Untitled
Abstract: No abstract text available
Text: Wire and Harness ID Products Performance Labels RMK Computer printable epoxy coated labels in a sheet form RMK is a computer printable labelstock with outstanding fluid and abrasion resistance, designed to be printed by sheet fed inkjet printers. When heat-cured after printing its unique heat reactive
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25-A4
RMK-190x30-A4
RMK-200x13-A4
RMK-250x13-A4
RMK-250x25-A4
RMK-6x20-A4
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1100C
Abstract: 750H TLOK1100C TLRK1100C TLRMK1100C TLSK1100C TLRK1100CT11
Text: TL RK,RMK,SK,OK,YK 1100C(T11) Tentative TLRK1100C(T11), TLRMK1100C(T11), TLSK1100C(T11) TLOK1100C(T11), TLYK1100C(T11) ・本資料は製品の紹介を目的とした技術検討資料です。最終仕様段階で特性内容 の変更を伴う場合もあります。製品設計を行う場合は、営業部門に最終仕様を
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1100C
TLRK1100C
TLRMK1100C
TLSK1100C
TLOK1100C
TLYK1100C
HOL-0206
750H
TLRK1100CT11
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PDF
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hp900
Abstract: MH17259 rmk-uncut-a4 R340 HP800 label RMK 6 28x4
Text: Wire and Harness ID Products Performance Labels RMK Computer printable epoxy coated labels in a sheet form RMK is a computer printable labelstock with outstanding fluid and abrasion resistance, designed to be printed by sheet fed inkjet printers. When heat-cured after printing its unique heat reactive
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signs250
hp900
MH17259
rmk-uncut-a4
R340
HP800
label RMK 6
28x4
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PDF
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1N-SS254
Abstract: 1N 2002 diode INNER CARTON LABEL
Text: 1N-SS254 HIGH-SPEED SWITCHING DIODE Features • Ultra-high speed. • High withstand voltage. • Low leakage and high voltage. Weight approx. 0.092g Absolute Maximum Ratings Ta = 25oC Symbol Value Unit Peak reverse voltage VRM 40 V Reverse voltage VR 35
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1N-SS254
100mA
DO-34
50kpcs
1N-SS254
1N 2002 diode
INNER CARTON LABEL
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Honey Technology
Abstract: carton box 1N-SS254 0092G SEMTECH LABEL SS-254 ss254 HONEY
Text: 1N-SS254 HIGH-SPEED SWITCHING DIODE Features • Ultra-high speed. • High withstand voltage. • Low leakage and high voltage. Weight approx. 0.092g Absolute Maximum Ratings Ta = 25oC Symbol Value Unit Peak reverse voltage VRM 40 V Reverse voltage VR 35
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1N-SS254
100mA
DO-34
50kpcs
Honey Technology
carton box
1N-SS254
0092G
SEMTECH LABEL
SS-254
ss254
HONEY
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PDF
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INNER CARTON LABEL
Abstract: 1N-SS254 SEMTECH LABEL
Text: 1N-SS254 HIGH-SPEED SWITCHING DIODE Features • Ultra-high speed. • High withstand voltage. • Low leakage and high voltage. Weight approx. 0.092g Absolute Maximum Ratings Ta = 25oC Symbol Value Unit Peak reverse voltage VRM 40 V Reverse voltage VR 35
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1N-SS254
100mA
DO-34
50kpcs
INNER CARTON LABEL
1N-SS254
SEMTECH LABEL
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PDF
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SS-254
Abstract: INNER CARTON LABEL 1N-SS254
Text: 1N-SS254 HIGH-SPEED SWITCHING DIODE Features • Ultra-high speed. • High withstand voltage. • Low leakage and high voltage. Weight approx. 0.092g Absolute Maximum Ratings Ta = 25oC Symbol Value Unit Peak reverse voltage VRM 40 V Reverse voltage VR 35
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1N-SS254
100mA
DO-34
50kpcs
SS-254
INNER CARTON LABEL
1N-SS254
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PDF
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carton box test
Abstract: ss119 SEMTECH LABEL INNER CARTON LABEL
Text: 1N-SS119 SILICON EPITAXIAL PLANAR DIODE for High Speed Switching Features • Low capacitance. C = 3.0pF max • Short reverse recovery time. (trr = 3.5ns max) • Small glass package (MHD) enables easy mounting and high reliability. Weight approx. 0.092g
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1N-SS119
