INTEL TRAY MECHANICAL DRAWINGS Search Results

INTEL TRAY MECHANICAL DRAWINGS Result Highlights (5)

Part	Manufacturer	Description
EN80C188XL-12	Rochester Electronics LLC	80C188XL - MPU Intel 186 CISC 16-Bit
EN80C188XL-20	Rochester Electronics LLC	80C188XL - MPU Intel 186 CISC 16-Bit
MD82C288-10/R	Rochester Electronics LLC	Replacement for Intel part number MD82C288-10. Buy from authorized manufacturer Rochester Electronics.
MD87C51/BQA	Rochester Electronics LLC	Replacement for Intel part number 5962-8768401QA. Buy from authorized manufacturer Rochester Electronics.
MG87C196KC/B	Rochester Electronics LLC	Replacement for Intel part number MG87C196KC. Buy from authorized manufacturer Rochester Electronics.

INTEL TRAY MECHANICAL DRAWINGS Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
ATMEL 220 24C16 Abstract: datasheet for atmel 416 24c16 an 24C16 pinout detail IPMB PICMG 2 11 R1 0 CompactPCI Power Interface IPMB Address AT24C16 ZT 7102 intel tray mechanical drawings carrier fru information Text: Intel NetStructureTM ZT 7102 Chassis Management Module Design Guide September 2002 Order Number: 273774-001 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN	Original	PDF
PQFP 132 PACKAGE DIMENSION intel Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING Text: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on	Original	PDF
88 lead cpga Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING Text: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on	Original	PDF	CH13WIP 88 lead cpga JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
L358 Abstract: 80523PY400512PE L357 q738 Text: Product Change Notification Please respond your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth	Original	PDF	50-Unit L358 80523PY400512PE L357 q738
processor Mobile Intel Pentium 4 socket 478 Abstract: 512484799 Text: Processor and IC Sockets Micro PGA Sockets. J-2 to J-3 Visit www.molex.com to access more part numbers and product information,	Original	PDF	PS-51248-005 PS-51248-020 Area--10m" processor Mobile Intel Pentium 4 socket 478 512484799
MIL-STD-81705 Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273 Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes	Original	PDF
JEDEC TRAY DIMENSIONS Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are	Original	PDF
MQFP Shipping Trays Abstract: TSOP32 Package 28F320B3 bga Shipping Trays D 2498 MIL-STD-81705 tray datasheet bga transport media and packing peak tray transistor databook Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are	Original	PDF
outline of the heat slug for JEDEC Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and	Original	PDF
SECC material Abstract: 80523PY350512PE L356 q558 Text: Change Notification #: 685 Change Title: Pentium II Processor on 0.25µ Packaging and Cover-mark Conversion 350 MHz dB0 PLGA Date of PCN Publication: September 16, 1998 Type of Change Notification: Addendum to Previous Form-Fit-Function Notification Key Characteristics of the Change:	Original	PDF
sop package tray Abstract: 29754* intel weight of SOP package SOP JEDEC tray Text: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.	Original	PDF
ppga package Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and	Original	PDF
A7647 Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package	Original	PDF
CBG064-052A Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability	Original	PDF

