Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    INTEL CPGA WITH 296 PINS Search Results

    INTEL CPGA WITH 296 PINS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TMPM4GQF15FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4GRF20FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP176-2020-0.40-002 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4KMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4MMFWAFG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP80-1212-0.50-003 Visit Toshiba Electronic Devices & Storage Corporation
    TMPM4NQF10FG Toshiba Electronic Devices & Storage Corporation Arm Cortex-M4 processor with FPU Core Based Microcontroller/32bit/P-LQFP144-2020-0.50-002 Visit Toshiba Electronic Devices & Storage Corporation

    INTEL CPGA WITH 296 PINS Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    88 lead cpga

    Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
    Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING PDF

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


    Original     		PDF

    ppga package

    Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    outline of the heat slug for JEDEC

    Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
    Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and


    Original     		PDF

    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


    Original     		PDF

    Robinson Nugent pga

    Abstract: burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging April 1996 Order Number: 243103-001 7/1/96 9:08 AM 243103_1.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Robinson Nugent pga burndy die set specifications Intel CPGA with 296 pins AP-577 thermalcote Matthey PEAK tray drawing cpga dimensions QUAD Video Processor 208 pin ap Evox Rifa PDF

    Matthey

    Abstract: sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging June 1997 Order Number: 243103-004 6/12/97 10:21 AM 24310304.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, Matthey sanyodenki driver Sanyo Denki cooler AP-577 burndy diode MARKING CODE 917 Evox Rifa sanyo denki stepping PEAK tray drawing QUAD Video Processor 208 pin ap PDF

    tucker

    Abstract: CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1
    Text: E AP-577 APPLICATION NOTE An Introduction to Plastic Pin Grid Array PPGA Packaging November 1996 Order Number: 243103-002 11/27/96 12:40 PM 24310302.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or


    Original     		AP-577 Box5200, tucker CPGA AP-577 intel DOC CPGA large cavity ppga package Robinson Nugent pga QUAD Video Processor 208 pin ap 296-Pin Socket1 PDF

    kic 125

    Abstract: ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES
    Text: 2 4 Performance Characteristics of IC Packages 1/22/97 10:05 AM CH04WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES 4.1. IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages:


    Original     		CH04WIP kic 125 ic KA 2645 C 6090 Side Brazed Ceramic Dual-In-Line Packages thermal analysis on pcb Coffin-Manson Equation AL Cu tungsten slug glass diode Braze Dual-In-Line 16 Packages cte table for epoxy adhesive and substrate PERFORMANCE CHARACTERISTICS OF IC PACKAGES PDF

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


    Original     		PDF

    Ablebond 71-1

    Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
    Text: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages  DC resistance R of leads or pins  Capacitance (C) including lead-to-lead and loading capacitances  Inductance (L) including only self-inductance values for pins traces and wires (PGA) or


    Original     		93-WA-EEP-6 91-WA-EEP-27 91-WA-EEP-31 pp1059-1070 pp357-366 Ablebond 71-1 Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board PDF

    ix 2933

    Abstract: transistor quang 7400 TTL ix 2933 data sheet schematic XOR Gates 7400 chip 7400 series pin connection CF160 schematic diagram inverter PF100
    Text: QuickWorks User's Guide with SpDE™ Reference June 1996 Copyright Information Copyright 1991-1996 QuickLogic Corporation. All rights reserved. The information contained in this manual and the accompanying software program are protected by copyright; all rights are reserved by QuickLogic Corporation.


    Original     		Win32s, ix 2933 transistor quang 7400 TTL ix 2933 data sheet schematic XOR Gates 7400 chip 7400 series pin connection CF160 schematic diagram inverter PF100 PDF

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays PDF

    Phoenix BIOS manual f.34

    Abstract: Phoenix BIOS f.34 manual dSMC Phoenix BIOS user manual f.34 acadia Cyrix 486 Cyrix 6x86mx 243192 diode T35 12H stamford voltage regulator
    Text: Preliminary Information 2 PROCESSOR Data Sheet Preliminary Information September 1998 IDT WINCHIP 2TM PROCESSOR DATA SHEET This is Version 1.0 of the IDT WinChip 2 Processor data sheet. The latest versions of this data sheet may be obtained from www.winchip.com


    Original     		PDF

    dSMC

    Abstract: Cyrix 6x86mx AA-01 AK-02 243190 acadia diode T35 12H intel 486 dx processor data sheet AMD K6 marking code t1a
    Text: Preliminary Information idt C6 TM Processor Data Sheet Preliminary Information March 1998 IDT WINCHIP TM C6TM PROCESSOR DATA BOOK This is Version 1.10 of the IDT WinChip C6 processor datasheet. The latest versions of this datasheet may be obtained from www.winchip.com


