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    J64 PACKAGE Search Results

    J64 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    J64 PACKAGE Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    J64 Package Cypress Semiconductor Plastic Leaded Chip Carriers Original PDF

    J64 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    85003

    Abstract: J64 Package
    Text: Package Diagram Plastic Leaded Chip Carriers 20-Lead Plastic Leaded Chip Carrier J61 51-85000-A 28-Lead Plastic Leaded Chip Carrier J64 51-85001-A 1 Package Diagram 32-Lead Plastic Leaded Chip Carrier J65 51-85002-B 44-Lead Plastic Leaded Chip Carrier J67


    Original     		20-Lead 1-85000-A 28-Lead 1-85001-A 32-Lead 51-85002-B 44-Lead 1-85003-A 52-Lead 1-85004-A 85003 J64 Package PDF

    52-Lead

    Abstract: 20 002 32-Lead carrier chip led J69 Package led circuit diagram led datasheets J64 Package
    Text: : Package Diagram Plastic Leaded Chip Carriers 20-Lead Plastic Leaded Chip Carrier J61 28-Lead Plastic Leaded Chip Carrier J64 1 : Package Diagram 32-Lead Plastic Leaded Chip Carrier J65 44-Lead Plastic Leaded Chip Carrier J67 2 : Package Diagram 52-Lead Plastic Leaded Chip Carrier J69


    Original     		20-Lead 28-Lead 32-Lead 44-Lead 52-Lead 68-Lead 84-Lead 20 002 carrier chip led J69 Package led circuit diagram led datasheets J64 Package PDF

    20V88

    Abstract: cerdip 16 lead 20V8-5 cg00
    Text: 20V8 PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL Device Features • QSOP package available — 10, 15, and 25 ns com’l version • Active pull-up on data input pins • Low power version 20V8L — 55 mA max. commercial (15, 25 ns) — 15, and 25 ns military/industrial versions


    Original     		PALCE20V8 20V8L) PALCE20V8 20V88 cerdip 16 lead 20V8-5 cg00 PDF

    20V8

    Abstract: PALCE20V8 20L8
    Text: PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL Device • QSOP package available — 10, 15, and 25 ns com’l version Features • Active pull-up on data input pins • Low power version 20V8L — 55 mA max. commercial (15, 25 ns) — 15, and 25 ns military/industrial versions


    Original     		PALCE20V8 20V8L) PALCE20V8 20V8 20L8 PDF

    64 CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: 20V8-5 CERAMIC LEADLESS CHIP CARRIER 20L8 20V8 PALCE20V8 28-PIN
    Text: fax id: 6010 1P AL CE 20 V8 PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL Device Features • QSOP package available — 10, 15, and 25 ns com’l version • Active pull-up on data input pins • Low power version 20V8L — 55 mA max. commercial (15, 25 ns)


    Original     		PALCE20V8 20V8L) PALCE20V8 64 CERAMIC LEADLESS CHIP CARRIER LCC 20V8-5 CERAMIC LEADLESS CHIP CARRIER 20L8 20V8 28-PIN PDF

    20V88

    Abstract: 20L8 20V8 PALCE20V8
    Text: fax id: 6010 1P AL CE 20 V8 PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL Device Features • QSOP package available — 10, 15, and 25 ns com’l version • Active pull-up on data input pins • Low power version 20V8L — 55 mA max. commercial (15, 25 ns)


    Original     		PALCE20V8 20V8L) PALCE20V8 20V88 20L8 20V8 PDF

    CERAMIC LEADLESS CHIP CARRIER

    Abstract: 20L8 20V8 PALCE20V8 ULTRA37000TM
    Text: USE ULTRA37000TM FOR ALL NEW DESIGNS PALCE20V8 Flash-Erasable Reprogrammable CMOS PAL Device Features • QSOP package available — 10, 15, and 25 ns com’l version • Active pull-up on data input pins — 15, and 25 ns military/industrial versions • Low power version 20V8L


    Original     		ULTRA37000TM PALCE20V8 20V8L) PALCE20V8 Ultra37000 CERAMIC LEADLESS CHIP CARRIER 20L8 20V8 PDF

    20V8

    Abstract: 20L8 PALCE20V8
    Text: 20V8 PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL Device Features • QSOP package available — 10, 15, and 25 ns com’l version • Active pull-up on data input pins • Low power version 20V8L — 55 mA max. commercial (15, 25 ns) — 15, and 25 ns military/industrial versions


