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    JEDEC BGA CASE OUTLINE Search Results

    JEDEC BGA CASE OUTLINE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    DF2B5M4ASL Toshiba Electronic Devices & Storage Corporation TVS Diode (ESD Protection Diode), Bidirectional, +/-3.6 V, SOD-962 (SL2) Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation

    JEDEC BGA CASE OUTLINE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    12x12 bga thermal resistance

    Abstract: SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack
    Text: Application Report 1998 MicroStar BGA Printed in U.S.A 11/98 SZZA005 MicroStar BGA Semiconductor Group Package Outline Application Report Kevin Lyne and Charles Williams Prepared by: Tanvir Raquib SZZA005 November 1998 Printed on Recycled Paper IMPORTANT NOTICE


    Original     		PDF SZZA005 thoseI1450 12x12 bga thermal resistance SZZA005 micro pitch BGA A113 TMS320VC549 TMS320VC549GGU BGA Ball Crack

    BGA PACKAGE thermal resistance

    Abstract: 100 PIN tQFP ALTERA DIMENSION capacitor cross reference EPM1270 EPM2210 324 air variable capacitor EPM2210 EPM240 EPM570 MS-026
    Text: Chapter 7. Package Information MII51007-1.0 Introduction This data sheet provides package information for Altera’s MAX II devices. It includes these sections: Section Page Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . . 7–1


    Original     		PDF MII51007-1 324-Pin BGA PACKAGE thermal resistance 100 PIN tQFP ALTERA DIMENSION capacitor cross reference EPM1270 EPM2210 324 air variable capacitor EPM2210 EPM240 EPM570 MS-026

    SPRU811

    Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
    Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue


    Original     		PDF SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate

    Datasheet of IC 7432

    Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
    Text: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type


    Original     		PDF

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    JEDEC JESD51-8 BGA

    Abstract: JESD51-8 jesd51 8 JESD51-5 G38-87 800E-02 JESD51-7 JEDEC JESD51-8 QFN PACKAGE thermal resistance AN2388
    Text: Freescale Semiconductor Application Note AN2388 Rev. 1.0, 12/2005 Heatsink Small Outline Package HSOP 1.0 Purpose This document is intended to provide information on Heatsink Small Outline Package (HSOP) and it’s process. The package related information includes:


    Original     		PDF AN2388 JEDEC JESD51-8 BGA JESD51-8 jesd51 8 JESD51-5 G38-87 800E-02 JESD51-7 JEDEC JESD51-8 QFN PACKAGE thermal resistance AN2388

    micro fineline BGA

    Abstract: EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z
    Text: 7. Package Information MII51007-2.1 Introduction This chapter provides package information for Altera’s MAX II devices, and includes these sections: • “Board Decoupling Guidelines” on page 7–1 ■ “Device and Package Cross Reference” on page 7–1


    Original     		PDF MII51007-2 144-Pin 68-Pin 144Pin 100-pin micro fineline BGA EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z

    JESD51-5

    Abstract: JEDEC JESD51-8 BGA JESD-51-5 MO-166 JESD51-8 outline of the heat slug for JEDEC HSOP 30 800E-02 jesd51 8 JESD-51
    Text: Freescale Semiconductor, Inc. Application Note AN2388/D Rev. 0, 11/2002 Heatsink Small Outline Package HSOP Freescale Semiconductor, Inc. This application note covers the following topics: Section Topic Page 1.0 Purpose 1 2.0 Scope 1 3.0 HSOP Package Information


    Original     		PDF AN2388/D JESD51-5 JEDEC JESD51-8 BGA JESD-51-5 MO-166 JESD51-8 outline of the heat slug for JEDEC HSOP 30 800E-02 jesd51 8 JESD-51

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    LPC2468 reflow solder profile

    Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,


    Original     		PDF AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Application Note AN2409 Rev. 2.0, 4/2013 Small Outline Integrated Circuit Fine Pitch Package SOIC 1.0 Purpose This Application Note provides general package information including package dimensions, guidelines for printed circuit board (PCB) layout,


    Original     		PDF AN2409

    PCB layout guidelines for NXP MCUs in BGA packages

    Abstract: LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 2 — 15 April 2011 Application note Document information Info Content Keywords LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, LPC432x, LPC433x, LPC435x, LPC2220, LPC2292,


    Original     		PDF AN10778 LPC175x, LPC176x, LPC177x, LPC178x, LPC181x, LPC182x, LPC183x, LPC185x, LPC431x, PCB layout guidelines for NXP MCUs in BGA packages LBGA256 AN10778 LPC2468 reflow solder profile land pattern for TSOP 2 54 pin NXP lpc LPC175x LFBGA256 lpc433x TSOP 54 land pattern

    PBGA 256 reflow profile

    Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


    Original     		PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    WEDPN8M72V-XBX

