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    JEDEC TRAY STANDARD FOR PLCC Search Results

    JEDEC TRAY STANDARD FOR PLCC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    JEDEC TRAY STANDARD FOR PLCC Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    cool white led super bright 1 watt

    Abstract: ADJD-S311-CR999 ADJD-S371-QR999 ASMT-MW00-NKK00 zxld1362 QFN tray 5x5 zetex product QFN 5x5 tray TLE4242G ASMT-MWC1-NJK00
    Text: Solid State Lighting Mid- and High-Power LEDs, LED-Modules and Color Management Your Imagination, Our Innovation Sense • Illuminate • Connect Solid-State Lighting Mid- and High-Power LEDs 0.5 Watt Mid-Power PLCC-4 Surface Mount LEDs Description The superior design allows this high-reliability LED package to be driven at high currents.


    Original     		AV00-0137EN cool white led super bright 1 watt ADJD-S311-CR999 ADJD-S371-QR999 ASMT-MW00-NKK00 zxld1362 QFN tray 5x5 zetex product QFN 5x5 tray TLE4242G ASMT-MWC1-NJK00 PDF

    JEDEC TRAY DIMENSIONS

    Abstract: tray bga JEDEC tray standard MIL-STD-81705 transport media and packing 100L PGA JEDEC tray JEDEC TRAY PGA MATERIALS MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs JEDEC tray standard tsop
    Text: Transport Media and Packing 10.1 Transport Media 10.1.1 Tubes 10 Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment. Standard tubes for most package types are translucent and allow visual inspection of units within the tube. Carbon-impregnated, black conductive tubes are


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    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing PDF

    IPC-SM-786A

    Abstract: BGA and QFP Altera Package mounting profile JESD22-A113 J-STD-020A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE IPC-SM-780 altera board
    Text: Reflow Soldering Guidelines January 1999, ver. 3 Introduction for Surface-Mount Devices Application Note 81 Altera’s surface-mount products include quad flat pack QFP , ceramic and plastic J-lead chip carriers (JLCC and PLCC, respectively), ball-grid


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    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES

    Abstract: AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


    Original     		JESD51, EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP PDF

    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    IPC-SM-786A

    Abstract: GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE ic packages A113 PMC-951041 baxter iv bag GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICES
    Text: APPLICATION NOTE PMC-951041 ISSUE 3 HANDLING MOISTURE SENSITIVE IC PACKAGES HANDLING OF MOISTURE SENSITIVE PLASTIC PACKAGES APPLICATION NOTE ISSUE 3: SEPTEMBER 1997 PMC-Sierra, Inc. 105 - 8555 Baxter Place Burnaby, BC Canada V5A 4V7 604 .415.6000 APPLICATION NOTE


    Original     		PMC-951041 IPC-SM-786A GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICE ic packages A113 PMC-951041 baxter iv bag GUIDELINES FOR HANDLING MOISTURE SENSITIVE DEVICES PDF

    TSOP-48 pcb LAYOUT

    Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    28 TSSOP JEDEC Thin Matrix Tray outlines

    Abstract: tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x
    Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three


    Original     		0637D 09/99/xM 28 TSSOP JEDEC Thin Matrix Tray outlines tsop tray matrix outline Shipping Trays ATMEL Packing Methods and Quantities ATMEL EIA-481-x Packing ATMEL 234 tsop Shipping Trays atmel tape and reel JEDEC Matrix Tray outlines EIA-481-x PDF

    JEDEC Matrix Tray outlines

    Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
    Text: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also


    Original     		EIA-481-x, JEDEC Matrix Tray outlines ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label PDF

    ATMEL 234

    Abstract: ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC
    Text: Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer's needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three


    Original     		0637B 10/98/xM ATMEL 234 ATMEL Packing Methods and Quantities ATMEL 210 atmel tape and reel ATMEL shipping label ATMEL Tape and Reel code ATMEL SOIC tape and reel ATMEL JEDEC SOIC atmel tape and reel JEDEC SOIC ATMEL Packing information JEDEC SOIC PDF

