hakko 907
Abstract: hakko 850 METCAL SP200 AC1102 HAKKO 937 2200C metcal Weller EC1302A AC1101
Text: Fume Extraction Systems OK O K I N T E R N A T I O N A LT M T o o l s OK International has been a leading manufacturer of tools for the electronics assembly work bench for almost 60 years. And, under the Metcal and Impell brand names, OK International has been an innovator in efficient, cost-effective systems to protect operators from hazardous fumes.
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BRO-FE-US-05
hakko 907
hakko 850
METCAL SP200
AC1102
HAKKO 937
2200C
metcal
Weller EC1302A
AC1101
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sdc 603
Abstract: SDC-602 plcc 52 SOCKET sdc603 MX-500P-21 sdc 606 sdc606 STTC-136 132 qfp extraction tool METCAL SP200
Text: soldering desoldering & rework systems contents and preface Contents 1 Introducing the QX2 2 QX2 system elements and functions 3 QX2 system elements and functions 4 Part numbers for the QX2 5 The power of SmartHeat 6 The power of SmartHeat 7 MX rework systems
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weller ec 4000
Abstract: WRS3000 METCAL SP200 metcal ps-800 transistor WT4 wsp80 WT4 Transistor SSC50 weller wsp80 WD1000M
Text: WRS3000X Soldering/Desoldering Station PS-800 and PS-800E Soldering System Features: • The PS-800 Soldering System is compact for repetitive manual soldering and touch-up • Utilizes SmartHeat Technology • Requires no calibration • Uses replaceable heater tips rather than cartridges
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WRS3000X
PS-800
PS-800E
PS800
PS800E
PHT-650325
PHT-650335
PHT-651355
PHT-6513-ND
weller ec 4000
WRS3000
METCAL SP200
metcal ps-800
transistor WT4
wsp80
WT4 Transistor
SSC50
weller wsp80
WD1000M
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metcal ps-800
Abstract: METCAL SP200 MX-500 metcal circuit ps-800 mx500 pht 094 tips SP200 sfv 04 STTC-1137P
Text: SmartHeat Power TipsTM Our SmartHeat® PowerTipTM technology meets the needs of high thermal demands of lead-free alloys and other high thermal demand applications. In concert with our SmartHeat® technology, we have enhanced both the heater efficiency and thermal transfer characteristics of our tips,
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MX-500
SP200
PS-800
metcal ps-800
METCAL SP200
metcal circuit ps-800
mx500
pht 094
tips
sfv 04
STTC-1137P
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IPC-7527
Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2
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transistor working principle
Abstract: weller tinning rf transistor 320 SN62 SN63 Cold solder joint gold embrittlement METCAL MX-500 circuit metcal iron
Text: RF Power Innovations 310 320-6160 AN3025 Transistor Mounting and Soldering Brett Kelley and Eric Hokenson 18 December 2003 Introduction There are three basic steps recommended to mount and solder RF power transistors into a circuit. 1. Solder pre-tin the transistor leads.
