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    MATERIAL FOR BALL GRID ARRAY PACKAGING Search Results

    MATERIAL FOR BALL GRID ARRAY PACKAGING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    MATERIAL FOR BALL GRID ARRAY PACKAGING Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


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    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


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    IPC-6012

    Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
    Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel


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    PDF 1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525

    hcte

    Abstract: AN3300 MPC7410 MPC7410CE MPC7410EC AN3442 AN2920 freescale LTCC
    Text: Freescale Semiconductor Application Note Document Number: AN3442 Rev. 0, 09/2007 MPC7410 Package Options by Allen Christenson. NCSG Linda Bal, NCSG Freescale Semiconductor, Inc. Austin, TX The purpose of this application note is to discuss the packaging options available for the MPC7410 product


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    PDF AN3442 MPC7410 mid-2008; hcte AN3300 MPC7410CE MPC7410EC AN3442 AN2920 freescale LTCC

    TLC 1050

    Abstract: FAA064 spansion Packing and Packaging Handbook DATE CODE Transistor Bo 17 Datasheet spansion Packing and Packaging Handbook WNF008
    Text: ‹ Chapter 6 Tape and Reel CHAPTER 6 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 6-1 ‹ Chapter 6 Tape and Reel INTRODUCTION A tape-and-reel packing container is available for shipment of the following Spansion products: single-chip FBGA packages


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    PDF 56-Lead 25917b TLC 1050 FAA064 spansion Packing and Packaging Handbook DATE CODE Transistor Bo 17 Datasheet spansion Packing and Packaging Handbook WNF008

    BGA 731

    Abstract: bga thermal cycling reliability material for ball grid array packaging
    Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board


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    28F160

    Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
    Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


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    JESD51-9

    Abstract: VFBGA package tray AN 7823 JESD51-2 vFBGA* 96 bALL WFBGA lfbga Encapsulation thermal resistance TRAY 15X15 tfBGA PACKAGE thermal resistance tray vfbga
    Text: FBGA Fine Pitch Ball Grid Array • Array molded, cost effective, space saving package solution • Available in 1.40mm LFBGA , 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness • Laminate substrate based package which enables 2 and 4 layers of


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    smd transistor mark E13

    Abstract: Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4
    Text: MicroStar BGAt Packaging Reference Guide Literature Number: SSYZ015B Third Edition – September 2000 MicroStar BGA is a trademark of Texas Instruments Incorporated. Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue


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    PDF SSYZ015B smd transistor mark E13 Modified Coffin-Manson Equation Calculations senju solder paste m10 f12 A10D10 P6K6 BGA reflow guide Senju metal flux T5 k5m6 K793 T4V4

    thermal printer 2 inch

    Abstract: hermetic packages PCB land Solder paste stencil life IPC-A610A paste profile pcb board pin in paste X-RAY INSPECTION RT1400B6 SN63
    Text: Note Number AN-C1-PCAG-A Printed Circuit Assembly Guidelines PRINTED CIRCUIT ASSEMBLY GUIDELINES APPLICATION NOTE INTRODUCTION Use of industry leading circuit deposition methods and equipment enables us to provide the highest packaging density and reliability while eliminating


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    hp laptop MOTHERBOARD pcb CIRCUIT diagram

    Abstract: hp laptop battery pack pinout SCBD002C hp laptop battery pinout sn74154 SN74LVC1G373 SDFD001B 4052 IC circuit diagram lg crt monitor circuit diagram PLL CD 4046
    Text: LOGIC OVERVIEW 1 PRODUCT INDEX 2 FUNCTIONAL CROSS−REFERENCE 3 DEVICE SELECTION GUIDE 4 PACKAGING AND MARKING INFORMATION A LOGIC PURCHASING TOOL/ALTERNATE SOURCES B LOGIC SELECTION GUIDE SECOND HALF 2004 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,


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    PLL WITH VCO 4046 appli note philips

    Abstract: CD74HC4050 marking microstar ms 4011 CI 40106 8952 microcontroller ic 4017 decade counter datasheet ic HC 4066 AG GK 7002 7 SEGMENT DISPLAY LT 543 PIN CONFIGURATION LA 4508 as af power amplifier
    Text: LOGIC OVERVIEW 1 PRODUCT INDEX 2 FUNCTIONAL CROSS−REFERENCE 3 DEVICE SELECTION GUIDE 4 PACKAGING AND MARKING INFORMATION A LOGIC PURCHASING TOOL/ALTERNATE SOURCES B LOGIC SELECTION GUIDE FIRST HALF 2004 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications,


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    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Text: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


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    BGA 256 PACKAGE power dissipation

    Abstract: capacitance in BGA package BGA 256 PACKAGE thermal resistance bga Crack Intel BGA Solder
    Text: Technical Notes December 8, 1997 Revision 1.0 THERMAL, ELECTRICAL AND MECHANICAL CONSIDERATIONS IN APPLYING BGA TECHNOLOGY TO A DESIGN ABSTRACT This document briefly discusses the thermal, mechanical and electrical design considerations associated with using ball-grid array components.