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo PDF

    AMD ORDERING AM29F010B PACKAGE

    Abstract: AMD AM29F010B PACKAGE known good die AMD AM29F010B-120 AM29F010B-90 AMD ORDERING AM29F010B AMD Package type am29f010b AM29F010 known good AM29F010 die
    Text: Am29F010B Known Good Die Data Sheet -XO\  7KH IROORZLQJ GRFXPHQW VSHFLILHV 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		Am29F010B AMD ORDERING AM29F010B PACKAGE AMD AM29F010B PACKAGE known good die AMD AM29F010B-120 AM29F010B-90 AMD ORDERING AM29F010B AMD Package type am29f010b AM29F010 known good AM29F010 die PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    INCOMING Plate INSPECTION

    Abstract: AM29F010B-120 AM29F010B-90 AM29F010
    Text: Am29F010B KGD Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and


    Original     		Am29F010B INCOMING Plate INSPECTION AM29F010B-120 AM29F010B-90 AM29F010 PDF

    erni 41612

    Abstract: No abstract text available
    Text: 074484_Cover_neu_A5_2010 29.04.2010 18:08 Uhr Seite U4U11 Catalog ERNI Electronics The Technology Center ERNI Electronics GmbH Seestrasse 9 73099 Adelberg/Germany Tel +49 71 66 50-0 Fax +49 71 66 50-282 [email protected] Europe South America ERNI Electronics, Inc.


    Original     		U4U11 23112/USA erni 41612 PDF

    822 smd

    Abstract: MIL-STD-81705 MIL-B-81705 cap intel 815 reflow profile manufacturing process calcium chloride molecular sieve A5753-01 Cu6Sn5 A5760 MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs
    Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the


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    solder paste alpha WS609

    Abstract: WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000 MO-193
    Text: TVSOP Application Brief August 1996 draft 1.2 SCBA009A List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete


    Original     		SCBA009A MO-193 IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF solder paste alpha WS609 WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000 PDF

    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


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    solder paste alpha WS609

    Abstract: WS609 Alpha WS609 solder cc fuji TSSOP YAMAICHI SOCKET Alpha WS609 dell monitor circuit diagram MO-194 scba009c reflow profile
    Text: Thin Very Small-Outline Package TVSOP SCBA009C March 1997 1 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest


    Original     		SCBA009C solder paste alpha WS609 WS609 Alpha WS609 solder cc fuji TSSOP YAMAICHI SOCKET Alpha WS609 dell monitor circuit diagram MO-194 scba009c reflow profile PDF

    SMD Packages

    Abstract: No abstract text available
    Text: IPC/JEDEC J-STD-033A July 2002 Supersedes IPC/JEDEC J-STD-033 April 1999 JOINT INDUSTRY STANDARD Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and approved through the JEDEC Board of


    Original     		J-STD-033A J-STD-033 SMD Packages PDF

    Quartz wrist watch ic

    Abstract: PC2002 WRIST WATCH CHIP digital wrist watch circuit digital watch circuit PCA2002 PCA2002T jedec tray bare die
    Text: INTEGRATED CIRCUITS DATA SHEET PCA2002 32 kHz watch circuit with programmable output period and pulse width Objective specification Supersedes data of 2002 Oct 25 2003 Feb 04 Philips Semiconductors Objective specification 32 kHz watch circuit with programmable


    Original     		PCA2002 PCA2002 SCA75 403414/02/pp20 Quartz wrist watch ic PC2002 WRIST WATCH CHIP digital wrist watch circuit digital watch circuit PCA2002T jedec tray bare die PDF

    ICS84330

    Abstract: ICS84330C MC12430 RD10 RD12
    Text: ICS84330C Integrated Circuit Systems, Inc. 700MHZ, LOW JITTER, CRYSTAL-TO-3.3V DIFFERENTIAL LVPECL FREQUENCY SYNTHESIZER GENERAL DESCRIPTION FEATURES The ICS84330C is a general purpose, single output high frequency synthesizer and a member of HiPerClockS


    Original     		ICS84330C 700MHZ, ICS84330C 250MHz 700MHz. 250KHz 16MHz 25MHz 25MHz. 84330CV ICS84330 MC12430 RD10 RD12 PDF