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    HOLE-VIA-20R10 Search Results

    HOLE-VIA-20R10 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163K Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Through hole type / HDIP30 Visit Toshiba Electronic Devices & Storage Corporation
    77313-120R10LF Amphenol Communications Solutions BergStikĀ®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions Visit Amphenol Communications Solutions
    75844-120R10LF Amphenol Communications Solutions BergStikĀ®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    950602CGLFT Renesas Electronics Corporation VIA Mobile PL133T and PLE133T Chipsets. Visit Renesas Electronics Corporation