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    PDF com/design/i960/packdata/2451 BGA 256 PACKAGE power dissipation capacitance in BGA package BGA 256 PACKAGE thermal resistance bga Crack Intel BGA Solder

    74LS series logic gates 3 input or gate

    Abstract: sn74 series TTL logic gates list 4017 counter IC datasheet data sheet ic 4017 IC CD 4033 pin configuration CMOS Data Book Texas Instruments Incorporated 74LS series logic gates hp 4514 TEXAS INSTRUMENTS SN7400 SERIES ic 4026 down counter
    Text: LOGIC OVERVIEW 1 FOCUS ON THE IDEAL LITTLE LOGIC SOLUTION 2 FUNCTIONAL INDEX 3 FUNCTIONAL CROSSĆREFERENCE 4 DEVICE SELECTION GUIDE 5 PACKAGING AND MARKING INFORMATION A LOGIC PURCHASING TOOL/ALTERNATE SOURCES B LOGIC SELECTION GUIDE FIRST HALF 2002 IMPORTANT NOTICE


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    Untitled

    Abstract: No abstract text available
    Text: Packaging technology PSGA – an innovative IC package for single and multichip designs More and more applications with multipin ICs or multichip systems require even smaller, flatter and more economical packages. The innovative PSGATM polymer stud grid array package for


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    PDF 232-pin, B-3001 B-8020

    thick bga tray size

    Abstract: K179 PEAK TRAY bga K180 PEAK tray drawing TRAY JEDEC BGA DRAWING Datum Electronics type 121 HASL summit
    Text: Application Specification 114- 13101 STEP- Z* Printed Circuit PC Board Connectors NOTE i 12 AUG 09 Rev H All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and


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    Coffin-Manson Equation

    Abstract: CHN 841 PP266 powerpc 620 was developed The PowerPC Microprocessor Family CBGA CBGA 255 motorola metal package case 603 MOTOROLA
    Text: Motorola's PowerPC 603 and PowerPC 604™ RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect Technology Gary B. Kromann, David Gerke, Wayne Huang m Advanced Packaging Technology 6501 William Cannon Dr., OE55 Semiconductor Products Sector Austin, Texas 78735


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    PDF 603TM 604TM 21x21 PowerPC603 PowerPC604 Coffin-Manson Equation CHN 841 PP266 powerpc 620 was developed The PowerPC Microprocessor Family CBGA CBGA 255 motorola metal package case 603 MOTOROLA

    MPGA479M

    Abstract: material for ball grid array packaging amp micro pga socket
    Text: | | | Search Products Documentation Resources My Account Home > Products > By Type > Socket/Card Products 5 - 1674770 Customer Support > Product Feature Selector > Product Details - 2 Product Details Quick Links PGA Sockets Statement of Compliance Always EU RoHS/ELV Compliant


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    PDF 26x26 mPGA47X MPGA479M material for ball grid array packaging amp micro pga socket

    EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES

    Abstract: AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP
    Text: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.


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    PDF JESD51, EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES AS 108-120 Plastic Encapsulate Diodes D2863 tube pl84 144 QFP body size die electric sealer PL84 tube MO-047 footprint jedec MS-026 TQFP

    Coffin-Manson Equation

    Abstract: 44th land pattern BGA c4 freescale CHN 841
    Text: Freescale Semiconductor, Inc. Motorola's PowerPC 603 and PowerPC 604™ RISC Microprocessor: the C4/Ceramic-ball-grid Array Interconnect Technology Gary B. Kromann, David Gerke, Wayne Huang Advanced Packaging Technology Freescale Semiconductor, Inc. 6501 William Cannon Dr., OE55


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    PDF 603TM 604TM elerPC603 PowerPC604 Coffin-Manson Equation 44th land pattern BGA c4 freescale CHN 841

    Untitled

    Abstract: No abstract text available
    Text: Patterned Substrate Products: High Density Interconnect Products G en eral EFI has state-of-the-art thin-film high density packaging technology in the area of MCM, polyimide multilayer, and perpendicular-edge thick conductor technologies. By partnering with customers to develop


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    Untitled

    Abstract: No abstract text available
    Text: Patterned Substrate Products: High Density Interconnect Products -EFI has state-of-the-art thin-film high density packaging technology in the area of M CM , polyimide


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