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    JEDEC TRAY STANDARD 29X29 Search Results

    JEDEC TRAY STANDARD 29X29 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    JEDEC TRAY STANDARD 29X29 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    JEDEC TRAY DIMENSIONS

    Abstract: tray container dimensions BGA package tray JEDEC tray standard dimensions 729-Pin tray bga TRAY CONTAINER JEDEC tray standard
    Text: TRAY CONTAINER UNIT : mm 4 x 9=36 135° C MAX. 31.60 29.23 31.10 252.8 315.0 322.6 Section A – A' 29.23 4.67 (6.35) 7.62 29.23 NEC 94.2 31.40 BGA29 × 29B A' 20.85 135.9 PPE A Applied Package 729-pin Plastic BGA (29×29) (Flip-chip type) Quantity (pcs)


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    BGA29 729-pin BGA29 SSD-A-H7796 JEDEC TRAY DIMENSIONS tray container dimensions BGA package tray JEDEC tray standard dimensions tray bga TRAY CONTAINER JEDEC tray standard PDF

    jedec bga tray

    Abstract: 784-pin 12Surface tray bga BGA package tray
    Text: TRAY CONTAINER 94.2 7 29.45 31.60 31.10 135°C MAX. 29.45 A' 20.85 A BGA29 x 29ESP 31.40 135.9 PPE 4 × 9=36 UNIT : mm 252.8 315.0 322.6 SECTION A – A' 29.45 (6.08) (6.35) 7.62 29.00 Applied Package Quantity (pcs) 272-pin Plastic BGA (29×29) (CAVITY DOWN ADVANCED TYPE)


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    BGA29 29ESP 272-pin 729-pin 784-pin BGA29 SSD-A-H6977-2 jedec bga tray 12Surface tray bga BGA package tray PDF

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


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    C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP PDF

    F-501

    Abstract: VT8235CD samsung lcd tv power supply schematic VT8377 cb-1410 ck 66 ul94v-0 lcd mitac 8 W83L950 CP2211 samsung crt monitor STR USED IN SUPPLY
    Text: SERVICE MANUAL FOR 8399 BY: Grass Ren Repair Technology Research Department /EDVD Aug.2004 8399 N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………. 1.1 Introduction ……………………………………………………………………………………………


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    K8N800 VT8235 H8/W83L950D F-501 VT8235CD samsung lcd tv power supply schematic VT8377 cb-1410 ck 66 ul94v-0 lcd mitac 8 W83L950 CP2211 samsung crt monitor STR USED IN SUPPLY PDF

    ar8151

    Abstract: amd radeon 16p SMD P96 m9-CSP64 q540s pin diagram AMD RADEON hd 6750 amd radeon hd pin diagram samsung R740 mother board components ATI RAGE mobility m1 ncc cap
    Text: SERVICE MANUAL FOR 8355 BY: Rain Li Repair Technology Research Department /EDVD Nov.2003 8355 N/B MAINTENANCE Contents 1. Hardware Engineering Specification ………………………………………………………………… 4 1.1 Introduction …………………………………………………………………………………………………………. 4


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    K8T800M VT8385 VT8235 ICS950403 CB710 ar8151 amd radeon 16p SMD P96 m9-CSP64 q540s pin diagram AMD RADEON hd 6750 amd radeon hd pin diagram samsung R740 mother board components ATI RAGE mobility m1 ncc cap PDF

    CP2211

    Abstract: VT1634 ac14g mitac 8 W83L950 LM358 K8N800 h55 MOTHERBOARD CIRCUIT diagram ICS952007 cb-1410
    Text: SERVICE MANUAL FOR 8889 BY: Star Meng Repair Technology Research Department /EDVD Nov.2004 8889 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4


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    Athon64 K8N800 VT8235 ICS950405 W83L950D CP2211 VT1634 ac14g mitac 8 W83L950 LM358 h55 MOTHERBOARD CIRCUIT diagram ICS952007 cb-1410 PDF