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    LGA LAND PATTERN Search Results

    LGA LAND PATTERN Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    R7FS5D57A2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    R7FS5D57C2A01CLK#AC1 Renesas Electronics Corporation 120 MHz Arm® Cortex®-M4 CPU, LGA, /Tray Visit Renesas Electronics Corporation
    UPA2371T1P-E1-A Renesas Electronics Corporation Nch Dual Power Mosfet 24V 6A 20Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
    UPA2351T1P-E4-A Renesas Electronics Corporation Nch Dual Power Mosfet 30V 5.7A 40Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation
    UPA2350T1P-E4-A Renesas Electronics Corporation Nch Dual Power Mosfet 20V 6.0A 35Mohm 4-Pin Eflip-Lga Visit Renesas Electronics Corporation

    LGA LAND PATTERN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LGA voiding

    Abstract: AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		PDF AN3311 MC1320x MC1321x LGA voiding AN3281 Lead Free reflow soldering profile BGA AN1902 AN3311 fr-5 laminate BGA PACKAGE thermal resistance Freescale bga PCB footprint reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance Freescale

    AN3281

    Abstract: LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate
    Text: Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.1, 12/2009 Considerations for the Application of Land Grid Array LGA Style Packages 1 Introduction This application note describes general considerations for application of the Land Grid Array (LGA) style


    Original     		PDF AN3311 MC1320x MC1321x AN3281 LGA voiding LGA PACKAGE thermal resistance Freescale reflow profile FOR LGA COMPONENTS "LGA footprint" lga components AN1902 AN3311 BGA cte fr-5 laminate

    LGA rework

    Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
    Text: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules


    Original     		PDF AN3241 MC1320x MC1321x LGA rework AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework

    LICC

    Abstract: kyocera mlcc military capacitors lga components
    Text: Land Grid Array LGA Low Inductance Capacitor Advantages in Military and Aerospace Applications A B S T R A C T : The benefits of Land Grid Array (LGA) capacitors and superior low inductance performance in modern military and aerospace designs. Sonja Brown


    Original     		PDF S-LGA0M806-N LICC kyocera mlcc military capacitors lga components

    reflow profile FOR LGA COMPONENTS

    Abstract: LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion
    Text: Enpirion, Inc. EN53x0D AN103_R0.9 Soldering Module Packages Having Large Asymmetric Pads 1.0 INTRODUCTION Enpirion’s power converter packages utilize module package technology to form Land Grid Array LGA packages. LGA module package technology provides additional


    Original     		PDF EN53x0D reflow profile FOR LGA COMPONENTS LGA PACKAGE thermal resistance an103r paste profile solder joint AN103 lga components LGA land pattern stencil Enpirion

    Untitled

    Abstract: No abstract text available
    Text: 3x3 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 3 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.


    Original     		PDF 03-July-08

    Untitled

    Abstract: No abstract text available
    Text: 2x2 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 2 x 2 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.


    Original     		PDF 20-April-2012

    LGA land pattern

    Abstract: cases lga components
    Text: LGA LAND PATTERN DIMENSIONS b2 e b2 e P-FLGA Unit:mm Pin pitch Land Pattern Dimensions Remark e Land dimeter φ b 2 0.80 0.65 0.45 0.35 0.50 0.24 to 0.30 (The reference value) Only representative dimensions are inscribed above. As there are cases where the dimensions


    Original     		PDF

    ST LGA marking code

    Abstract: No abstract text available
    Text: 3x5 mm LGA Package Guidelines for Printed Circuit Board Design This technical note is intended to provide information about Kionix’s 3 x 5 mm LGA packages and guidelines for developing PCB land pattern layouts. These guidelines are general in nature and based on recommended industry practices.


    Original     		PDF 03-July-2008 ST LGA marking code

    Untitled

    Abstract: No abstract text available
    Text: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector


    Original     		PDF UL94V-0,

    lga 115

    Abstract: No abstract text available
    Text: LGPS SERIES CONNECTORS 1.27mm .050" Contact Spacing, Land Grid Array Sockets • • • • • • • • • • • • • • The LGPS Series connector is a low profile connector for LGA (Land Grid Array) Packages with 599 contacts. The connector


    Original     		PDF

    IPC-7527

    Abstract: LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT
    Text: Application Note 100 February 2006 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100fb AN100-10 434-0507CAwww IPC-7527 LGA voiding koki solder paste LTM4600 IPC-7525 reflow profile FOR LGA COMPONENTS LGA land pattern IPC7525 for lga LGA 32 land pattern Solder Paste, Indium 5.1 AT

    IPC-7527

    Abstract: IPC-7525 koki solder paste IPC7527
    Text: Application Note 100 June 2005 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 INTRODUCTION The Linear Technology µModule solution combines integrated circuits and passive components in a single


    Original     		PDF 101752C 01049A an100p AN100-10 434-0507CAwww IPC-7527 IPC-7525 koki solder paste IPC7527

    C2084

    Abstract: AM05-0006 AM05-0005 AM05-0005-TB AM05-0006-TB
    Text: Application Note C2084 Ceramic Surface Mount Amplifier Rev. V3 1. Introduction M/A-COM’s Ceramic Surface Mount amplifier platform offers superior intermodulation performance for IF amplifiers in a commercial LGA Land Grid Array package. This design approach


