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    MADP-000208-13180W Search Results

    MADP-000208-13180W Result Highlights (3)

    Part ECAD Model Manufacturer Description Download Buy
    68000-208HLF Amphenol Communications Solutions BergStikĀ®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 8 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 2.41 mm (0.095 in.) Tail Visit Amphenol Communications Solutions
    68000-208-030030LF Amphenol Communications Solutions BergStikĀ®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch Visit Amphenol Communications Solutions
    68000-208-100030LF Amphenol Communications Solutions BergStikĀ®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch Visit Amphenol Communications Solutions