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AN3025
transistor working principle
weller
tinning
rf transistor 320
SN62
SN63
Cold solder joint
gold embrittlement
METCAL MX-500 circuit
metcal iron
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AN3025
Abstract: transistor working principle tinning METCAL MX-500 circuit free transistor SN62 SN63 GC Electronics 108109 metcal transistor free
Text: Application Note AN3025 Transistor Mounting and Soldering Rev. 3 Introduction There are three basic steps recommended to mount and solder RF power transistors into a circuit. Solder pre-tin the transistor leads Mount the transistor Solder the transistor leads to the circuit trace
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AN3025
AN3025
transistor working principle
tinning
METCAL MX-500 circuit
free transistor
SN62
SN63
GC Electronics 108109
metcal
transistor free
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74397
Abstract: steinel HG3002LCD steinel "air gun" APR-5000 AN828 AR5000 SiE802DF Simple test MOSFET Procedures PolarPAK WEIGHT
Text: AN828 Vishay Siliconix Working With PolarPAK In-Lab Soldering and Re-Working Recommendations By Kandarp Pandya INTRODUCTION ® PolarPAK , a new-generation Vishay Siliconix power MOSFET package, offers double-sided cooling with a metal surface on both the top and bottom sides. As it
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AN828
SiE802DF
21-Aug-06
74397
steinel
HG3002LCD
steinel "air gun"
APR-5000
AN828
AR5000
Simple test MOSFET Procedures
PolarPAK WEIGHT
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SLMA002
Abstract: "x-ray machine" DCA56 land pattern for tSOP56 powerPAD SMTC-0118 750-W METCAL removal iron TQFP64 land package IPC-7525 SLMA004
Text: Application Report SLMA002E – November 1997 – Revised January 2010 PowerPAD Thermally Enhanced Package Steven Kummerl. ABSTRACT
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SLMA002E
SLMA002
"x-ray machine"
DCA56
land pattern for tSOP56
powerPAD
SMTC-0118
750-W METCAL removal iron
TQFP64 land package
IPC-7525
SLMA004
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Untitled
Abstract: No abstract text available
Text: MFR-2200 Series Dual Simultaneous Output Soldering and Rework System One power supply. Two simultaneous ports. Three hand-pieces to choose from. New MFR Series with SmartHeat Power and Control The MFR-2200 Series Soldering and Rework Systems provide a high power, flexible solution for production soldering, touch-up soldering and SMD rework. SmartHeat®
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MFR-2200
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SLMA002
Abstract: land pattern for tSOP56 double sided pcb, thermal via "x-ray machine" TQFP64 land package cut template DRAWING tsop20 TQFP100 TQFP64 TSOP24
Text: PowerPAD Thermally Enhanced Package TECHNICAL BRIEF: SLMA002 Mixed Signal Products Semiconductor Group 21 November 1997 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information
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SLMA002
SLMA002
land pattern for tSOP56
double sided pcb, thermal via
"x-ray machine"
TQFP64 land package
cut template DRAWING
tsop20
TQFP100
TQFP64
TSOP24
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Untitled
Abstract: No abstract text available
Text: Desoldering Braid & Desoldering Wick | Quick Braid, Sea Braid, One-Step Home About Us Material Safety Data Sheets FEATURED PRODUCTS CROSS REFERENCE PRODUCT OVERVIEW Compliance Documents Distributors Sales Reps Page 1 of 3 Request a Sample Contact Us REPLACEMENT SOLDERING TIPS
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EB9000S
EBBC-10
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Application Note 27703
Abstract: Allegro
Text: SOLDERING OF SURFACE-MOUNT DEVICES Leaded through-hole products Allegro leaded products are designed to be through-hole soldered into printed wiring boards. They will withstand the temperature excursions experienced during hand soldering, reflow soldering, or wave soldering as long as normal, good
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GH-062-1
Application Note 27703
Allegro
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transistor smd marking mx
Abstract: desoldering MFR-PS2200 smd transistor marking MX metcal
Text: Welcome to OK International - Soldering, Rework and Fume Extraction System Home Literature Where to Buy Page 1 of 3 Languages >> Home > Products & Applications > Soldering/Desoldering > MFR-2200 Series > MFR-2240 MFR-2210, MFR-2220, MF
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MFR-2200
MFR-2240
MFR-2210,
MFR-2220,
183cm
122cm
Di28mm
mfr2200/mfr2240
transistor smd marking mx
desoldering
MFR-PS2200
smd transistor marking MX
metcal
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Untitled
Abstract: No abstract text available
Text: Welcome to OK International - Soldering, Rework and Fume Extraction System Home Literature Where to Buy Page 1 of 7 Languages >> Home > Products & Applications > Soldering/Desoldering > MFR-2200 Series > MFR-2211 MFR-2210, MFR-2220, MF
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MFR-2200
MFR-2211
MFR-2210,
MFR-2220,
183cm
122cm
mfr2200/mfr2211
