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    IC TRAY Search Results

    IC TRAY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    74HC4051FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    7UL1G07FU Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Non-Inverter Buffer (Open Drain), USV, -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
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    IC TRAY Price and Stock

    Microchip Technology Inc WINCS02IC-TRAY

    Wi-Fi IC with PIC32MZ SOC, flash is EON 16Mb(YW00Q), VQFN, Projected EOL: 2049-06-22
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Microchip Technology Inc WINCS02IC-TRAY Tray 5 Weeks
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Buy Now

    Same Sky CEM-1205-IC

    12 mm, 5 Vdc, 92 dB, Through Hole, Driving Circuit, Magnetic Audio Indicator Buzzer
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Onlinecomponents.com CEM-1205-IC
    • 1 -
    • 10 -
    • 100 $1.391
    • 1000 $1.005
    • 10000 $0.965
    		Buy Now

    IC TRAY Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    OBGA

    Abstract: No abstract text available
    Text: iC-LSB, iC-LSC oBGA LS2C PHOTOSENSOR PACKAGE SPECIFICATION Rev B1, Page 1/5 ORDERING INFORMATION Type Package Options Order Designation iC-LSB oBGA LS2C glass lid iC-LSB oBGA LS2C iC-LSB oBGA LS2C reticle iC-LSB oBGA LS2C-LSxR iC-LSC oBGA LS2C glass lid iC-LSC oBGA LS2C


    Original     		PDF

    OF2RZ

    Abstract: No abstract text available
    Text: iC-OF BLCC OF3C PACKAGE SPECIFICATION Rev C2, Page 1/4 ORDERING INFORMATION Type Package Options Order Designation iC-OF BLCC OF3C none iC-OF BLCC OF3C iC-OF BLCC OF3C reticle iC-OF BLCC OF3C OF2RZ iC-OF BLCC OF3C-ET iC-OF BLCC OF3C-ET reticle Code Disc 1024 PPR, 18 mm


    Original     		PDF

    1895 ic

    Abstract: tfp 370 TFP-32D 2620D 40DA IC 404
    Text: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed


    Original     		PDF TTP-48D CP-32D CP-32DB CP-40D CP-40DA CP-42D CP-44D TTP-28/24D TTP-28D TTP-28DA 1895 ic tfp 370 TFP-32D 2620D 40DA IC 404

    OBGA

    Abstract: iC-Haus OF4C analog devices bottom mark
    Text: iC-OF oBGA OF4C PACKAGE SPECIFICATION Rev C1, Page 1/4 ORDERING INFORMATION Type Package Options Order Designation iC-OF optoBGATM OF4C none leaded balls built-in reticle iC-OF oBGA OF4C iC-OF oBGA OF4C-1 iC-OF oBGA OF4C-OF2RY optoBGATM OF4C 5.4 mm x 4.2 mm


    Original     		PDF

    diode wg

    Abstract: 9958 MMA6
    Text: iC-WG BLCC WGC OPTO ENCODER PACKAGE SPECIFICATION Rev E1, Page 1/5 ORDERING INFORMATION Type Package Options Order Designation iC-WG BLCC WGC Glass Lid iC-WG BLCC WGC-WG1L iC-WG BLCC WGC iC-WG BLCC WGC-WG1R Code Disc 13bit-Gray +2048 PPR A/B, d 44mm - reticle


    Original     		PDF 13bit-Gray diode wg 9958 MMA6

    Untitled

    Abstract: No abstract text available
    Text: AnaSem Analog Semiconductor IC A7B Series Single-cell Li-ion / Li-polymer Battery Protection IC Rev. E09-06 AnaSem Inc. . Future of the analog world Rev. E09-06 AnaSem Products Data Sheet Analog Semiconductor IC Single-cell Li-ion / Li-polymer Battery Protection IC


    Original     		PDF E09-06

    corrugated carton

    Abstract: FP-32D package IC Packing and Labelling Specification
    Text: Packing Specifications Contents 1. Forms of Package Packing 2. Moistureproof Packing 3. Taping for IC 4. Taping for IC Memorys Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using


    Original     		PDF TTP-28/24D TTP-28DR TTP-28DA TTP-44/40DA TTP-44/40DAR TTP-44D TTP-44DB TTP-44DBR TTP-44DE TTP-32D corrugated carton FP-32D package IC Packing and Labelling Specification

    Untitled

    Abstract: No abstract text available
    Text: CD-LDE033-0510 T-1437 SMT14mm-width type <IC drive type> Features ・Slim, low-profile design 7.5mm max. and high power. ・Supports reflow soldering. (Supports Pb free soldering) ・Supports automatic mounting. (Tray type) ・High efficiency possible by using separate excitation IC.


