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    LGA APPLICATION NOTES Search Results

    LGA APPLICATION NOTES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TSL1401CCS-RL2 Rochester Electronics TSL1401 - 128 x 1 Linear Sensor Array with hold. Please note, an MOQ and OM of 250 pcs applies. Visit Rochester Electronics Buy
    C8231A Rochester Electronics LLC Math Coprocessor, 8-Bit, NMOS, CDIP24, DIP-24 Visit Rochester Electronics LLC Buy
    AM79865JC Rochester Electronics LLC Telecom Circuit, Visit Rochester Electronics LLC Buy
    AM79866AJC-G Rochester Electronics LLC SPECIALTY TELECOM CIRCUIT, PQCC20, ROHS COMPLIANT, PLASTIC, LCC-20 Visit Rochester Electronics LLC Buy
    MD8087/R Rochester Electronics LLC Math Coprocessor, CMOS Visit Rochester Electronics LLC Buy

    LGA APPLICATION NOTES Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    X-RAY INSPECTION

    Abstract: LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance
    Text: Freescale Semiconductor, Inc. Application Note AN2265/D Rev. 0, 03/2002 LGA Application Notes Freescale Semiconductor, Inc. by Thomas Koschmieder and Michael Leoni Introduction The Land Grid Array LGA is an area array matrix package that uses solder paste as


    Original     		PDF AN2265/D 26mm-0 X-RAY INSPECTION LGA Application Notes motorola 12x12mm BGA package thermal resistance LGA Application Notes pitch 0.4mm BGA solder wire 0.3 mm lga components s3527 LGA PACKAGE thermal resistance

    LGA rework

    Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
    Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules


    Original     		PDF AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework

    LIS302DL c source

    Abstract: LIS302DL self test example AN2335 LIS302DL self test LIS302DL LIS302DL X Y Z smd code YL transistor smd ZH DO13 DO14
    Text: AN2335 Application note LIS302DL: 3-Axis - ±2g/±8g digital output ultracompact linear accelerometer Introduction This document is intended to give application notes for the low-voltage 3-axis digital output linear MEMS accelerometer provided in LGA package.


    Original     		PDF AN2335 LIS302DL: LIS302DL LIS302DL c source LIS302DL self test example AN2335 LIS302DL self test LIS302DL X Y Z smd code YL transistor smd ZH DO13 DO14

    AN2381

    Abstract: VIA Tremor 5.1 LIS3LV02DL LIS3LV02DL c source DO13 DO14 DO15 LGA-16
    Text: AN2381 Application note LIS3LV02DL: 3-Axis - ±2g/±6g digital output low voltage linear accelerometer Introduction This document is intended to give application notes for the low-voltage 3-axis digital output linear MEMS accelerometer provided in LGA package.


    Original     		PDF AN2381 LIS3LV02DL: LIS3LV02DL AN2381 VIA Tremor 5.1 LIS3LV02DL c source DO13 DO14 DO15 LGA-16

    LGA voiding

    Abstract: AN1091 international rectifier application note AN-1091 AN-1028 AN-1029 AN10912 vias
    Text: Application Note AN-1091 Recommended PCB Via Design for International Rectifier’s BGA and LGA Packages By Kevin Hu, International Rectifier Table of Contents Page Introduction . 2


    Original     		PDF AN-1091 AN-1028. AN-1029. LGA voiding AN1091 international rectifier application note AN-1091 AN-1028 AN-1029 AN10912 vias

    Ceramic Surface Mount Amplifiers

    Abstract: SURFACE MOUNT rf TRANSFORMER AM05-0005 AM05-0005-TB AM05-0006 AM05-0006-TB C2084
    Text: C2084 Application Notes Ceramic Surface Mount Amplifiers V 2.00 1. Introduction M/A-COM’s Ceramic Surface Mount amplifier platform offers superior intermodulation performance for IF amplifiers in a commercial LGA Land Grid Array package. This design approach integrates coupler


    Original     		PDF C2084 AM05-0006 AM05-0006-TB AM05-0005 AM05-0005-TB AM05-000Drawing C2084 AM05-0005/6 Ceramic Surface Mount Amplifiers SURFACE MOUNT rf TRANSFORMER AM05-0005 AM05-0005-TB AM05-0006 AM05-0006-TB

