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    Alpha WS609

    Abstract: Yamaichi TQFP 244 MO-194AA MO-193 MO-194 tssop 16 exposed pad stencil Alpha WS609 solder TSSOP YAMAICHI SOCKET MO-194AC SN74LVC16xxx
    Text: TVSOP Application Brief December 1996 SCBA009B List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Draft 1.3 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete


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    SCBA009B MO-193 IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF Alpha WS609 Yamaichi TQFP 244 MO-194AA MO-194 tssop 16 exposed pad stencil Alpha WS609 solder TSSOP YAMAICHI SOCKET MO-194AC SN74LVC16xxx PDF

    DUAL ROW QFN leadframe

    Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
    Text: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the


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    solder paste alpha WS609

    Abstract: ic51-0142 WS609 Alpha WS609 solder AHC244 AKXXX TSSOP YAMAICHI SOCKET MO-194 MO-194AF 194-AA
    Text: Thin Very Small-Outline Package TVSOP SCBA009D February 2001 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


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    SCBA009D solder paste alpha WS609 ic51-0142 WS609 Alpha WS609 solder AHC244 AKXXX TSSOP YAMAICHI SOCKET MO-194 MO-194AF 194-AA PDF

    solder paste alpha WS609

    Abstract: WS609 ic51-0142 TSSOP YAMAICHI SOCKET MO-194 028089 CM92 MO-194AB MO-194AD
    Text: Thin Very Small-Outline Package TVSOP SCBA009E April 2001 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest


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    SCBA009E solder paste alpha WS609 WS609 ic51-0142 TSSOP YAMAICHI SOCKET MO-194 028089 CM92 MO-194AB MO-194AD PDF

    Alpha WS609

    Abstract: solder paste alpha WS609 WS609 Screen Printer DEK 265GS TSSOP YAMAICHI Socket 14 leads cc fuji IC51-0562 socket TSSOP YAMAICHI SOCKET SCBA009A mutual capacitance touch screens 2000
    Text: TVSOP Application Brief August 1996 draft 1.2 SCBA009A The Thin Very Small Outline Package (TVSOP) Acknowledgment The authors wish to acknowledge the following persons and corporations for their invaluable assistance in the preparation of this document.


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    SCBA009A IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF IC51-0142-2074 Alpha WS609 solder paste alpha WS609 WS609 Screen Printer DEK 265GS TSSOP YAMAICHI Socket 14 leads cc fuji IC51-0562 socket TSSOP YAMAICHI SOCKET SCBA009A mutual capacitance touch screens 2000 PDF

    solder paste alpha WS609

    Abstract: WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000 MO-193
    Text: TVSOP Application Brief August 1996 draft 1.2 SCBA009A List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete


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    SCBA009A MO-193 IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF solder paste alpha WS609 WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000 PDF

    solder paste alpha WS609

    Abstract: WS609 Alpha WS609 solder cc fuji TSSOP YAMAICHI SOCKET Alpha WS609 dell monitor circuit diagram MO-194 scba009c reflow profile
    Text: Thin Very Small-Outline Package TVSOP SCBA009C March 1997 1 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest


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    SCBA009C solder paste alpha WS609 WS609 Alpha WS609 solder cc fuji TSSOP YAMAICHI SOCKET Alpha WS609 dell monitor circuit diagram MO-194 scba009c reflow profile PDF