    Original     		PDF CDLDE0330510 T-1437 SMT14mm-width 42inches) AC60Hz) CD-T-1437

    Untitled

    Abstract: No abstract text available
    Text: CD-LDE049-0510 T-1437B SMT14mm-width type <IC drive type> Features ・Slim, low-profile design 7.5mm max. and high power. ・Supports reflow soldering. (Supports Pb free soldering) ・Supports automatic mounting. (Tray type) ・High efficiency possible by using separate excitation IC.


    Original     		PDF CDLDE0490510 T-1437B SMT14mm-width AC60Hz) CD-T-1437B 20mfloating

    Untitled

    Abstract: No abstract text available
    Text: CD-LDE041-0510 T-1034A SMT10mm-width type <IC drive type> Features ･Slim, low-profile design 5.8mm max. and high power. ･Supports reflow soldering. (Supports Pb free soldering) ･Supports automatic mounting. (Tray type) ･High efficiency possible by using separate excitation IC.


    Original     		PDF CDLDE0410510 T-1034A SMT10mm-width 23inches) AC60Hz) CD-T-1034A 10MAX

    1232B

    Abstract: No abstract text available
    Text: CD-LDE031-0510 T-1232B SMT12mm-width type <IC drive type> Features ・Slim, low-profile design 7.5mm max. and high power. ・Supports reflow soldering. (Supports Pb free soldering) ・Supports automatic mounting. (Tray type) ・High efficiency possible by using separate excitation IC.


    Original     		PDF CDLDE0310510 T-1232B SMT12mm-width 32inches) AC60Hz) CD-T-1232B 1232B

    Untitled

    Abstract: No abstract text available
    Text: CD-LDE023-0510 T-0936 SMT9mm-width type <IC drive type> Features ･Slim, low-profile design 3.8mm max. and high power. ･Supports reflow soldering. (Supports Pb free soldering) ･Supports automatic mounting. (Tray type) ･High efficiency possible by using separate excitation IC.


    Original     		PDF CDLDE0230510 T-0936 14inches) AC60Hz) CD-T-0936

    Untitled

    Abstract: No abstract text available
    Text: CD-LDE037-0510 T-0940 SMT9mm-width type <IC drive type> Features ･Slim, low-profile design 4.0mm max. and high power. ･Supports reflow soldering. (Supports Pb free soldering) ･Supports automatic mounting. (Tray type) ･High efficiency possible by using separate excitation IC.


    Original     		PDF CDLDE0370510 T-0940 17inches) AC60Hz) CD-T-0940

    Untitled

    Abstract: No abstract text available
    Text: CD-LDE027-5010 T-1033A SMT10mm-width type <IC drive type> Features ･Slim, low-profile design 4.7mm max. and high power. ･Supports reflow soldering. (Supports Pb free soldering) ･Supports automatic mounting. (Tray type) ･High efficiency possible by using separate excitation IC.


    Original     		PDF CD-LDE027-5010 T-1033A SMT10mm-width 17inches) AC60Hz) CD-T-1033A 10MAX

    21-inches

    Abstract: No abstract text available
    Text: CD-LDE039-0510 T-1034 SMT10mm-width type <IC drive type> Features ･Slim, low-profile design 4.7mm max. and high power. ･Supports reflow soldering. (Supports Pb free soldering) ･Supports automatic mounting. (Tray type) ･High efficiency possible by using separate excitation IC.