    Untitled

    Abstract: No abstract text available
    Text: RF25F Tx ASIC for CDMA, AMPS, and PCS Applications The RF25F Tx Application-Specific Integrated Circuit ASIC is a tri-mode, dualband upconverter and driver amplifier in 5x5 mm LGA package, designed for transmitter application in portable phones. ASIC can be used in both cellular and


    Original     		PDF RF25F RF25F 32-pin

    Untitled

    Abstract: No abstract text available
    Text: RF25F Tx ASIC for CDMA/AMPS and PCS Applications The RF25F Tx Application-Specific Integrated Circuit ASIC is a tri-mode, dualband upconverter and driver amplifier in a 5x5 mm LGA package designed for transmitter application in portable phones. ASIC can be used in both cellular and


    Original     		PDF RF25F RF25F 101118B

    C1327 transistor

    Abstract: C1285 C429 C872 DTC114WUA RF25F
    Text: RF25F Tx ASIC for CDMA/AMPS and PCS Applications Features The RF25F Transmit Application-Specific Integrated Circuit ASIC is a tri-mode, dual-band upconverter and driver amplifier in a 5x5 mm LGA package designed for transmitter application in portable phones. The RF25F can be used in both cellular


    Original     		PDF RF25F RF25F 32-pin 101118B C1327 transistor C1285 C429 C872 DTC114WUA

    thermal analysis on pcb

    Abstract: flotherm MODEL AN2026 AN-2026 2026 led thermal cfd thermal resistance of low power semiconductor flotherm
    Text: National Semiconductor Application Note 2026 Lianxi Shen February 8, 2010 Summary Power Module better in thermal performance than other package types. For example, LGA packages have a θJC of about 5C/W or larger for the similar package size, depending on the


    Original     		PDF O-263. AN-2026 thermal analysis on pcb flotherm MODEL AN2026 AN-2026 2026 led thermal cfd thermal resistance of low power semiconductor flotherm

    LGA voiding

    Abstract: NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D
    Text: Freescale Semiconductor Application Note Document Number: AN2920 Rev. 2, 12/2008 Manufacturing with the Land Grid Array Package by Networking & Multimedia Group Freescale Semiconductor, Inc. Austin, TX Freescale has introduced the High Coefficient of Thermal


    Original     		PDF AN2920 LGA voiding NC-SMQ230 Indalloy 181 Solder Paste, Indium, Type 3 AN2920 7313 28 pin freescale ltcc BGA cte hcte ipc 610D

    Untitled

    Abstract: No abstract text available
    Text: 2x2 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 2 x 2 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.


    Original     		PDF 20-April-2012

    pcb design of zigbee

    Abstract: FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32
    Text: Freescale IEEE 802.15.4 / ZigBee Package and Hardware Layout Considerations Reference Manual Document Number: ZHDCRM Rev. 1.3 08/2009 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor


    Original     		PDF CH370 pcb design of zigbee FBGA 17X17 DRAWING AN3345 LGA71 an3553 lga 115 71-Contact AN2731 AN3003 QFN-32

    ST LGA marking code

    Abstract: No abstract text available
    Text: 3x5 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 5 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.


    Original     		PDF 03-July-2008 ST LGA marking code

    Untitled

    Abstract: No abstract text available
    Text: 3x3 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 3 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.


    Original     		PDF 03-July-08

    C25704-002

    Abstract: LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details C25704 6010a AL322 Loctite 7452
    Text: Intel Celeron® D Processor in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #303730-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF 775-Land C69175 PSC-2U001 C25704-002 LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details C25704 6010a AL322 Loctite 7452

    WBSOIC-16

    Abstract: LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments       Two completely isolated drivers  Independent HS and LS inputs or in one package PWM input versions Up to 5 kVRMS input-to-output


    Original     		PDF Si823x Si8230/1/2 SOIC-16 Si8233/4/5/6 LGA-14 SOIC-16 WBSOIC-16 LGA land pattern SI8233BD-C-IS SI823 Si8233 mosfet igbt drivers theory si8235 Si823x Si8233BB-C-IS SI8234-B-IS

