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    Infineon Technologies AG IGC114T170S8RMX1SA2

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC114T170S8RMX1SA)
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    Avnet Americas IGC114T170S8RMX1SA2 Waffle Pack 2,025
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    IGC114T170S8RM Datasheets Context Search

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    soft solder die bonding

    Abstract: No abstract text available
    Text: IGC114T170S8RM IGBT3 Power Chip Features: • 1700V Trench + Field stop technology • low switching losses • soft turn off • positive temperature coefficient • easy paralleling Chip Type VCE IC IGC114T170S8RM 1700V 100A This chip is used for: • power modules


    Original     		IGC114T170S8RM IGC114T170S8RM L7783O, soft solder die bonding PDF

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    Abstract: No abstract text available
    Text: IGC114T170S8RM IGBT3 Power Chip Features: • 1700V Trench + Field stop technology  low switching losses  soft turn off  positive temperature coefficient  easy paralleling Chip Type VCE IC IGC114T170S8RM 1700V 100A This chip is used for:  power modules


    Original     		IGC114T170S8RM IGC114T170S8RM L7783O, L7783T, L7783E, PDF