    Original     		PDF C2084 AM05-0006 AM05-0006-TB AM05-0005 AM05-0005-TB AM05-000reserve AM05-0005/6 C2084 AM05-0006 AM05-0005 AM05-0005-TB AM05-0006-TB

    LGA1366

    Abstract: 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow
    Text: Lever Actuated Land Grid Array LGA1366 Socket Application Specification 114-5432 24 Sep ’08 Rev.A 1. INTRODUCTION This specification covers the requirements for application of lever-actuated LGA1366 Socket position onto printed circuit board PCB . The socket accepts 1366-position LGA


    Original     		PDF LGA1366 LGA1366 1366-position 016mm Table12. Table12 1981467-1 LGA-1366 LGA rework Socket 1366 reflow profiles MMC socket socket LGA 1366 PEAK tray drawing X-1981837-X pcb warpage* in smt reflow

    C25704-002

    Abstract: LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details C25704 6010a AL322 Loctite 7452
    Text: Intel Celeron® D Processor in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #303730-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF 775-Land C69175 PSC-2U001 C25704-002 LGA 775 SOCKET PIN LAYOUT Nidec fan C25704-002 intel fan socket 775 air output lga 775 motherboard drawings lga 775 socket details C25704 6010a AL322 Loctite 7452

    Untitled

    Abstract: No abstract text available
    Text: AH4 The Communications Edge Advanced Product Information High Dynamic Range Amplifier Product Features Product Description Functional Diagram The AH4 is a high dynamic range amplifier • 0.25-6 GHz Bandwidth Pin 1 indicator packaged in a Land Grid Array LGA surface


    Original     		PDF 1-800-WJ1-4401

    LGA voiding

    Abstract: IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux
    Text: Application Note 100 February 2006 Revised January 2008 Recommended Land Pad Design, Assembly and Rework Guidelines for DC/DC µModule in LGA Package David Pruitt 1.1 Introduction The Linear Technology Module solution combines integrated circuits and passive components in a single package.


    Original     		PDF 101752C 01049A an100fc AN100-14 LGA voiding IPC-7527 IPC7525 lga material koki solder paste LTM4600 an100fc AN100 IPC7525 reflowing profiles lga Water soluble flux

    ATT0805-03R0DB-T1

    Abstract: No abstract text available
    Text: AT02M750.04 - Page 1 of 2 Preliminary Currently in development Construction: •    High Purity Alumina Substrate Ni alloy thin-film resistive elements Ground-Signal-Ground GSG , Land Grid Array (LGA) construction Immersion gold over Ni terminations


    Original     		PDF AT02M750 0-10dB DC-30Ghz ATT0805 10GHz 10GHz 20GHz 20GHz 30GHz ATT0805-03R0DB-T1

    RF Board 600-034

    Abstract: 25361 895910 data+8873+64+pin+colour+tv+ic
    Text: AH4 The Communications Edge High Dynamic Range Amplifier Product Features Product Description Functional Diagram The AH4 is a high dynamic range amplifier • 0.25-6 GHz Bandwidth Pin 1 indicator packaged in a Land Grid Array LGA surface • 41 dBm Output IP3


    Original     		PDF 1-800-WJ1-4401 RF Board 600-034 25361 895910 data+8873+64+pin+colour+tv+ic

    AH 05

    Abstract: AH05AB
    Text: AH4 The Communications Edge High Dynamic Range Amplifier Actual Size Product Description The AH4 is a high dynamic range amplifier packaged in a Land Grid Array LGA surface mount package for applications thru 6 GHz. The combination of low noise figure and high output


    Original     		PDF 1-800-WJ1-4401 AH 05 AH05AB

    C25704-002

    Abstract: LGA 775 Socket PIN layout Nidec fan C25704-002 LGA775 thermal design guide PENTIUM D lga775 WIRING 33 2U nidec 775 AVC cooler LGA775 SOCKET PIN LAYOUT lga 775 socket details
    Text: Intel Pentium® 4 Processor on 90 nm Process in the 775-Land LGA Package for Embedded Applications Thermal Design Guide July 2005 Order #302822-002 Contents INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


    Original     		PDF 775-Land C69175 PSC-2U001 775-Land C25704-002 LGA 775 Socket PIN layout Nidec fan C25704-002 LGA775 thermal design guide PENTIUM D lga775 WIRING 33 2U nidec 775 AVC cooler LGA775 SOCKET PIN LAYOUT lga 775 socket details

    lga16 land pattern

    Abstract: LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97
    Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Introduction This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. Note: April 2008 Data provided in this document are to be intended as reference for PCB design and


    Original     		PDF TN0018 lga16 land pattern LGA16 footprint TN0018 LGA 16L 4x4x1 LGA16 L footprint LGA16 LGA land pattern ST LGA-16 JESD97

    LGA16 footprint

    Abstract: TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land
    Text: TN0018 Technical note Linear accelerometers in LGA package surface mounting guidelines Abstract This document is a general guidelines about soldering accelerometer products packaged in LGA surface mount. October 2006 Rev 1 1/13 www.st.com Contents TN0018 Contents


    Original     		PDF TN0018 LGA16 footprint TN0018 lga16 land pattern LGA16 L footprint 788755 LGA voiding LGA16 JESD97 LGA14 lga16 land