ic 6116 datasheet from texas instruments Abstract: intel date code marking 28f160 SMT pitch roadmap intel 6116 uBGA device MARKing intel intel 04195 intel 28f160 SMT roadmap 28f800 56 pin csp process flow diagram Text: D Comprehensive User’s Guide for µBGA* Packages 1998 NOTE: For the most current µBGA* package related information, please refer to Intel's Website at http://www.intel.com/design/flcomp/packdata Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any	Original	PDF
transistor d525 Abstract: transistor D525 equivalent FCBGA559 PBGA437 SLB73 intel i5 MOTHERBOARD pcb CIRCUIT diagram SLBXC D525 AU80610006237AA SLBX9 NM10 Express Chipset N475 SLBX5 Text: Intel Atom Processor 230∆ Series Datasheet April 2010 Document Number: 319977-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT	Original	PDF	i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. 07-Sep-2011 transistor d525 transistor D525 equivalent FCBGA559 PBGA437 SLB73 intel i5 MOTHERBOARD pcb CIRCUIT diagram SLBXC D525 AU80610006237AA SLBX9 NM10 Express Chipset N475 SLBX5
T2300 intel Abstract: PPGA478 intel 945 motherboard 945 chip intel motherboard intel core solo overview product LE80538UE0092M ICH7M-DH INTEL 945 FAMILY express chipset T2700 LE80539LF0282M Text: Intel Core Duo Processor and Intel® Core™ Solo Processor on 65 nm Process Datasheet January 2007 Document Number: 309221-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR	Original	PDF	ts/27247/Intel-Core-Solo-Processor-U1400- 06-Sep-2011 U1400 i7-2630QM/i7-2635QM, i7-2670QM/i72675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. T2300 intel PPGA478 intel 945 motherboard 945 chip intel motherboard intel core solo overview product LE80538UE0092M ICH7M-DH INTEL 945 FAMILY express chipset T2700 LE80539LF0282M
intel 2102 Static RAM Abstract: AF000047 50-pin lcd connector pinout sata hot plug CIRCUIT diagram 50-pin ATAPI dimensions hot swap connectors SR2500AL lsi 7622 r1 SR2500 pcie riser Text: Intel Server Chassis SR2500 Intel® Server System SR2500AL Technical Product Specification Intel order number D31980-004 Revision – 1.00 June 2006 Enterprise Platforms and Services Division - Marketing Revision History Intel® Server System SR2500AL Revision History	Original	PDF	SR2500 SR2500AL D31980-004 S5000PAL SR2500 intel 2102 Static RAM AF000047 50-pin lcd connector pinout sata hot plug CIRCUIT diagram 50-pin ATAPI dimensions hot swap connectors SR2500AL lsi 7622 r1 pcie riser
pcie X1 edge Abstract: PCIE peg footprint pcie x16 right angle connector Text: www.erni.com www.erni.com Catalog E XXXXXX 09/08 Edition 1 PCI Express Right Angle Connector System Table of Contents General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2	Original	PDF	23230/USA pcie X1 edge PCIE peg footprint pcie x16 right angle connector
Untitled Abstract: No abstract text available Text: PCI Express Right Angle Connector System www.erni.com Catalog E XXXXXX 09/08 Edition 1 www.erni.com Catalog E XXXXXX 09/08 Edition 1 PCI Express Right Angle Connector System Table of Contents General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2	Original	PDF	23230/USA
PPGA478 Abstract: sl6pc manual 865gv motherboard intel 845GL users manual RK80532PE072512 SL6PF figure intel pentium 4 processor input 777 socket fcpga pentium m ppga478 845 intel chipset motherboard circuit 478 SOCKET Text: Intel Pentium® 4 Processor with 512-KB L2 Cache on 0.13 Micron Process and Intel® Pentium® 4 Processor Extreme Edition Supporting Hyper-Threading Technology1 Datasheet 2 GHz – 3.40 GHz Frequencies Supporting Hyper-Threading Technology1 at 3.06 GHz with 533 MHz System Bus and All	Original	PDF	512-KB roducts/27447/Intel-Pentium-4-Processor-2 80-GHz-512K-Cache-. 21-Sep-2011 PPGA478 sl6pc manual 865gv motherboard intel 845GL users manual RK80532PE072512 SL6PF figure intel pentium 4 processor input 777 socket fcpga pentium m ppga478 845 intel chipset motherboard circuit 478 SOCKET
E4400 Abstract: E6750 12V FAN CONTROL BY USING THERMISTOR E6600 Intel E4400 Intel Core 2 Duo E6750 Intel Core 2 Duo Processor E4500 e4300 LGA 2011 cooler intel i5 MOTHERBOARD pcb CIRCUIT diagram Text: Intel Core 2 Extreme Processor X6800Δ and Intel® Core™2 Duo Desktop Processor E6000Δ and E4000Δ Sequences Datasheet —on 65 nm Process in the 775-land LGA Package and supporting Intel® 64 Architecture and supporting Intel® Virtualization Technology±	Original	PDF	X6800 E6000 E4000 775-land 72630QM 72635QM 72670QM 72675QM 52430M 52435M E4400 E6750 12V FAN CONTROL BY USING THERMISTOR E6600 Intel E4400 Intel Core 2 Duo E6750 Intel Core 2 Duo Processor E4500 e4300 LGA 2011 cooler intel i5 MOTHERBOARD pcb CIRCUIT diagram
82801gb Abstract: Intel 82801GB ich7 82801GB circuit 945G MOTHERBOARD CIRCUIT diagram 945p 82801gr 82801HH 82801HB intel 915gl Text: Intel Pentium® 4 Processors 570/571, 560/561, 550/551, 540/541, 530/531 and 520/521∆ Supporting Hyper-Threading Technology1 Datasheet On 90 nm Process in 775-land LGA Package and supporting Intel® Extended Memory 64 TechnologyΦ May 2005 Document Number: 302351-004	Original	PDF	775-land i7-2630QM/i7-2635QM, i7-2670QM/i72675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. entium-4-Processor-530J-supporting-HT-Tec 05-Sep-2011 82801gb Intel 82801GB ich7 82801GB circuit 945G MOTHERBOARD CIRCUIT diagram 945p 82801gr 82801HH 82801HB intel 915gl
PPGA478 Abstract: X7800 82801hbm ICH8M intel 965 motherboard circuit diagram 82801HBM Intel BGA U770 U7700 intel core i5-2430m U7600 Text: Intel Core 2 Duo Processors and Intel® Core™2 Extreme Processors for Platforms Based on Mobile Intel® 965 Express Chipset Family Datasheet January 2008 Document Number: 316745-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR	Original	PDF	i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. 12-Sep-2011 PPGA478 X7800 82801hbm ICH8M intel 965 motherboard circuit diagram 82801HBM Intel BGA U770 U7700 intel core i5-2430m U7600

Privacy Settings

INTEL TRAY MECHANICAL DRAWINGS Search Results

INTEL TRAY MECHANICAL DRAWINGS Result Highlights (5)

INTEL TRAY MECHANICAL DRAWINGS Datasheets Context Search

ATMEL 220 24C16

PQFP 132 PACKAGE DIMENSION intel

88 lead cpga

L358

processor Mobile Intel Pentium 4 socket 478

MIL-STD-81705

JEDEC TRAY DIMENSIONS

MQFP Shipping Trays

outline of the heat slug for JEDEC

SECC material

sop package tray

ppga package

A7647

CBG064-052A

ic 6116 datasheet from texas instruments

transistor d525

T2300 intel

intel 2102 Static RAM

pcie X1 edge

Untitled

PPGA478

E4400

82801gb

PPGA478