    Abstract: AN0019
    Text: AN0019 White Electronic Designs APPLICATION NOTE PBGA THERMAL RESISTANCE CORRELATION INTRODUCTION CALIBRATION, MEASUREMENTS AND MODELING The thermal resistances for the Plastic Ball Grid Array PBGA Multi Chip Packages (MCP) published in WEDC data sheets are results from thermal modeling software


    Original     		PDF AN0019 WEDPN8M72V-XBX 128Mb AN0019

    64-BGA

    Abstract: 64BGA
    Text: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: 6 4 BGA, STD, MAP, 8 X 8 PACKAGE MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ASH70651A REV: B CASE NUMBER: 1224-02 13 DEC 2005 STANDARD: NON-JEDEC


    OCR Scan     		PDF 98ASH70651A 64-BGA 64BGA

    JEDEC bga case outline

    Abstract: tolerancing a bga 8439
    Text: FREESCALE SEMICONDUCTOR, ALL RIGHTS RESERVED. TITLE: INC. MECHANICAL OUTLINE 783 I/O, FC BGA, 29 X 29 PKG, 1 MM PI TCH, WITH CAP ZONES PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARE10662D REV: A CASE NUMBER: 1 8 6 5 - 0 2 16 OCT 2006 STANDARD: NON JEDEC


    OCR Scan     		PDF 98ARE10662D 5M-1994. PACKA994. 98ARE10662D JEDEC bga case outline tolerancing a bga 8439

    Untitled

    Abstract: No abstract text available
    Text: F R E E S C A L E SEMICONDUCTOR, ALL R I G H T S RESERVED. TITLE: INC. 6 7 2 I/O TAPE BGA, 35 X 35 PKG, 1 MM PITCH MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARE10569D REV: A CASE NUMBER: 1589-02 26 NOV 2008 STANDARD: NON-JEDEC NOTES:


    OCR Scan     		PDF 98ARE10569D 5M-1994.

    MO-192

    Abstract: JEDEC bga case outline
    Text: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE 5 0 0 I / O TAPE BGA, 31 X 31 PKG, 1 MM r i IUH PRINT VERSION NOT TO SCALE DOCUMENT NO: 98A R S 10509D REV: A CASE NUMBER: 1 4 7 5 -0 1 18 AUG 2 0 0 5 STANDARD: JEDEC M O -1 9 2 , VARIATION A A N -1


    OCR Scan     		PDF 98ARS10509D MO-192, 5M-1994. PARA00 MO-192 JEDEC bga case outline

    MO-192

    Abstract: JEDEC bga case outline aan1
    Text: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE 3 2 4 I / O TA P E BGA, 31 X 31 PKG, 1 MM PITCH PRINT VERSION NOT TO SCALE DOCUMENT NO: 9 8A S A 9 9 3 4 6 D REV: A CASE NUMBER: 1 3 8 2 -0 1 0 4 AUG 2 0 0 5 STANDARD: JEDEC M O -1 9 2 , VARIATION A A N -1


    OCR Scan     		PDF 98ASA99346D MO-192, 5M-1994. MO-192 JEDEC bga case outline aan1

    MS-034

    Abstract: JEDEC MS-034 JEDEC bga case outline OMPAC MS034 MS 034
    Text: TOP VIEW 8 91 ' ‘n i213141516171819 rh 0 0 .3 A 1B 1C 1 0 0 .1 5 ® A SIDE VIEW BOTTOM VIEW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. PBG A, T IT L E : 241 1.27 I/O , MECHANICAL OUTLINE STD PROFILE, 25 MM PITCH X 25 PKG, OMPAC BGA PR IN T VERSION NOT TO SCALE


    OCR Scan     		PDF 241X1 lbni213141518171819 98ASA10542D MS-034 5M-1994. JEDEC MS-034 JEDEC bga case outline OMPAC MS034 MS 034

    480X

    Abstract: No abstract text available
    Text: 480X| ^ | o.1~5TX A iz 0.25 A ►— A Iv A j>, SEATING PLANE •0.1 MIN TOP VIEW 35.56 - 1H 28X 1.27 •(NHNHNHNHMHHHHh^HMNHNHNHNHHMHI- 2 AD! AB Y V T P M K H F D B 1.05 0.85 ‘ 5 7 6 9 11 13 15 17 19 21 23 25 27 29 8 10 12 14 16 18 20 2 2 24 26 28 BOTTOM VIEW


    OCR Scan     		PDF 98ASS23799W M0-/9222MRIATI0N 5M-1994. 51E22 480X

    MO-192

    Abstract: 304X
    Text: 304X 0.15 A A A iz i 0.25 Jfv ’j Jjj SEATING PLANE •0.1 MIN ri I 27.94 1.05 0.85 4 5 _ 7 _ 9 11 13 15 17 19 21 23 6 8 10 12 14 16 18 20 22 BOTTOM FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: VIEW °-9A 304X 0n 0.6 Z ^ A O .3 |A |B |C |


    OCR Scan     		PDF 98ASS23791W 1137B-02 MO-192, 5M-1994. MO-192 304X