    SI8233BD-C-IS

    Abstract: SOIC127P600 igbt series Si8232BB-B-IS Si8233 SI8235BB-C-IS1 SI8234A
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features  Two completely isolated drivers  60 ns propagation delay (max) in one package  Independent HS and LS inputs or Up to 5 kVRMS input-to-output PWM input versions isolation


    Original     		PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 LGA-14 SI8233BD-C-IS SOIC127P600 igbt series Si8232BB-B-IS Si8233 SI8235BB-C-IS1 SI8234A

    SM2C

    Abstract: mark a2 2mm 2mm iC-SM2L
    Text: iC-SM2L LGA SM2C 2MM MR-SENSOR PACKAGE SPECIFICATION Rev A3, Page 1/4 ORDERING INFORMATION Type Package Options Order Designation iC-SM2L LGA SM2C none iC-SM2L LGA SM2C 7.6 mm x 2.8 mm PIN CONFIGURATION PIN FUNCTIONS No. Name Function 1 2 3 4 5 6 NCOS PCOS


    Original     		PDF

    Si8233BB-C-IS

    Abstract: LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233
    Text: Si823x 0 . 5 AND 4 . 0 A MP I S O D R I V E R S 2.5 AND 5 K V RMS Features Pin Assignments      Two completely isolated drivers  60 ns maximum propagation in one package delay Up to 5 kVRMS input-to-output  Independent HS and LS inputs or


    Original     		PDF Si823x Si8230/1/2 Si8233/4/5/6 SOIC-16 Si8233BB-C-IS LGA land pattern SI8233BD-C-IS Si8230 SI8234-B-IM mosfet igbt drivers theory SI8234 solar inverters circuit diagram Si823x Si8233

    J-STD-002B

    Abstract: LGA03C-00SADJJ
    Text: Embedded Power for Business-Critical Continuity SXX06E Rev. 08.01.06 Page 1 of 2 Rev. 11.02.09 LGA C SERIES 1 of 4 LGA C Series 15-100 Watts Total Power: 15-100 Watts No. of Outputs: Single Electrical Specifications Output Special Features • 3,6,10 and 20 A output


    Original     		PDF SXX06E J-STD-002B LGA03C-00SADJJ

    13707RZ

    Abstract: 13707RZ-S02L inphi S02l inphi Converter Inphi NRZ inphi terms
    Text: 13707RZ 12.5 Gbps NRZ-to-RZ Converter Data Sheet Applications • • • • • NRZ-to-RZ data conversion with pulse width control SONET OC-192 linecards and equipment Long haul and ultra long haul transmission systems Mach-Zehnder optical modulators Broadband test and measurement equipment


    Original     		PDF 13707RZ OC-192 13707RZ 13707RZ-S02D, 13707RZ-S02 ISO-9001 13707RZ-S02L inphi S02l inphi Converter Inphi NRZ inphi terms

    LGA20C-00SADJJ

    Abstract: J-STD-002B Lga10c LGA03C-00SADJJ LGA10C-00S lga20c-01sadjj LGA06C00SADJJ LGA10
    Text: Embedded Power for Business-Critical Continuity SXX06E Rev. 08.01.06 Page 1 of 2 Rev. 12.15.09 LGA C SERIES 1 of 4 LGA C Series 15-100 Watts Total Power: 15-100 Watts No. of Outputs: Single Electrical Specifications Output Special Features • 3,6,10 and 20 A output


    Original     		PDF SXX06E LGA20C-00SADJJ J-STD-002B Lga10c LGA03C-00SADJJ LGA10C-00S lga20c-01sadjj LGA06C00SADJJ LGA10

    Untitled

    Abstract: No abstract text available
    Text: 12 11 10 74988 4.18 X 4 5° CHAMFER 2 PLACES 4 NOTES: 1. MATERIAL: HOUSING: LIQUID CRYSTAL POLYMER, (LCP 30% G LASS FILLED, BLACK TERMINALS: 2. FINISH: COPPER ALLOY 0.761-1.016 MICRONS GOLD OVER QUALITY SYMBOLS 1.27-3.175 MICRONS NICKEL OVERALL. • s f C N C SI C N


    OCR Scan     		PDF