    Original     		PALCE20V8 20V8L) PALCE20V8 20V8 20L8 PDF

    20V8-25

    Abstract: 20L8 20V8 PALCE20V8 ULTRA37000TM CG-02
    Text: USE ULTRA37000TM FOR ALL NEW DESIGNS PALCE20V8 Flash-Erasable Reprogrammable CMOS PAL Device Features • QSOP package available — 10, 15, and 25 ns com’l version • Active pull-up on data input pins — 15, and 25 ns military/industrial versions • Low power version 20V8L


    Original     		ULTRA37000TM PALCE20V8 20V8L) PALCE20V8 Ultra37000 20V8-25 20L8 20V8 CG-02 PDF

    C2613

    Abstract: C2614 c2615 C2611 C2617 7C261 7C264 CY7C261 CY7C263 CY7C264
    Text: CY7C261 CY7C263/CY7C264 8K x 8 Power-Switched and Reprogrammable PROM Features Functional Description The CY7C261, CY7C263, and CY7C264 are high-performance 8192-word by 8-bit CMOS PROMs. When deselected, the 7C261 automatically powers down into a low-power standby mode. It is packaged in a 300-mil-wide package. The 7C263


    Original     		CY7C261 CY7C263/CY7C264 CY7C261, CY7C263, CY7C264 8192-word 7C261 300-mil-wide 7C263 7C264 C2613 C2614 c2615 C2611 C2617 CY7C261 CY7C263 PDF

    semiconductor c243

    Abstract: transistor c243 CY7C243-45QMB c243 diode c2432 C2434 C2437 cerdip z PACKAGE DN2540N5-G CY7C243
    Text: 1CY 7C24 4 CY7C243 CY7C244 4Kx8 Reprogrammable PROM Features Functional Description • CMOS for optimum speed/power The CY7C243 and CY7C244 are high-performance 4K x 8 CMOS PROMs. The CY7C243 and CY7C244 are packaged in 300-mil-wide and 600-mil-wide packages respectively. The reprogrammable packages are equipped with an erasure window. When exposed to UV light, these PROMs are erased and


    Original     		CY7C243 CY7C244 CY7C243 CY7C244 300-mil-wide 600-mil-wide semiconductor c243 transistor c243 CY7C243-45QMB c243 diode c2432 C2434 C2437 cerdip z PACKAGE DN2540N5-G PDF

    cy7c245a-35dmb

    Abstract: 7C245A CERAMIC LEADLESS CHIP CARRIER CY7C245A CY7C245A35DMB CY7C245A-35PC C245A-1 CY7C245A-25DMB
    Text: 1CY 7C24 5A CY7C245A 2K x 8 Reprogrammable Registered PROM Features Functional Description • Windowed for reprogrammability • CMOS for optimum speed/power The CY7C245A is a high-performance, 2K x 8, electrically programmable, read only memory packaged in a slim 300-mil


    Original     		CY7C245A CY7C245A 300-mil 15-ns 10-ns cy7c245a-35dmb 7C245A CERAMIC LEADLESS CHIP CARRIER CY7C245A35DMB CY7C245A-35PC C245A-1 CY7C245A-25DMB PDF

    js28f256p

    Abstract: s162d RGMII phy Xilinx MT4JSF6464HY-1G1
    Text: ML605 Hardware User Guide UG534 v1.8 October 2, 2012 Copyright 2009–2012 Xilinx, Inc. Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. All other trademarks are the property of their respective owners.


    Original     		ML605 UG534 2002/96/EC 2002/95/EC 2006/95/EC, 2004/108/EC, js28f256p s162d RGMII phy Xilinx MT4JSF6464HY-1G1 PDF

    CY7C245A-25WMB

    Abstract: 7C245A CY7C245A a9242 C245A-5
    Text: CY7C245A D Features D D D D D CMOS for optimum speed/power Ċ Ċ D 15Ćns address setĆup Capable of withstanding greater than Functional Description The CY7C245A is a highĆperformance, 2K x 8, electrically programmable, read only memory packaged in a slim 300Ćmil


    Original     		CY7C245A CY7C245A 300mil CY7C245A-25WMB 7C245A a9242 C245A-5 PDF

    Untitled

    Abstract: No abstract text available
    Text: fax id: 6010 PyfP PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL Device Features • QSOP package available — 1 0 ,1 5 , and 25 ns com ’I version • Active pull-up on data input pins • Low power version 20V8L — 15, and 25 ns military/industrial versions


