MATERIAL FOR BALL GRID ARRAY PACKAGING Search Results

MATERIAL FOR BALL GRID ARRAY PACKAGING Result Highlights (5)

Part	Manufacturer	Description
TPH9R00CQH	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC	Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM	Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

MATERIAL FOR BALL GRID ARRAY PACKAGING Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Intel reflow soldering profile BGA Abstract: socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal Text: 2 14 An Introduction to Plastic Ball Grid Array PBGA Packaging 1/17/97 9:57 AM CH14WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 14 AN INTRODUCTION TO PLASTIC BALL GRID ARRAY (PBGA) PACKAGING 14.1. INTRODUCTION The plastic ball grid array (PBGA) is today on its way to becoming one of the most popular	Original	PDF	CH14WIP Intel reflow soldering profile BGA socket s1 REFLOW PROFILE intel topside mark outline of the heat slug for JEDEC heat pipes intel pbga package weight BGA OUTLINE DRAWING intel mother board circuit land pattern BGA 0,50 324 bga thermal
PBGA 256 reflow profile Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75 Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)	Original	PDF
Intel reflow soldering profile BGA Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764 Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems	Original	PDF
Side Brazed Ceramic Dual-In-Line Packages Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year	Original	PDF
pcb warpage in ipc standard Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)	Original	PDF
CERAMIC CHIP CARRIER LCC 68 socket Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a	Original	PDF
IPC-6012 Abstract: IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525 Text: Maxim > App Notes > General Engineering Topics Prototyping and PC- Board Layout Wireless and RF Keywords: chip scale package, flip chip, CSP, UCSP, U- CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-level packaging WLP and its applications Abstract: This application note discusses Maxim's wafer-level package (WLP). Topics include: wafer construction, tape-and-reel	Original	PDF	1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6012 IPC-D-279 IPC-6013 IPC-6016 IPC-2223 ipc 7094 IPC-7094 IPC-2226 IPC-6011 IPC-7525
IPC-6011 Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222 Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications	Original	PDF	1000x com/an1891 AN1891, APP1891, Appnote1891, IPC-6011 IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
Kostat tray Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13 Text: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher	Original	PDF	and5-741-9148 Kostat tray KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
QFP PACKAGE thermal resistance Abstract: 017AG QFP PACKAGE thermal resistance die down ceramic QFP Package 100 lead TS83084G0 CQFP68 TS81102G0 TS8308500GL TS83102G0B TS8388BGL Text: Packaging of Atmel Data Conversion Circuits Introduction This document aims at highlighting the main issues in thermal management for fast and dense devices such as the Atmel Data Conversion products ADCs and DMUX . It especially deals with packaging, electrical and thermal considerations in order to put	Original	PDF	TS83xxxxx/ AT84xxx TS81102G0 QFP PACKAGE thermal resistance 017AG QFP PACKAGE thermal resistance die down ceramic QFP Package 100 lead TS83084G0 CQFP68 TS81102G0 TS8308500GL TS83102G0B TS8388BGL
SPRU811 Abstract: BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate Text: Flip Chip Ball Grid Array Package Reference Guide Literature Number: SPRU811A May 2005 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue	Original	PDF	SPRU811A SPRU811 SPRU811 BGA reflow guide ionograph ionograph spec SZZA021B bga dye pry EndoScope schematic endoscope case to board cte table flip chip substrate
footprint jedec MS-026 TQFP Abstract: footprint jedec MS-026 LQFP JEDEC TRAY ssop footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP 44 MS-026 BED BGA package tray 40 x 40 AMD Package moisture MO-069 footprint jedec MS-026 TQFP 144 Text: u Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Surface-Mount Array Packages Column Grid Array Packages Surface-Mount Leaded Packages Thru-Hole Packages Packages and Packing Publication Revision A 3/1/03 2-1 u Chapter 2 Package Design SURFACE-MOUNT ARRAY PACKAGES	Original	PDF
S1998 Abstract: Coffin-Manson Equation CBGA manson 100C 110C N100 N50M IBM supports ccga CBGA 304 motorola Text: CBGA FATIGUE LIFE IMPROVEMENT Marie S. Cole, Gregory B. Martin, Peter J. Brofman and Lewis S. Goldmann IBM Microelectronics Hopewell Jct, New York 12533 Biography Marie Cole is a Senior Engineer in Ceramic Packaging Applications at IBM Microelectronics. She holds a B.S.	Original	PDF
hcte Abstract: AN3300 MPC7410 MPC7410CE MPC7410EC AN3442 AN2920 freescale LTCC Text: Freescale Semiconductor Application Note Document Number: AN3442 Rev. 0, 09/2007 MPC7410 Package Options by Allen Christenson. NCSG Linda Bal, NCSG Freescale Semiconductor, Inc. Austin, TX The purpose of this application note is to discuss the packaging options available for the MPC7410 product	Original	PDF	AN3442 MPC7410 mid-2008; hcte AN3300 MPC7410CE MPC7410EC AN3442 AN2920 freescale LTCC