DO-34
50kpcs
carton box test
ss119
SEMTECH LABEL
INNER CARTON LABEL
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PDF
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carton box test
Abstract: 0092G
Text: 1N-SS119 SILICON EPITAXIAL PLANAR DIODE for High Speed Switching Features • Low capacitance. C = 3.0pF max • Short reverse recovery time. (trr = 3.5ns max) • Small glass package (MHD) enables easy mounting and high reliability. Weight approx. 0.092g
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1N-SS119
DO-34
50kpcs
carton box test
0092G
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PDF
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carton box test
Abstract: SEMTECH LABEL
Text: 1N-SS119 SILICON EPITAXIAL PLANAR DIODE for High Speed Switching Features • Low capacitance. C = 3.0pF max • Short reverse recovery time. (trr = 3.5ns max) • Small glass package (MHD) enables easy mounting and high reliability. Weight approx. 0.092g
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1N-SS119
DO-34
50kpcs
carton box test
SEMTECH LABEL
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murata REEL label lot number
Abstract: No abstract text available
Text: PREPARED BY: DATE Reference SPEC NO. FILE No. ISSUE CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE PAGE Dec. 4, 2012 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 2.4GHz Wireless LAN Front-End IC
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QM2A1UB028
QM2A1UB028/EL/
murata REEL label lot number
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Untitled
Abstract: No abstract text available
Text: PREPARED BY: Reference DATE SPEC NO. FILE No. CHECKED BY: ELECTRONIC COMPOMENTS DATE AND DEVICES GROUP APPROVED BY: ISSUE Mar. 28, 2013 PAGE 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION DATE SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 2.4GHz Wireless LAN Front-End IC
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QM2A1UB032A
QM2A1UB032A/EL/
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PDF
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murata REEL label lot number
Abstract: No abstract text available
Text: Reference PREPARED BY: SPEC NO. DATE FILE No. CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE ISSUE Mar. 28, 2013 PAGE 1/22 REPRESENTATIVE DIVISION SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 5GHz Wireless LAN Front-End IC
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QM2A1UB033A
QM2A1UB033A/EL/
murata REEL label lot number
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PDF
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murata REEL label lot number
Abstract: No abstract text available
Text: PREPARED BY: DATE SPEC NO. FILE No. ISSUE CHECKED BY: DATE ELECTRONIC COMPOMENTS AND DEVICES GROUP APPROVED BY: DATE PAGE Dec. 4, 2012 1/22 REPRESENTATIVE DIVISION U SHARP CORPORATION SPECIFICATION SYSTEM DEVICE DIVISION DEVICE SPECIFICATION FOR 5GHz Wireless LAN Front-End IC
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QM2A1UB029
QM2A1UB029/EL/
murata REEL label lot number
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MIL-M-87958
Abstract: X0640 BMS-13-47 lms9000 T612M-DS MV203 snap on tools for electronic BMS13-47 RT-1805 CR-107
Text: C O N T E N T S WIRE AND HARNESS ID P R O D U C T S 2 Heat Shrink/Cable Markers Performance Labels Self-Laminating Labels Pre-Printed Wire & Cable Markers LABEL ID PRODUCTS 64 Product Code Cross Reference Thermal Transfer Labels Dot Matrix Labels Laser Labels
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WV-762508-2
ZH-SCE-1K-11/2-2
ZH-SCE-1K-3/16-2
ZH-SCE-1K-3/32-2
MIL-M-87958
X0640
BMS-13-47
lms9000
T612M-DS
MV203
snap on tools for electronic
BMS13-47
RT-1805
CR-107
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Siemens Ni1000 temperature sensor
Abstract: n531 QAC22 N9292 LG-Ni1000 QFM3100 triac BT 317 DATASHEET
Text: System Catalog 2014 The information in this document contains general descriptions of technical options available, which do not always have to be present in individual cases. The required features should therefore be specified in each individual case at the time of closing the contract.
