ATMEL 740
Abstract: atmel 830 ATMEL Tape and Reel drawing LQFP-44 ATMEL shipping label atmel 0635 ATMEL Tape and Reel QFN-64 QFN-64 atmel 1030 pj 54 diode
Text: Packaging and Packing Information Packaging according to IEC 60286-3 for Tape and Reel, and IEC 60286-4 for tube packing. 1. Labels In general, on products coming out of Atmel ’s Heilbronn Germany location, two labels are on the inner cardboard: Atmel's standard bar code label and a customer
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JESD97.
4845C
ATMEL 740
atmel 830
ATMEL Tape and Reel drawing
LQFP-44
ATMEL shipping label
atmel 0635
ATMEL Tape and Reel QFN-64
QFN-64
atmel 1030
pj 54 diode
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56QN50T18080
Abstract: Senju MO-220-compliant Theta JA of 64-pin BGA 56RGQ senju solder paste MO-220 SN74SSTV16859 IPC-9701 qfn jc jb
Text: Application Report SCEA032 - March 2003 56-Pin Quad Flatpack No-Lead Logic Package Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-Lead (QFN) 56-terminal package complies with JEDEC standard MO-220, allows for board miniaturization, and holds several advantages
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SCEA032
56-Pin
56-terminal
MO-220,
56QN50T18080
Senju
MO-220-compliant
Theta JA of 64-pin BGA
56RGQ
senju solder paste
MO-220
SN74SSTV16859
IPC-9701
qfn jc jb
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Solder bar of Senju M705
Abstract: senju M31 GRN360 Senju senju m31 JESD Senju 7100 reflow profile 16QN50T23030 JESD 51-7, ambient measurement qfn 32 land pattern Senju paste 7100
Text: Application Report SCBA017D – February 2004 Quad Flatpack No-Lead Logic Packages Frank Mortan and Lance Wright SLL Package Development ABSTRACT Texas Instruments TI Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold
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SCBA017D
14/16/20-terminal
MO-241,
Solder bar of Senju M705
senju M31 GRN360
Senju
senju m31
JESD
Senju 7100 reflow profile
16QN50T23030
JESD 51-7, ambient measurement
qfn 32 land pattern
Senju paste 7100
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TPS59611
Abstract: No abstract text available
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact [email protected]. PACKAGE MATERIALS INFORMATION
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8-Apr-2009
TPS59611RHBR
TPS59611RHBT
TPS59611
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Untitled
Abstract: No abstract text available
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact [email protected]. PACKAGE MATERIALS INFORMATION
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8-Apr-2009
TPS59610RHBR
TPS59610RHBT
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Untitled
Abstract: No abstract text available
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact [email protected]. PACKAGE MATERIALS INFORMATION
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8-Apr-2009
TPS51610IRHBR
TPS51610IRHBT
TPS51610RHBR
TPS51610RHBT
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TPS59610
Abstract: No abstract text available
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact [email protected]. PACKAGE MATERIALS INFORMATION
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8-Apr-2009
TPS59610RHBR
TPS59610RHBT
TPS59610
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40spq
Abstract: No abstract text available
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact [email protected]. PACKAGE MATERIALS INFORMATION
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8-Apr-2009
TPS59610RHBR
TPS59610RHBT
40spq
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TI QFN marking
Abstract: TPS59611
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact [email protected]. PACKAGE MATERIALS INFORMATION
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8-Apr-2009
TPS59611RHBR
TPS59611RHBT
TI QFN marking
TPS59611
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CDC857-2
Abstract: CY2SSTV857-32
Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32
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CY2SSTV857-32
DDR400/PC3200-Compliant
CY2SSTV857-32
CDC857-2
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CDC857-2
Abstract: CY2SSTV857-32
Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32
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CY2SSTV857-32
DDR400/PC3200-Compliant
CY2SSTV857-32
CDC857-2
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Untitled
Abstract: No abstract text available
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact [email protected]. PACKAGE MATERIALS INFORMATION
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TPS59610RHBR
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CDC857-2
Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32
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CY2SSTV857-32
DDR400/PC3200-Compliant
CY2SSTV857-32
400-MHz
CDC857-2
QFN "200 pin" PACKAGE
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CDC857-2
Abstract: CY2SSTV857-32 QFN "200 pin" PACKAGE
Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32
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CY2SSTV857-32
DDR400/PC3200-Compliant
CY2SSTV857-32
400-MHz
CDC857-2
QFN "200 pin" PACKAGE
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JEDEC MO 224
Abstract: CY2SSTU877 CY2SSTU877BVC-XX CY2SSTU877BVI-XX CY2SSTU877BVI-XXT CY2SSTU877LFC-XX CY2SSTU877LFC-XXT CY2SSTU877LFI-XX JEDEC pin1 qfn tape
Text: CY2SSTU877 PRELIMINARY 1.8V, 500-MHz, 10-Output JEDEC-Compliant Zero Delay Buffer Features • Operating frequency: 125 MHz to 500 MHz • Supports DDRII SDRAM • Ten differential outputs from one differential input • Spread-Spectrum-compatible • Low jitter cycle-to-cycle : < 40 ps
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CY2SSTU877
500-MHz,
10-Output
52-ball
40-pin
CY2SSTU877
JEDEC MO 224
CY2SSTU877BVC-XX
CY2SSTU877BVI-XX
CY2SSTU877BVI-XXT
CY2SSTU877LFC-XX
CY2SSTU877LFC-XXT
CY2SSTU877LFI-XX
JEDEC pin1 qfn tape
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FMS2016-001
Abstract: FMS2016-001-TB FMS2016-001-TR FMS2016QFN MIL-HDBK-263 sp4t switch die
Text: FMS2016-001 Datasheet v2.4 High Power Reflective GaAs SP4T Switch FEATURES: • • • • • • FUNCTIONAL SCHEMATIC: 3x3x0.9mm Packaged pHEMT Switch High isolation: >30dB at 1.8GHz Low Insertion loss: 0.65dB at 1.8GHz Excellent low control voltage performance
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FMS2016-001
2002/95/EC)
FMS2016-001
22-A114.