    Original     		PDF

    dSMC

    Abstract: WinChip-2 Phoenix BIOS manual f.34 cyrix Cyrix 6x86mx AK-02 diode T35 12H P54C P55C TR12
    Text: Preliminary Information PROCESSOR Data Sheet Preliminary Information April 1999 IDT WINCHIPTM 3 PROCESSOR DATA SHEET This is Version 0.9 of the IDT WinChip 3 Processor data sheet. The latest versions of this data sheet may be obtained from www.winchip.com


    Original     		PDF

    Phoenix BIOS manual f.34

    Abstract: dSMC Intel Processor Identification and the CPUID intel date code format bga t95 cyrix 486 ibm 6X86MX Cyrix 6x86mx MII Processor basic architecture of Pentium Processors IDT CROSS
    Text: Preliminary Information PROCESSOR Data Sheet for WinChip 2 version B Preliminary Information April 1999 IDT WINCHIP 2BTM PROCESSOR DATA SHEET This is Version 0.9 of the IDT WinChip 2 version B Processor data sheet. The latest versions of this data sheet may be obtained from


    Original     		PDF

    30-pin simm memory

    Abstract: award 586 30 pin simm memory ALI m5123 usb Mouse mitsumi 430VX SK084 P54C M5123 A1 npnx dimm
    Text: Table of Contents Chapter 1 Introduction of IT5 Series Features ¬ l l Layout


    Original     		PDF

    W25P010AF

    Abstract: SY033 mitsumi floppy seagate hard drive CIRCUIT diagram P54C SU071 7" mainboard circuit diagram SY037 Cyrix 6x86mx ibm 6X86MX
    Text: Foreword Foreword Thank you for purchasing the AB-PX5/AX5/TX5 as the heart of your computer’s system. We hope this instruction booklet will enable you to install PX5/AX5/TX5 in your system safely and without any errors. Although you may be familiar with some of the concepts we


    Original     		430TX W25P010AF SY033 mitsumi floppy seagate hard drive CIRCUIT diagram P54C SU071 7" mainboard circuit diagram SY037 Cyrix 6x86mx ibm 6X86MX PDF

    Intel 1702 eprom

    Abstract: 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28
    Text: 2 2 Package/Module/PC Card Outlines and Dimensions 1/20/97 6:33 PM CH02LINK.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 2 PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369-1 2-1 1/20/97 6:33 PM CH02LINK.DOC


    Original     		CH02LINK Intel 1702 eprom 231369 INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE Side Brazed Ceramic Dual-In-Line Packages PACKAGE/MODULE/PC CARD OUTLINES AND DIMENSIONS 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC PIN GRID ARRAY CPGA lead frame 325 Intel 2164 Side Brazed Ceramic Dual-In-Line Packages 28 PDF

    AMD K6

    Abstract: No abstract text available
    Text: Preliminary Information AMD-K6 -2E+ Embedded Processor Data Sheet Publication # 23542 Rev: A Amendment/0 Issue Date: September 2000 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro


    Original     		3542A/0â AMD K6 PDF

    CR04

    Abstract: RISC86 TR12 TR123 AK-02 AMD-K6-III amd-k6-2 350auz amd-k6-2e 500 desktop intel cpu
    Text: Preliminary Information AMD-K6 -2E+ Embedded Processor Data Sheet Publication # 23542 Rev: A Amendment/0 Issue Date: September 2000 2000 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced Micro


    Original     		3542A/0--September CR04 RISC86 TR12 TR123 AK-02 AMD-K6-III amd-k6-2 350auz amd-k6-2e 500 desktop intel cpu PDF

    Untitled

    Abstract: No abstract text available
    Text: Programmable Peripheral PSD302 Programmable Microcontroller Peripheral with Memory Preliminary Key Features □ □ Single Chip Programmable Peripheral for Microcontroller-based Applications 19 Individually Configurable I/O pins that can be used as — Microcontroller I/O port expansion


    OCR Scan     		PSD302 52-pin MIL-STD-883C PDF

    PSD302-20XMB

    Abstract: PSD302-12J microcontroller based missile tracking microcontroller based missile tracking systems p2231 SC80C451 PSD302-15LI PSD302-15JI
    Text: Programmable Peripheral PSD302 Programmable Microcontroller Peripheral with Memory Preliminary Key Features J Single Chip Programmable Peripheral for Microcontroller-based Applications U 19 Individually Configurable I/O pins that can be used as i j 512 Kbits of UV EPROM


    OCR Scan     		PSD302 44-pin 52-pin PSD302-20XMB PSD302-12J microcontroller based missile tracking microcontroller based missile tracking systems p2231 SC80C451 PSD302-15LI PSD302-15JI PDF