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MIL-STD-1750* BX
Abstract: mil-std-1750a nim ttl ttl nim cmos 4004 MA17501 MA17502 MA17503 MA31751 MAS281
Text: MA17502 MA17502 Radiation Hard MIL-STD-1750A Control Unit Replaces June 1999 version, DS3565-4.0 The MA17502 Control Unit is a component of the MAS281 chip set. Other chips in the set include the MA17501 Execution Unit and the MA17503 Interrupt Unit. Also available is the
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MA17502
MIL-STD-1750A
DS3565-4
MA17502
MAS281
MA17501
MA17503
MA31751
MIL-STD-1750* BX
nim ttl
ttl nim
cmos 4004
MAS281
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SPRU401C
Abstract: TMS320C64xx cpu C6000 C6201 SPRU189 SPRU190 TMS320C6000
Text: TMS320C6000 Chip Support Library API User’s Guide Literature Number SPRU401C October 2001 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at
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TMS320C6000
SPRU401C
SPRU401C
TMS320C64xx cpu
C6000
C6201
SPRU189
SPRU190
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ES50N18LA2
Abstract: YTX14-BS YTZ10S MOTORCYCLE engine specifications yamaha mt-03 ES14AA2 PT12B YTZ14s GL1800 EXIDE GEL G 210
Text: 145372_CalCoastAdv 2/23/11 4:07 PM Page 1 145372_CalCoastAdv 2/23/11 4:07 PM Page 2 Sealed Maintenance Free Battery Features Sealed Post Prevents acid leakage, reduces corrosion, and extends battery life safety valve flame/arrestor relieves excess pressure
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PTX19CL-BS
12N9-4B-1
CB14-A2
CB12C-A
CB30CL-B
PTX14L-BS
ES50N18LA2
YTX14-BS
YTZ10S
MOTORCYCLE engine specifications
yamaha mt-03
ES14AA2
PT12B
YTZ14s
GL1800
EXIDE GEL G 210
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GEC Plessey Semiconductors cross reference
Abstract: BMA31751 MA17501 MA17502 MA17503 MA31751 MAS281 AD00 TI MIL-STD-1750A E04A
Text: MAS281 MAS281 MIL-STD-1750A Microprocessor Replaces June 1999 version, DS3563-4.0 The MAS281 Microprocessor is a MIL-STD-1750A Notice 1 , 16-bit Central Processing Unit (CPU). It consists of three CMOS/SOS large-scale integration (LSI) chips: the MA17501
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MAS281
MIL-STD-1750A
DS3563-4
MAS281
MIL-STD-1750A
16-bit
MA17501
MA17502
MA17503
GEC Plessey Semiconductors cross reference
BMA31751
MA17501
MA31751
AD00 TI
E04A
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transistor SMD t04
Abstract: transistor SMD t05 transistor SMD t04 51 smd T04 transistor kA2 smd smd t05 transistor t05 smd transistor D1060 smd t04 68 smd code t04
Text: 2009-2 PRODUCT GUIDE LED Lamps SEMICONDUCTOR http://www.semicon.toshiba.co.jp/eng High-Brightness LED Lamps Overview of Toshiba’s Visible LED Lamp Family 1 New Product Digest 1. 2. 3. 4. High-Luminous-Flux SMD LED Lamps: TL12 Series . 4
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TLWK1100C
F1050
F1052
H1100B
BCE0006D
BCE0006E
transistor SMD t04
transistor SMD t05
transistor SMD t04 51
smd T04
transistor kA2 smd
smd t05
transistor t05 smd
transistor D1060
smd t04 68
smd code t04
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HQFN052-P-0707
Abstract: marking codes LXX 05 SHARP LED 6.0 4.6 IR2D20U SEMI42-996
Text: .SPEC No. EL193027 ISSU E : Mar. 19. 2007 To 0N S P E C I F I CAT I Product Type S 24-ch LED Driver IC IR 2D 20U Model No. IR2D20U1 This specifications contains 24 pages including the cover and appendix. If you have any objections, please contact us before issuing purchasing order.
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fl0500-2-A4
IR2D20U
R2D20U1
IR2D20L
HQFN052-P-0707
marking codes LXX 05
SHARP LED 6.0 4.6
IR2D20U
SEMI42-996
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Untitled
Abstract: No abstract text available
Text: Wf f l l G E C P L E S S E Y DS3563-2.3 June 1993 MAS281 MIL-STD-1750A MICROPROCESSOR The MAS281 Microprocessor is a MIL-STD-1750A Notice 1 . 16-bit Central Processing Unit (CPU). It consists of three CMOS/SOS large-scale integration (LSI) chips: the MA17501
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DS3563-2
MAS281
MIL-STD-1750A
MAS281
MIL-STD-1750A
16-bit
MA17501
MA17502
MA17503
64-pin
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Untitled
Abstract: No abstract text available
Text: P jp J GEC P L E S S E Y DS3563-3.2 MAS281 MIL-STD-1750A MICROPROCESSOR The MAS281 Microprocessor is a MIL-STD-1750A Notice 1 , 16-bit Central Processing Unit (CPU). It consists of three CMOS/SOS large-scale integration (LSI) chips: the MA17501 Execution Unit (EU), the MA17502 Control Unit (CU), and the
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DS3563-3
MAS281
MIL-STD-1750A
MAS281
MIL-STD-1750A
16-bit
MA17501
MA17502
MA17503
64-pin
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