    Original     		PDF CDLDE0390510 T-1034 SMT10mm-width 21inches) AC60Hz) CD-T-1034 10MAX 21-inches

    1432

    Abstract: No abstract text available
    Text: CD-LDE032-0510 T-1432 SMT14mm-width type <IC drive type> Features ・Slim, low-profile design 7.5mm max. and high power. ・Supports reflow soldering. (Supports Pb free soldering) ・Supports automatic mounting. (Tray type) ・High efficiency possible by using separate excitation IC.


    Original     		PDF CDLDE0320510 T-1432 SMT14mm-width 32inches) AC60Hz) CD-T-1432 1432

    ic socket DIP

    Abstract: ic base for 40 pin DIP ic
    Text: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN SEALED TYPE Compliance with RoHS Directive ROUND PIN TYPE SEALED IC SOCKETS (AXS1) FEATURES CONSTRUCTION 1. Sealed IC sockets compatible with ultrasonic cleaning (30 seconds), 3-bath cleaning (boiling, ultrasonic,


    Original     		PDF

    ramp generator 555

    Abstract: Bluetooth RSSI circuit diagram
    Text: T2901 Bluetooth Single-chip Transceiver IC Description The T2901 is a bipolar IC manufactured using Atmel Wireless & Microcontrollers’ advanced UHF process. This IC includes a transceiver for the 2.45 GHz ISM band especially for Bluetooth applications. Features


    Original     		PDF T2901 T2901 HP-VQFP-N48 D-74025 14-Sep-00 ramp generator 555 Bluetooth RSSI circuit diagram

    ic type diagram

    Abstract: 32 QFP PACKAGE thermal resistance marking mitsubishi TSOP 32 thermal resistance QFP PACKAGE thermal resistance TSOP 62 Package ic package LIST OF Serial IC BGA and QFP Package mounting mitsubishi marking
    Text: IC Package Table of Contents 1. GUIDANCE 2. DETAILED DIAGRAM OF PACKAGE OUTLINES 3. PACKAGING FOR SHIPMENT 4. MOUNTING TECHNOLOGY 5. REFERENCE MATERIAL MITSUBISHI ELECTRIC CORPORATION IC Package 1. GUIDANCE 1. FUNCTIONAL REQUIREMENTS 2. IC PACKAGE CLASSIFICATION


    Original     		PDF

    tfp 370

    Abstract: No abstract text available
    Text: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed


    OCR Scan     		PDF TFP-32D TFP-32DR TTP-32D TTP-32DR TTP-32DB TTP-50/44DC TTP-50D TTP-50DA TTP-28/24D TTP-28D tfp 370

    IC 404

    Abstract: No abstract text available
    Text: Packing Specifications 1. Forms of Package Packing The forms of IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed


    OCR Scan     		PDF TFP-32D TFP-32DR TTP-32D TTP-32DR TTP-32DB TTP-50/44DC TTP-50D TTP-50DA TTP-28/24D TTP-28D IC 404

    Untitled

    Abstract: No abstract text available
    Text: Packing Specifications 1. Forms of Package Packing The forms o f IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there are magazines, trays, or a tape, with the IC being housed inside. In the unsealed


    OCR Scan     		PDF

    TSOP II 44 REEL

    Abstract: CP-20DA
    Text: Packing Specifications 1. Forms of Package Packing The forms o f IC delivery include, as shown below, leaving the IC unsealed in a packing box and using an inside box in which there is a magazine, a tray, or tape, with the IC being housed inside. In the unsealed mode, the order o f operations should be


    OCR Scan     		PDF CP-32D CP-40D CP-44 CP-52 CP-68 CP-84 TFP-20DA TFP-20DAR TFP-32D TFP-32DR TSOP II 44 REEL CP-20DA

    Untitled

    Abstract: No abstract text available
    Text: THE INFORMATION CONTAINED HEREIN IS CONSIDERED 'PROPRIETARY' TO BEL FUSE INC. AND SHALL NOT BE COPIED, REPRODUCED DR DISCLOSED WITHOUT THE WRITTEN APPROVE DF BEL FUSE INC. SCHEMATIC ELECTRICAL TURNS CH ARAC TERISTICS R A T IO IC T IC T IC T IC T TP1 TP2 TP3


    OCR Scan     		PDF 100MHz 100MHz f/80M z-40M 40MHz-L0QMHz 020B2Ã