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    Diodes Incorporated 17-33

    Abstract: CKE 2009 cke02 RING TERM M6 2,5mm2
    Text: PreLIMINARY Information L9D125G80BG4 2.5 Gb, DDR - SDRAM Integrated Module IMOD Benefits FEATURES DDR SDRAM Data Rate = 200, 250, 266, and 333 Mbps Package: • 25mm x 25mm, Encapsulated Plastic Ball Grid array (PBGA), 219 balls, 1.27mm pitch. 2.5V ±0.2V Core Power supply


    Original     		L9D125G80BG4 LDS-L9D125G80BG4-C Diodes Incorporated 17-33 CKE 2009 cke02 RING TERM M6 2,5mm2 PDF

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    Abstract: No abstract text available
    Text: PreLIMINARY Information L9D112G80BG4 1.2 Gb, DDR - SDRAM Integrated Module IMOD Benefits FEATURES DDR SDRAM Data Rate = 200, 250, 266, and 333 Mbps Package: • 25mm x 25mm, Encapsulated Laminate Ball Grid array (LBGA), 219 balls, 1.27mm pitch. 2.5V ±0.2V Core Power supply


    Original     		L9D112G80BG4 LDS-L9D112G80BG4-A PDF

    Diodes Incorporated 17-33

    Abstract: T6N 700 DQ66 L9D12
    Text: PreLIMINARY Information L9D112G80BG4 1.2 Gb, DDR - SDRAM Integrated Module IMOD Benefits FEATURES DDR SDRAM Data Rate = 200, 250, 266, and 333 Mbps Package: • 25mm x 25mm, Encapsulated Plastic Ball Grid array (PBGA), 219 balls, 1.27mm pitch. 2.5V ±0.2V Core Power supply


    Original     		L9D112G80BG4 LDS-L9D112G80BG4-C Diodes Incorporated 17-33 T6N 700 DQ66 L9D12 PDF