Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    MCKENZIE SOCKET DIVISION PGA Search Results

    MCKENZIE SOCKET DIVISION PGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB15SKT0-000 D-Subminiature (DB15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB50SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals Datasheet

    MCKENZIE SOCKET DIVISION PGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PDF PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    MO-83-AF

    Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 MO-83-AF PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    mckenzie

    Abstract: valox 420 salt MIL-P-13949 DC600P-118-FR50 McKenzie socket division pga zytel fr50 mil-m-24519 molding plastics McKenzie technology sip zytel fr 72 ASTM-B487-79
    Text: Specialty DIP Sockets E L E C T R O N I C S I80K McKenzie Socket Division DIP Clamps • Positive 1C retention in high shock or vibration environments • Designed to fit McKenzie Technology's standard open or closed frame B DIP sockets DIP INSULATOR CENTERS


    OCR Scan     		PDF CPPDC300C-118- DC300P-090-FR50 DC600P-118-FR50 mckenzie valox 420 salt MIL-P-13949 DC600P-118-FR50 McKenzie socket division pga zytel fr50 mil-m-24519 molding plastics McKenzie technology sip zytel fr 72 ASTM-B487-79

    McKenzie socket division

    Abstract: No abstract text available
    Text: Specialty DIP Sockets ELECTRONICS MK McKenzie Socket Division DIP Clamps • Positive 1C retention in high shock or vibration environm ents • Designed to fit M cKenzie Technology's standard open or closed fram e DIP sockets DIP INSULATOR CENTERS THICKNESS


    OCR Scan     		PDF DC300P-090-FR50 DC600P-118-FR50 McKenzie socket division

    011B

    Abstract: MIL-P-13949 MIL-STD-109 Brass per QQ-B-626, Alloy 360 McKenzie IEC-68-2-14 410B zytel fr50 HT2004 dip molding machine
    Text: fflCX McKenzie Socket Division • Integral Decoupling Capacitor reduces noise • SMT construction eliminates capacitor intermittence during thermal cycling GROUND PLANE • Three standard capacitance values: .01, .10, .33 jf — Specify in part number • For other capacitance values, please consult factory


    OCR Scan     		PDF CONTACT-160B 011B MIL-P-13949 MIL-STD-109 Brass per QQ-B-626, Alloy 360 McKenzie IEC-68-2-14 410B zytel fr50 HT2004 dip molding machine

    McKenzie socket division

    Abstract: No abstract text available
    Text: fflSX McKenzie Socket Division Insulator Options 3 LEVEL W IRE W RAP 2 LEVEL W IRE W RAP OPEN FRAME Standard Insertion Force Standard Insertion Force Specify Contact/Shell 400B 30p" Gold/200 j" Tin Specify Contact/Shell 41 OB 30p" Gold/200|j" Tin 30p" Gold/10p" Gold


    OCR Scan     		PDF Gold/200 Gold/10p" Gold/200p" Gold/10p McKenzie socket division

    862S

    Abstract: FR 530 POLYESTER UL MIL-P-13949 924H ASTM-B567 McKenzie technology sip pga socket 867s 867s gold socket McKenzie socket division
    Text: fnKC McKenzie Socket Division — r .460 r .585 I 14,86 •250 (6,35) 1 ,210(11’,68) Plating/Material Specify Plating/Material Specify Plating/Material 870S 10p" Gold/Brass 861S 10|j" Gold/Brass 867S 10p" Gold/Phosphor Bronze PTH = .027 ± .003 857S 200|j" Tin/Brass


    OCR Scan     		PDF 018-typ 862S FR 530 POLYESTER UL MIL-P-13949 924H ASTM-B567 McKenzie technology sip pga socket 867s 867s gold socket McKenzie socket division

    QQ-B-750

    Abstract: alloy 25 BeCu McKenzie technology sip gold 400B 401B 402B 403B 410B 411B ASTM-B487-79
    Text: fflCX McKenzie Socket Division Insulator Options 3 LEVEL WIRE WRAP 2 LEVEL WIRE WRAP 1 r .116 2.95 u .360 (9,14) .0 2 5 (0,63) SQ OPEN FRAME T .116 (2,951 .193 (4,90) .193 (4,90) .500 (12,70) .0 2 5 (0,63) SQ Standard Insertion Force Standard Insertion Force


    OCR Scan     		PDF Gold/200 Gold/200^ Gold/10 QQ-B-750 alloy 25 BeCu McKenzie technology sip gold 400B 401B 402B 403B 410B 411B ASTM-B487-79

    McKenzie

    Abstract: McKenzie socket division pga ASTM-B487-79 McKenzie technology pga McKenzie socket division
    Text: High Profile DSP Sockets E L E C T R O N I C S DSC McKenzie Socket Division Elevated DIP Sockets How to Order .DIP, - 3 2 0, - ,3 0 0 B, # of Contacts Product Code D Hi-Temp Material Call Out (Option Contact Style Closed Frame (Option)* Row-to-Row Spacing