    OCR Scan     		PALCE20V8 20V8L) PALCE20V8 PDF

    Untitled

    Abstract: No abstract text available
    Text: CYPRESS PALCE20V8 Flash Erasable, Reprogrammable CMOS PAL Device Features • QSOP package available — 10,15, and 25 ns com’l version • Active pull-up on data input pins • Low power version 20V8L — 55 mA max. commercial (15, 25 ns) — 15, and 25 ns military/industrial versions


    OCR Scan     		20V8L) PALCE20V8 300-Mil) 28-Pin PALCE20V8L-15JI PALCE20V8L-15PI PALCE20V8L-15QI PALCE20V8L-15DMB PALCE20V8L-15LMB PDF

    VX 1818

    Abstract: 22V10G-7 TS13-1 PAL22
    Text: CYPRESS Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 4 ns — tg = 2.5 ns — f[HAX = 166 MH* External • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­ tional Vcc and Vss pins for lowest


    OCR Scan     		PAL22V10G PAL22VP10G PAL22VP10G) 300-Mil) 28-Pin PAL22VP10G- 28-Lead 24-Lead VX 1818 22V10G-7 TS13-1 PAL22 PDF

    22V10G-7

    Abstract: No abstract text available
    Text: m f CYPRESS Features — f[HAX = 1 6 6 MHz External • Reduced ground bounce and under­ shoot • PLCC and LCC packages w ith addi­ tional Vc c and V ss pins for lowest ground bounce • Up to 22 inputs and 10 outputs for more logic power Synchronous PRESET, asynchronous


    OCR Scan     		PAL22V10G PAL22VP10G PAL22VP10G 10LMB 22V10G-7 PDF

    22V10G

    Abstract: No abstract text available
    Text: PRELIMINARY r0 CYPRESS • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpo = 4 ns — ts = 2.5 ns — fMAX = 166 M Hz External • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­ tional V cc and Vs s pins for lowest


    OCR Scan     		PAL22V10G PAL22VP10G L22V10G L22VP10G 300-M 28-Pin 24-Lead --10PC 22V10G PDF

    b0615

    Abstract: BUS-65515 5962-8869201XC Phar Lap common mode rejection ratio test 1553B BUS-27765 BUS-65517II BUS-65520 bu-63147 microchannel
    Text: SECTION J MIL-STD-1553 DATA BUS PRODUCTS PRODUCT SUMMARY TABLE • TRANSCEIVERS — Smalt MODEL BUS63102H TYPE Universal Transceiver PACKAGE 1.26x1.26 x 0.17' BUS-6310411 Transceiver 1.26x1.26 x 0.17" BUS«310S» -15V BUS«3107I(-12V) Transceiver 24 Pin DDIP


    OCR Scan     		MIL-STD-1553 BUS-27765 5962-86049-02ZC. MIL-STD-1553A/B. BUS-25679 BUS-29854 -1US-69029 b0615 BUS-65515 5962-8869201XC Phar Lap common mode rejection ratio test 1553B BUS-65517II BUS-65520 bu-63147 microchannel PDF

    semiconductor c243

    Abstract: C2432
    Text: CY7C243 CY7C244 4Kx8 Reprogrammable PROM Features Functional Description • The CY7C243 and CY7C244 are high-performance 4K x 8 CMOS PROMs. The CY7C 243 and CY7C244 are packaged in 300-m il-wide and 600-mil-wide packages respectively. The re­ programmable packages are equipped with an erasure w in­


    OCR Scan     		CY7C243 CY7C244 CY7C244 300-m 600-mil-wide semiconductor c243 C2432 PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tsu = 2.5 ns — fMAX= 153.8 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­ tional V cc and Vs s pins for lowest


    OCR Scan     		PAL22VP10G) 300-M PAL22 10DMB L22VP10G 10LMB 28-Pin PDF

    Untitled

    Abstract: No abstract text available
    Text: PAL22V10G PAL22VP10G PRELIMINARY ” I CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tgu = 2.5 ns — fMAX = 153.8 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­


    OCR Scan     		PAL22V10G PAL22VP10G PAL22VP10G) L22V10G PAL22VP10G h00-M 28-Pin 300-M 24-Lead PDF

    22V10C

    Abstract: PAL22V10C-7DC
    Text: — . _ PAL22V10C _ PAL22VP10C SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 6 ns — tsu = 3 ns — fMAX = 117 MHz • Reduced ground bounce and under­ shoot • PLCC and LCC packages with addi­


    OCR Scan     		PAL22V10C PAL22VP10C PAL22V10C PAL22VP10C PAL22VP10C--12DC PAL22VP10C-12JC 22V10C PAL22V10C-7DC PDF