transistor b 1238 Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than	Original	PDF
BGA-56 DATASHEET Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION Text: pkg-3.7-04/99 Packaging Introduction . 4-3 Package Options: Table . 4-3	Original	PDF
Strain gage report Abstract: with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG Text: Application Report SPRAA55 - August 2004 Use and Handling of Semiconductor Packages with ENIG Pad Finishes Eddie Moltz DSP Packaging ABSTRACT Electroless Nickel/Immersion Gold plating, or ENIG, is a versatile process and enables fabrication of high-density flip chip BGA substrates needed for high-performance IC chips.	Original	PDF	SPRAA55 Strain gage report with or without underfill flip SMT Texas "Strain Gage" ENIG strain rate texas instruments automotive flip chip underfill Texas alternative ENIG
TLC 1050 Abstract: FAA064 spansion Packing and Packaging Handbook DATE CODE Transistor Bo 17 Datasheet spansion Packing and Packaging Handbook WNF008 Text: Chapter 6 Tape and Reel CHAPTER 6 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Methodologies Handbook 17 Oct 2008 6-1 Chapter 6 Tape and Reel INTRODUCTION A tape-and-reel packing container is available for shipment of the following Spansion products: single-chip FBGA packages	Original	PDF	56-Lead 25917b TLC 1050 FAA064 spansion Packing and Packaging Handbook DATE CODE Transistor Bo 17 Datasheet spansion Packing and Packaging Handbook WNF008
BGA 731 Abstract: bga thermal cycling reliability material for ball grid array packaging Text: BGA Adapters Ball Grid Array BGA Adapters Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board	Original	PDF
BGA 328 Abstract: No abstract text available Text: u Chapter 8 Tape and Reel CHAPTER 8 TAPE AND REEL Introduction Design and Materials Device Count per Reel Reel Dimensions and Labels Tape Dimensions Packages and Packing Publication Revision A 3/1/03 8-1 u Chapter 8 Tape and Reel INTRODUCTION AMD offers a tape-and-reel packing container for PLCC, SOIC,	Original	PDF	44-Lead 48-Lead 80-Lead BGA 328
28F160 Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than	Original	PDF
intel packaging Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than	Original	PDF	CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Untitled Abstract: No abstract text available Text: Patterned Substrate Products: High Density Interconnect Products G en eral EFI has state-of-the-art thin-film high density packaging technology in the area of MCM, polyimide multilayer, and perpendicular-edge thick conductor technologies. By partnering with customers to develop	OCR Scan	PDF
Untitled Abstract: No abstract text available Text: Patterned Substrate Products: High Density Interconnect Products -EFI has state-of-the-art thin-film high density packaging technology in the area of M CM , polyimide	OCR Scan	PDF

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MATERIAL FOR BALL GRID ARRAY PACKAGING Search Results

MATERIAL FOR BALL GRID ARRAY PACKAGING Result Highlights (5)

MATERIAL FOR BALL GRID ARRAY PACKAGING Datasheets Context Search

Intel reflow soldering profile BGA

PBGA 256 reflow profile

Intel reflow soldering profile BGA

Side Brazed Ceramic Dual-In-Line Packages

pcb warpage in ipc standard

CERAMIC CHIP CARRIER LCC 68 socket

IPC-6012

IPC-6011

Kostat tray

QFP PACKAGE thermal resistance

SPRU811

footprint jedec MS-026 TQFP

S1998

hcte

transistor b 1238

BGA-56 DATASHEET

Strain gage report

TLC 1050

BGA 731

BGA 328

28F160

intel packaging

Untitled

Untitled