MIL-STD-1686
MIL-HDBK-263.
FMS2016-001-TR
FMS2016-001-TB
FMS2016-001-EB
FMS2016-001-TB
FMS2016-001-TR
FMS2016QFN
MIL-HDBK-263
sp4t switch die
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tps5161
Abstract: No abstract text available
Text: This device is designed specifically to power IMVP Mobile Processors under a strict disclosure agreement with Intel. The end user must have a current CNDA Agreement in place with Intel. For more information please contact [email protected]. PACKAGE MATERIALS INFORMATION
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TPS51610IRHBR
TPS51610IRHBT
TPS51610RHBR
TPS51610RHBT
tps5161
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CDC857-2
Abstract: CY2SSTV857-32 CY2SSTV857LFI-32
Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32
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CY2SSTV857-32
DDR400/PC3200-Compliant
CY2SSTV857-32
400-MHz
CDC857-2
CY2SSTV857LFI-32
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PC3200-Compliant
Abstract: No abstract text available
Text: CY2SSTV857-32 Differential Clock Buffer/Driver DDR400/PC3200-Compliant Features Description • Operating frequency: 60 MHz to 230 MHz The CY2SSTV857-32 is a high-performance, low-skew, low-jitter zero-delay buffer designed to distribute differential clocks in high-speed applications. The CY2SSTV857-32
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CY2SSTV857-32
DDR400/PC3200-Compliant
400-MHz
CDC857-2
48-pin
CY2SSTV857-32
250MHz
230MHz
PC3200-Compliant
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TSC2020
Abstract: No abstract text available
Text: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •
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TSC2020
SBAS536B
12-Bit
TSC2020
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TI QFN marking
Abstract: No abstract text available
Text: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •
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TSC2020
SBAS536B
12-Bit
TI QFN marking
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Untitled
Abstract: No abstract text available
Text: TSC2020 SBAS536B – FEBRUARY 2011 – REVISED MARCH 2011 www.ti.com Analog Matrix TOUCH SCREEN CONTROLLER with I2C Serial Interface for 3 x 5 Array Check for Samples: TSC2020 FEATURES APPLICATIONS • • • • • • 1 23 • • • • • • •
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TSC2020
SBAS536B
12-Bit
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lf24a
Abstract: fs211 CY2544FI CY2544 CY2546
Text: CY2544 CY2546 PRELIMINARY Quad PLL Programmable Clock Generator with Spread Spectrum Features Benefits • Four fully integrated phase-locked loops PLLs • Input Frequency range: — External crystal: 8 to 48 MHz — External reference: 8 to 166 MHz clock
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CY2544
CY2546
nineY2546
CY2544
CY2546
lf24a
fs211
CY2544FI
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FMS2016-005-TB
Abstract: FMS2016-005TR FMS2016-005 FMS2016-005-TR FMS2016QFN MIL-HDBK-263
Text: FMS2016-005 Datasheet v2.4 High Power Reflective GaAs SP4T Switch FEATURES: • • • • • • FUNCTIONAL SCHEMATIC: 3x3x0.9mm Packaged pHEMT Switch NiPdAu finish for Military and High reliability applications High isolation: >30dB at 1.8GHz Excellent low control voltage performance
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FMS2016-005
2002/95/EC)
FMS2016-005
22-A114.
MIL-STD-1686
MIL-HDBK-263.
FMS2016-005-TR
FMS2016-005-TB
FMS2016-005-EB
FMS2016-005-TB
FMS2016-005TR
FMS2016-005-TR
FMS2016QFN
MIL-HDBK-263
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