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Allegro
Abstract: No abstract text available
Text: Application Note 26009* APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT DEVICES Leaded through-hole products Allegro leaded products are designed to be through-hole soldered into printed wiring boards. They will withstand the temperature excursions experienced during hand soldering,
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GH-062-1
Allegro
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hallsensor application
Abstract: hallsensor HALL-SENSOR ALLEGRO Hallsensor
Text: Application Note 27703C APPLICATIONS INFORMATION SOLDERING OF THROUGH-HOLE HALL-SENSOR DEVICES Through-hole products Allegro leaded Hall-effect products package codes K, KA, LL, U, and UA are designed to be through-hole soldered into printed wiring boards. They will withstand the temperature
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27703C
GH-062-4
hallsensor application
hallsensor
HALL-SENSOR
ALLEGRO Hallsensor
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Untitled
Abstract: No abstract text available
Text: Application Note 26009 APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT DEVICES Leaded through-hole products Allegro leaded products are designed to be through-hole soldered into printed wiring boards. They will withstand the temperature excursions experienced during hand soldering,
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GH-062-1
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AN2222
Abstract: footprint mlf FOOTPRINT PCB Kester AN-2222 metcal
Text: Application Note AN2222 Flex-Pod Soldering Guide Author: Matt Basinger Associated Project: No Associated Part Family: CY8C21x34, CY8C29x66 Abstract This Application Note provides instructions on soldering PSoC Flex-Pods. Suggested Shop Supplies o Solder o
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AN2222
CY8C21x34,
CY8C29x66
LF218
STTC-036
2331-Zx
AN2222
footprint mlf
FOOTPRINT PCB
Kester
AN-2222
metcal
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hallsensor 120
Abstract: hall-sensor hallsensor Application Note 27703 ALLEGRO Hallsensor an+503+hall+sensor 50G+HALL+SENSOR Hall+sensor+44e
Text: Application Note 27703.2* APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering Manual soldering of surface-mount products is not recommended! Hall sensors are sensitive to thermal shock. When the soldering temperature is high enough, and the transmission of
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GH-062-4
hallsensor 120
hall-sensor
hallsensor
Application Note 27703
ALLEGRO Hallsensor
an+503+hall+sensor
50G+HALL+SENSOR
Hall+sensor+44e
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hallsensor
Abstract: hallsensor application hallsensor 120 metcal ALLEGRO Hallsensor 50G+HALL+SENSOR
Text: Application Note 27703.2 APPLICATIONS INFORMATION SOLDERING OF SURFACE-MOUNT HALL-SENSOR DEVICES Manual soldering Manual soldering of surface-mount products is not recommended! Hall sensors are sensitive to thermal shock. When the soldering temperature is high enough, and the transmission of
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GH-062-4
hallsensor
hallsensor application
hallsensor 120
metcal
ALLEGRO Hallsensor
50G+HALL+SENSOR
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qfn 32 land pattern
Abstract: MO-220 5x5mm "BGA Rework Practices", hakko vqfn 44 land pattern MO-220 qfp 32 land pattern jedec package MO-220 vkkd qfn land pattern
Text: APPLICATION NOTE QFN PACKAGES 32-pin leadless package Introduction to the QFN The QFN Quad Flat No lead package is a near chip scale plastic encapsulated package related to the plastic quad flat package. This style of package comes in several varieties and is known by several names such as MLF, LPCC, and
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32-pin
MO-220
199707558G
qfn 32 land pattern
MO-220 5x5mm
"BGA Rework Practices",
hakko
vqfn 44 land pattern
MO-220
qfp 32 land pattern
jedec package MO-220 vkkd
qfn land pattern
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weller ds100
Abstract: weller ec1000 weller ec 4000
Text: EASYBRAID CO. DESOLDERING BRAID 1 Easy Braid Co. is a manufacturer of desolder wick with an emphasis on continuing advancement in desoldering technology. Established in 1989, Easy Braid Co. quickly achieved widespread recognition in the rework/repair industry with its competitive pricing and innovative
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SW6PFAS-10
SW6PFAS-50
SW6PFAS-100
SW6PFG-10
SW6PFG-50
SW6PFG-100
SW6WC-10
SW6WC-50
SW6WC-100
SW6WF-10
weller ds100
weller ec1000
weller ec 4000
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anaren divider
Abstract: metcal 5000
Text: Model 2425FB50-50E Rev A Ultra Low Profile Filter Balun 50Ω to 100Ω Balanced Description The 2425FB50-50E is a low cost, low profile sub-miniature unbalanced to balanced transformer designed for differential inputs and output locations on next generation wireless chipsets in an easy to use surface mount package covering
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2425FB50-50E
2425FB50-50E
11b/g/n)
anaren divider
metcal 5000
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