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    MAT10050 Search Results

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    MAT10050 Price and Stock

    MACOM MAT10050

    RF ATTENUATOR 5DB DIE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MAT10050 Tray 3,800 100
    • 1 -
    • 10 -
    • 100 $14.7937
    • 1000 $13.03279
    • 10000 $13.03279
    		Buy Now
    Mouser Electronics MAT10050 200
    • 1 -
    • 10 -
    • 100 $14.98
    • 1000 $13.1
    • 10000 $13.1
    		Buy Now
    Richardson RFPD MAT10050 300 1
    • 1 $5.33
    • 10 $5.33
    • 100 $5.33
    • 1000 $5.33
    • 10000 $5.33
    		Buy Now

    MAT10050 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    MAT10050 M/A-Com RF/IF and RFID - Attenuators - RF ATTENUATOR 5DB DIE Original PDF

    MAT10050 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    MSPD2018

    Abstract: MZBD-9161 ZENER 15B1 msd700 package inductance MSPD2018-H50 B20 zener diode glass MPN7320 MZBD9161 MLP7121 15B1 zener diode
    Text: Aeroflex / Metelics, Inc. Microwave Diodes & Passive Semiconductor Devices Microwave Diodes & Passive Semiconductor Devices Aeroflex / Metelics, Inc. Aeroflex / Metelics, Inc. East Coast Operations 54 Grenier Field Road, Londonderry, NH 03053 Tel: 603 641-3800


    Original     		foc17091 MSPD2018 MZBD-9161 ZENER 15B1 msd700 package inductance MSPD2018-H50 B20 zener diode glass MPN7320 MZBD9161 MLP7121 15B1 zener diode PDF

    MAT10030

    Abstract: Aeroflex / Metelics
    Text: Attenuator Pads MAT Series Datasheet RoHS General Information These fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped


    Original     		PDF

    MAT10030

    Abstract: MAT10060 MAT10020 MAT100 MAT10080 MAT10300 mat10010 MAT10070 MAT10040 MAT10100
    Text: Attenuator Pads MAT Series Datasheet RoHS General Information These fixed attenuator chips are fabricated using our state of the art thin film metallization and advanced photolithography technology. All devices are available in chip form with a metalized ground connection on the back. This ground is wrapped


    Original     		PDF