB LAND Search Results

    HERMETIC PACKAGES PCB LAND Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    HERMETIC PACKAGES PCB LAND Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    qfn 32 land pattern

    Abstract: hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782
    Text: APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. OD-323 qfn 32 land pattern hermetic packages PCB land IPC 1725 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP land pattern for TSSOP 24 pin 16 soic pcb footprint QFN-20 reflow IPC-SM-782

    SOD-323 land pattern

    Abstract: SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern
    Text: Application Note Suggested PCB Land Pattern Designs for Leaded and Leadless Packages and Detailed Surface Mount Guidelines for Leadless Packages Below are sample printed circuit board land pattern dimensions. These are based on the IPC Institute for Interconnecting and


    Original     		PDF IPC-SM-782. SoD-323 SOD-323 land pattern SOIC 8 pcb pattern land pattern for SSOP tssop 16 exposed pad stencil land pattern for TSsOP 16 LPCC-16 16 soic pcb footprint land pattern for TSSOP qfn 32 land pattern qfn 28 land pattern

    smema

    Abstract: land pattern for TSOP ultrasonic bond tensile-strength soft solder die bonding IPC-SM-780 TO metal package aluminum kovar dual beam laser land pattern for SOP material composition of chip capacitors
    Text: CHAPTER 13 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.


    Original     		PDF

    SOT333

    Abstract: SOT423 sot468 thermal compound wps II TO metal package aluminum kovar SOT439 Transistor Packages sot262 SOT443 rf transistor smd pages
    Text: Philips Semiconductors RF transmitting transistor and power amplifier fundamentals 4 RF and microwave transistor packages RF AND MICROWAVE TRANSISTOR PACKAGES handbook, halfpage The packages of electronic devices are, in general, designed to: metal cap – Protect the electronics from mechanical damage


    Original     		PDF

    IPC-SM-780

    Abstract: No abstract text available
    Text: 2 Glossary 1/17/97 11:08 AM GLOSSARY.DOC INTEL CONFIDENTIAL until publication date 2 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide(s) access to the surface of the land in one or more layers of the board.


    Original     		PDF Glossary-13 IPC-SM-780

    CERAMIC PIN GRID ARRAY wire lead frame

    Abstract: IPC-SM-780 nickel corrosion electroplating
    Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.


    Original     		PDF Glossary-11 CERAMIC PIN GRID ARRAY wire lead frame IPC-SM-780 nickel corrosion electroplating

    IPC-SM-780

    Abstract: No abstract text available
    Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.


    Original     		PDF Glossary-11 IPC-SM-780

    SAA7136E

    Abstract: saa7136 SAA7135 TO-220F JEDEC SAA7134 hso16 philips SAA7134 SAA7131E Philips SAA7130 SAA7133
    Text: PCI Digital A/V Decoders PCI DIGITAL AUDIO/VIDEO DECODERS Typenumber SAA7130H SAA7134H SAA7133H SAA7135H SAA7131E SAA7136E SAA7136HS PCI PCI PCI PCI PCI PCI PCI Description Digital Audio/Video Decoders Digital Audio/Video Decoders Digital Audio/Video Decoders


    Original     		PDF SAA7130H SAA7134H SAA7133H SAA7135H SAA7131E SAA7136E SAA7136HS OT425 LQFP128) SAA7136E saa7136 SAA7135 TO-220F JEDEC SAA7134 hso16 philips SAA7134 SAA7131E Philips SAA7130 SAA7133

    smd t2a

    Abstract: smd t2a 01 SP-T2B SP-T1A SP-T1B
    Text: SP-T Series Surface Mount Quartz Crystal Units for Low Frequencies FEATURES • Plastic mold package incorporated tubular type quartz crystal. • Suitable for automatic and high density surface mounting. • Excellent shock and heat resistance. APPLICATIONS


    Original     		PDF 768kHzd, RC-1009B) smd t2a smd t2a 01 SP-T2B SP-T1A SP-T1B

    MIL-C-26482 interchangeable KPD series

    Abstract: 16 3 PIN CIRCULAR MS CONNECTORS D SUB connector ITT Cannon veam cir 290
    Text: Interconnect Solutions Cannon, VEAM, BIW and over 20 billion interconnects Interconnect Solutions Product Portfolio Cannon, VEAM, BIW A Historical Achievement Approaching Nearly a Century of Technology Innovation THINK ITT Reliability, Engineered Solutions, and Interconnect Science these terms collectively describe ITT


    Original     		PDF

    hitachi tuffy

    Abstract: smd glass diode color codes TR1141 TF1154 smd glass zener diode color codes tuffy TF-1150 Zener diode smd marking code 5t TR-1141 medical application of ultrasonic waves
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF REJ27G0008-0400/Rev hitachi tuffy smd glass diode color codes TR1141 TF1154 smd glass zener diode color codes tuffy TF-1150 Zener diode smd marking code 5t TR-1141 medical application of ultrasonic waves

    The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes

    Abstract: No abstract text available
    Text: FEATURE ARTICLE PAGE 1 • NOVEMBER 2009 www.mpdigest.com The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes by Rick Cory, Skyworks Solutions, Inc. Introduction he incessant drive to miniaturize electronic systems places pressure on semiconductor manufacturers to offer ever-smaller components. This trend is rapidly


    Original     		PDF SMS7621-096 The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes

    gold embrittlement

    Abstract: ADXL278 application note ADXL278 ADXL78 AN-652 cte table LCC-8 LCC-8 land pattern ADXL193 IPC-SM-782
    Text: AN-652 APPLICATION NOTE One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/326-8703 • www.analog.com Considerations for Soldering Accelerometers in LCC-8 Packages onto Printed Circuit Boards By Hubert Geitner


