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    Text: PDF: 2003 Jun 19 Philips Semiconductors PC board footprint HBCC24; SOT564-1 FOOTPRINT REFLOW SOLDERING handbook, full pagewidth PA = OA = 4.40 (2x) 2.05 (2×) 1.275 (2×) solder lands solder resist 0.075 0.50 (16×) clearance 0.150 0.40 (9×) solder paste


    Original     		HBCC24; OT564-1 MGX376 PDF