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Low Profile SIP Sockets E L E C T R O N I C S fflOK McKenzie Socket Division Features LOWEST PROFILE OPTIONS ULTRA LOW PROFILE OPTIONS • Profiles as low as .016" 0 ,4 1 ab ove P C B • X and Y stackable • Single and Dual R ow available Specify Contact/Shell


    OCR Scan     		PDF Gold/200nâ Tin/200p" Gold/200p" Gold/10M

    BERG strip 40 pin single row

    Abstract: E 877 11 94V-0 ASTM-B567 BERG 6 pin dual row ASTM-B487-79 solder tail sip socket McKenzie technology sip gold TEFZEL McKenzie technology pga ASTM-A-754-79
    Text: SIP Sockets E L E C T R O N I C S flMK McKenzie Socket Division SHORTER SOLDER TAIL — NO TRIMMING .1 6 5 4 ,1 9 , .265 1 (6.73) .100 .0 2 0 - OUR MOST POPULAR CONTACT .165 (4,19) .230 (5,84) .030 (0,76) .020 — (0,51) (2 .5 4 ) (0.51) f .290 (7.37) .125


    OCR Scan     		PDF Tin/200M" Gold/200M" Gold/10M" 35nts BERG strip 40 pin single row E 877 11 94V-0 ASTM-B567 BERG 6 pin dual row ASTM-B487-79 solder tail sip socket McKenzie technology sip gold TEFZEL McKenzie technology pga ASTM-A-754-79

    McKenzie socket division

    Abstract: No abstract text available
    Text: ZIP Sockets E L E C T R O N I C S MK McKenzie Socket Division Features LOW PROFILE • For high density m em ory using vertical •lOO (4,19 J TYP. zig -zag in-line patterns _L n r X .125 T (3,17) -.020 (0,51) TYP. Specify Contact/Shell 001B • Available in 16, 18, 2 0 , 2 4 , and 2 8 positions


    OCR Scan     		PDF Gold/200 Gold/10 Gold/200n, Tin/200p" McKenzie socket division

    mil-m-24519 molding plastics

    Abstract: McKenzie technology McKenzie 01-4B solder tail sip socket 001B 011B 113B fr4 94v0 TEFZEL
    Text: Open and Closed Frame DIP Sockets E X TR A LO N G S O LD E R TAILS ,i§ .116 2,951 H r1 i U 1 1 , Fj83 (+, 65 x x x . T TYP . . . A ll contact styles ^ a r e available in our Patented PPC Disposable Carrier System. Specify PPC in part number. 1.17 3


    OCR Scan     		PDF Gold/10p" Gold/200 n/200 Gold/200fj" mil-m-24519 molding plastics McKenzie technology McKenzie 01-4B solder tail sip socket 001B 011B 113B fr4 94v0 TEFZEL

    Untitled

    Abstract: No abstract text available
    Text: fUKC M cKenzie Socket Division — r .585 ' 14,86 •250 V (6,35) G .180 .018— (0,46) (4.57) TYP Specify Specify Plating/Material Plating/Material Specify Plating/Material 870S 10p" Gold/Brass 861S 10p" Gold/Brass 867S 10p" Gold/Phosphor Bronze PTH = .027 ± .003


    OCR Scan     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Ultra Low Profile DIP Sockets ELECTRONICS MX McKenzie Socket D ivision Features • Profiles to .083" (2,11 above PCB • Available in our PPC disposable carrier system • Hi-Rel multifinger contacts are non-solder wicking U LTR A LOW PRO FILE OPTIONS


    OCR Scan     		PDF Gold/200p" old/200 old/10pâ old/200p

    Untitled

    Abstract: No abstract text available
    Text: Mal@4 -MaSe DIP Headers E L E C T R O N I C S fflex M cKenzie Socket Division Insulator Options Low Profile Options ,. 020- .050 1.27 I I T (0 .51 ) _ L .335 ,.085, I (2.]6) 1 (8,51) TYP I I £ 1 .104 (2,64) I-.070 (1,78) .299 (7.60) r TTT25 (3.18) .020 '


    OCR Scan     		PDF TTT25

    Untitled

    Abstract: No abstract text available
    Text: DIP Sockets E L E C T R O N I C S DISK M cKenzie Socket Division Open and Closed Frame DIP Sockets EXTRA LONG SOLDER TAILS 'h _ '^ 4 'S fes f c ; .116 2,95 P n U 1 H , I .183 (4,65) .020— 1 (0,51) TYP Specify . . x x x I Contact/Shell 091B 30p" Gold/10p" Gold


    OCR Scan     		PDF Gold/10p" Gold/200 /Tin/200

    Untitled

    Abstract: No abstract text available
    Text: Elevated SIP Sockets ELECTRONICS mac M cKenzie S ocket D ivisio n Features • Elevated Sockets allow for greater package density • Allows stacking of PCB • Maximizes airfow • Available in Hi-Temp P P S Insulator material STANDARD TEMPERATURE — UL 94V-0 THERMOPLASTIC


    OCR Scan     		PDF