    Original     		PDF AN-652 ADXL78/ADXL278/ADXL193 E03707 gold embrittlement ADXL278 application note ADXL278 ADXL78 AN-652 cte table LCC-8 LCC-8 land pattern ADXL193 IPC-SM-782

    PGA68

    Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
    Text: CHEMICAL CONTENT OF SEMICONDUCTOR PACKAGING SEPTEMBER 1998 Corp. Environment Strategies Corp. Package Development USE IN LIFE SUPPORT DEVICES OR SYSTEMS MUST BE EXPRESSLY AUTHORIZED STMicroelectronics PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE


    Original     		PDF GS-150T 102x51x19 GS-100T GS-R1005 PGA68 clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight

    D2863-77

    Abstract: Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208
    Text: GENERAL INFORMATION Packages INTRODUCTION P lastic surface-mount package designs were developed in the late 1970s in answer to the demand for costeffective solutions to achieving greater board density without sacriÞcing reliability or functionality. Recent developments in these


    Original     		PDF 1970s D2863-77 Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208

    Untitled

    Abstract: No abstract text available
    Text: SP-T Series Surface Mount Quartz Crystal Units for Low Frequencies New FEATURES • Low height 2.0mm max. • Plastic mold package incorporated tubular type quartz crystal. • Suitable for automatic and high density surface mounting. • Excellent shock and heat resistance.


    Original     		PDF RC-1009B)

    DIP-16L

    Abstract: BD429B
    Text: Device Engineering Incorporated BD429/BD429A/BD429B/BD429C ARINC 429/RS-422 Line Driver 385 E. Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: [email protected] Integrated Circuit Features: • ARINC 429 Line Driver for HI speed (100 kHz) and LOW speed (12.5 kHz) data rates


    Original     		PDF BD429/BD429A/BD429B/BD429C 429/RS-422 RS-422 125mW DS-MW-00429-01 DIP-16L BD429B

    land pattern for TSOP 2 86 PIN

    Abstract: land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern ic packages TSOP 66 pin Package thermal resistance SOJ 44 PCB land ED730
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS This document is Chapter 1 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1. PACKAGE CLASSIFICATIONS


    Original     		PDF

    dei0429-wms

    Abstract: BD429A-G BD429A DEI0429-NES DEI0429-WMB BD429 MS-018-AB ARINC429 BD429B-G 5V RS422
    Text: Device Engineering Incorporated BD429/BD429A/BD429B/BD429C ARINC 429/RS-422 Line Driver 385 E. Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: [email protected] Integrated Circuit Features: • ARINC 429 Line Driver for HI speed (100 kHz) and LOW speed (12.5 kHz) data rates


    Original     		PDF BD429/BD429A/BD429B/BD429C 429/RS-422 RS-422 125mW DS-MW-00429-01 dei0429-wms BD429A-G BD429A DEI0429-NES DEI0429-WMB BD429 MS-018-AB ARINC429 BD429B-G 5V RS422

    DEI0429

    Abstract: DEI0429-WMB BD429A-G BD429B DEI0429-NMS DEI0429-NES BD429 MS-030-AC BD429-G ARINC
    Text: Device Engineering Incorporated BD429/BD429A/BD429B/DEI0429 ARINC 429/RS-422 Line Driver 385 E. Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: [email protected] Integrated Circuit Features: • ARINC 429 Line Driver for HI speed (100 kHz) and LOW speed (12.5 kHz) data rates


    Original     		PDF BD429/BD429A/BD429B/DEI0429 429/RS-422 RS-422 125mW DS-MW-00429-01 DEI0429 DEI0429-WMB BD429A-G BD429B DEI0429-NMS DEI0429-NES BD429 MS-030-AC BD429-G ARINC

    BD429A

    Abstract: No abstract text available
    Text: Device Engineering Incorporated BD429/BD429A/BD429B/BD429C ARINC 429/RS-422 Line Driver 385 E. Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: [email protected] Integrated Circuit Features: • ARINC 429 Line Driver for HI speed (100 kHz) and LOW speed (12.5 kHz) data rates


    Original     		PDF BD429/BD429A/BD429B/BD429C 429/RS-422 RS-422 125mW DS-MW-00429-01 BD429A

    BD429A

    Abstract: ARINC 739 BD429A1 hermetic packages PCB land DEI0429-NES dei0429-wmb DEI-0429-WMB dei0429-wms 125KB BD429-G
    Text: Device Engineering Incorporated BD429/BD429A/BD429B/BD429C ARINC 429/RS-422 Line Driver 385 E. Alamo Drive Chandler, AZ 85225 Phone: 480 303-0822 Fax: (480) 303-0824 E-mail: [email protected] Integrated Circuit Features: • ARINC 429 Line Driver for HI speed (100 kHz) and LOW speed (12.5 kHz) data rates


    Original     		PDF BD429/BD429A/BD429B/BD429C 429/RS-422 RS-422 125mW DS-MW-00429-01 BD429A ARINC 739 BD429A1 hermetic packages PCB land DEI0429-NES dei0429-wmb DEI-0429-WMB dei0429-wms 125KB BD429-G

    w2 mark 5 pin mosfet smd

    Abstract: Philips SC07 Small-signal Transistors transistor bf 175
    Text: For an update of this information, please go to the package website. SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii


    Original     		PDF

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm