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    MIL-STD-750 METHOD 3161 Search Results

    MIL-STD-750 METHOD 3161 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    MIL-STD-750 METHOD 3161 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: INCH-POUND The documentation and process conversion measures necessary to comply with this revision shall be completed by 1 June 2013. MIL-PRF-19500/661D 17 April 2013 SUPERSEDING MIL-PRF-19500/661C 7 August 2006 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, FIELD EFFECT RADIATION HARDENED


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    PDF MIL-PRF-19500/661D MIL-PRF-19500/661C 2N7444, 2N7434, 2N7391, 2N7392, MIL-PRF-19500.

    capacitor 226 35K 022 electrolytic

    Abstract: 3216 footprint IPC TANTALUM smd capacitor 685 35K KC-1206 BB GP 031 smd LD33 capacitor 476 35K 026 2824 footprint dimension MIL-STD-1285 Commercial "L", SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
    Text: Surface Mount Multilayer Ceramic Capacitors Commercial Grade Surface Mount Multilayer Ceramic Chip Capacitors One world. One KEMET. Surface Mount Multilayer Ceramic Capacitors Commercial Grade Table of Contents Page Why Choose KEMET. 4


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    PDF 15bis capacitor 226 35K 022 electrolytic 3216 footprint IPC TANTALUM smd capacitor 685 35K KC-1206 BB GP 031 smd LD33 capacitor 476 35K 026 2824 footprint dimension MIL-STD-1285 Commercial "L", SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)

    Untitled

    Abstract: No abstract text available
    Text: Assembly Instructions for bipolar Chips Assembly Instructions for MOS/IGBT Chips Assembling Recommended Solder System IXYS bipolar semiconductor chips have a soft-solderable, multilayer metallization Ti/Ni/Ag on the bottom side and, on top, either the same metallization scheme or an alumunium layer


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    Untitled

    Abstract: No abstract text available
    Text: Assembly Instructions MOS/IGBT Chips Recommended Solder System IXYS recommends a soft solder chip attach using a solder composition of 92.5 % Pb, 5 % Sn and 2.5 % Ag. The maximum chip attach temperature is 460°C for MOSFET and 360°C for HiPerFETTM and IGBT.


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    CTS 750 series

    Abstract: 3570 1301 051 94v0 1052 schematic amplify CV 203 TMC 3162 3570 1301 PSA 88C Delco Electronics 3570 1301 151 Delco Electronics 185
    Text: R E S I S T O R P R O D U C T S The CTS Resistor Products Catalog is also on the World Wide Web at www.ctscorp.com. The Web Catalog is updated regularly to provide all customers with the latest information on new products and improvements. You can also contact us at


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    IXFd50n20

    Abstract: IXGD32N60B IXFD75N10 IXTD5N100 IXTH40N25 91x0 IXGH25N120A IXTD5N100-5T IXGD32N60B-5X IXGD8N100-2L
    Text: Chips and DCB Ceramic Substrates Contents Page General Information for Chips IGBT Chips J-2 VCES IC VCE sat G-Series, Low VCE(sat) type G-Series, High Speed type 600 - 1200 V 600 - 1200 V 10 - 60 A 10 - 100 A 1.8 - 3.5 V 2.5 - 4.0 V J-3 S-Series, Low VCE(sat) type


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    DIN 41529

    Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
    Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.


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    PDF C-865 UT-304 FCT-551 FCT-552 DIN 41529 bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb

    BACC63CB

    Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
    Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.


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    PDF C-865 UT-304 FCT-551 FCT-552 BACC63CB bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft

    IXTD08N100P-1A

    Abstract: IXTQ22N60P IXFH20N80P DWS20-200A IXFH24N80P IXFK180N15P IXTQ22N50P DWHP16-12 IXGH64N60A3 IXFB50N80Q2
    Text: www.ixys.com Contents Page Symbols and Definitions Nomenclature General Informations for Chips Assembly Instructions FRED, Rectifier Diode and Thyristor Chips in Planar Design 2 2 3 4 5 IGBT Chips VCES G-Series, Low VCE sat B2 Types G-Series, Fast C2 Types


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    DC-37PTI

    Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
    Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.


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    PDF C-865 UT-304 FCT-551 FCT-552 DC-37PTI ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500

    104k 630 capacitor

    Abstract: TT 2206 transistor tt 2206 substitute MARKING CODE ZAA diode cc 3053 HP 1003 WA Transistor TT 2246 transistor tt 2206 M.A ENGLISH DATE SHEET 2011 mx 2262
    Text: A KYOCERA GROUP COMPANY AVX Multilayer Ceramic Leaded Capacitors NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee,


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    PDF S-MCLC20M199-C 104k 630 capacitor TT 2206 transistor tt 2206 substitute MARKING CODE ZAA diode cc 3053 HP 1003 WA Transistor TT 2246 transistor tt 2206 M.A ENGLISH DATE SHEET 2011 mx 2262

    transistor tt 2206 substitute

    Abstract: t 3866 power transistor equivalent transistor TT 3034 ix 2933 HP 3120 TT 2206 HP 2630 sc 2262 HP 2602 HP 2231
    Text: Index The Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9 Dielectrics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-13 Radial Leads SKYCAPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-19 CERALAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-23


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    PDF S-MCLC20M297-C transistor tt 2206 substitute t 3866 power transistor equivalent transistor TT 3034 ix 2933 HP 3120 TT 2206 HP 2630 sc 2262 HP 2602 HP 2231

    transistor tt 2206

    Abstract: MX 0541 tt 2246 104k 630 capacitor TT 2206 y5v 104z sec capacitor Transistor TT 2246 a5e 104 transistor tt 2206 substitute diode cc 3053
    Text: A KYOCERA GROUP COMPANY AVX Multilayer Ceramic Leaded Capacitors NOTICE: Specifications are subject to change without notice. Contact your nearest AVX Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee,


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    PDF S-MCLC20M199-C transistor tt 2206 MX 0541 tt 2246 104k 630 capacitor TT 2206 y5v 104z sec capacitor Transistor TT 2246 a5e 104 transistor tt 2206 substitute diode cc 3053

    TT 2206

    Abstract: transistor tt 2206 substitute MIL-C-11015 transistor tt 2206 capacitor type 104z 50v TT 2206 datasheet 103k 0291 skycap Transistor TT 2246 equivalent transistor TT 3034
    Text: Index The Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9 Dielectrics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-13 Radial Leads SKYCAPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-19 CERALAM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20-23


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    PDF S-MCLC20M297-C TT 2206 transistor tt 2206 substitute MIL-C-11015 transistor tt 2206 capacitor type 104z 50v TT 2206 datasheet 103k 0291 skycap Transistor TT 2246 equivalent transistor TT 3034

    TT 2206

    Abstract: tt 3043 capacitor type 104z 50v transistor tt 2206 capacitor cross reference 104z 50v a5e 104 Y5V 104Z MC 3843 skycap sr40 ultrasonic
    Text: www.avx.com AVX Multilayer Ceramic Leaded Capacitors Version 8.1 Contents The Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9 Dielectrics C0G NP0 Dielectric “A”. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10


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    PDF S-MCLC0M1208-C TT 2206 tt 3043 capacitor type 104z 50v transistor tt 2206 capacitor cross reference 104z 50v a5e 104 Y5V 104Z MC 3843 skycap sr40 ultrasonic

    a5e 104z

    Abstract: TT 2206 MIL-PRF-39014 a5e 104 sr40 ultrasonic skycap MX 0541 104K X7R 63 capacitor 1005 0402 ,metric SLA681
    Text: www.avx.com AVX Multilayer Ceramic Leaded Capacitors Version 10.10 Contents The Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9 Dielectrics C0G NP0 Dielectric “A”. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10


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    PDF S-MCLC0M1010-C a5e 104z TT 2206 MIL-PRF-39014 a5e 104 sr40 ultrasonic skycap MX 0541 104K X7R 63 capacitor 1005 0402 ,metric SLA681

    A5C 104K

    Abstract: ESA/SCC 3901 MIL-PRF-28861 hr 821K 3kv ceramic capacitor ckr06 ceramic capacitor marx generator BT 2258 diode cc 3053 SM 686 16V cc 3053
    Text: A KYOCERA GROUP COMPANY AVX Military Products Military Products AVX Military Qualified Products Listing Table of Contents Multilayer Ceramic Leaded Capacitors – Military Cross Reference. . . . . . . . . . . . . . . . . 3-31 MIL-PRF-39014 M, P, R and S Failure Rate Level


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    PDF MIL-PRF-39014 MIL-PRF-11015 MIL-PRF-20 S-MIL00M503-N A5C 104K ESA/SCC 3901 MIL-PRF-28861 hr 821K 3kv ceramic capacitor ckr06 ceramic capacitor marx generator BT 2258 diode cc 3053 SM 686 16V cc 3053

    MX 0541

    Abstract: TB 2929 Ho BT 3758 equivalent MIL-PRF-28861 k 3638 Alternatives klystron weapon STC 07256 Klystron tube Bt 2313 K 4005
    Text: AVX Military Products Military Products AVX Military Qualified Products Listing Table of Contents Multilayer Ceramic Leaded Capacitors – Military Cross Reference . . . . . . . . . . . . . . . . 3-31 MIL-PRF-39014 M, P, R and S Failure Rate Level /01, /02, /05, /20, /21, /23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4


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    PDF MIL-PRF-39014 MIL-PRF-11015 S-MPC12 5M1198-N MX 0541 TB 2929 Ho BT 3758 equivalent MIL-PRF-28861 k 3638 Alternatives klystron weapon STC 07256 Klystron tube Bt 2313 K 4005

    K 4005

    Abstract: MX 0541 3652 substitution klystron weapon TB 2929 H alternative 8526 1348 TB 2929 Ho Bt 2313 military capacitor codes MIL-PRF-123/01
    Text: AVX Military Products Military Products AVX Military Qualified Products Listing Table of Contents Multilayer Ceramic Leaded Capacitors – Military Cross Reference . . . . . . . . . . . . . . . . 3-31 MIL-PRF-39014 M, P, R and S Failure Rate Level /01, /02, /05, /20, /21, /23 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4


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    PDF MIL-PRF-39014 MIL-PRF-11015 S-MPC12 5M1198-N K 4005 MX 0541 3652 substitution klystron weapon TB 2929 H alternative 8526 1348 TB 2929 Ho Bt 2313 military capacitor codes MIL-PRF-123/01

    din IEC 68

    Abstract: 150a gto GTO 100A IXYS 40N60A D-68623 DWEP 17-12 DWEP DWlP 2580B L 7CG
    Text: Contents Page Symbols and Definitions Nomenclature General Information Assembly Instructions FRED, Rectifier Diode and Thyristor Chips in Planar Design 2 2 3 4 5 IGBT Chips VCES G-Series, Low VCE sat B2 Types G-Series, Fast C2 Types S-Series, SCSOA Capability, Fast Types


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    M28840/17

    Abstract: glenair 490
    Text: MIL -PR F -2475 8 A SHIPBOARD INTERCONNECT AND CONDUIT SOLUTIONS DLA / US NAVY APPROVED FOR TOPSIDE APPLICATIONS NOVEMBER 2013 Glenair MIL-PRF-24758A* “BlueJacket” Topside Conduit , e c n O Do I t ! t h g i R t I o D “.Only rigid conduit and conduit


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    PDF MIL-PRF-24758A* F-24758A 271310Z MIL-24758A M28840/17 glenair 490

    220v AC voltage stabilizer schematic diagram

    Abstract: BA 49182 RJh 3047 rjh 3047 equivalent a1458 opto philips ecg master replacement guide MOSFET, rjh 3077 sc1097 philips ecg semiconductors master replacement guide Electronic ballast 40W using 13005 transistor
    Text: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 2-6 Fiber Optic Connectors and Accessories . . . . . . . . . . . See Page 121 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 10-122 Fiber Optic Cable, Connectors, and Accessories . . . . . . See Pages 118-122


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    PDF P390-ND P465-ND P466-ND P467-ND LNG901CF9 LNG992CFBW LNG901CFBW LNG91LCFBW 220v AC voltage stabilizer schematic diagram BA 49182 RJh 3047 rjh 3047 equivalent a1458 opto philips ecg master replacement guide MOSFET, rjh 3077 sc1097 philips ecg semiconductors master replacement guide Electronic ballast 40W using 13005 transistor

    Untitled

    Abstract: No abstract text available
    Text: Assembly Instructions for bipolar Chips Assembly Instructions for MOS/IGBT Chips Assembling Recommended Solder System IXYS bipolar semiconductor chips have a soft-solderable, multi­ layer metallization Ti/Ni/Ag on the bottom side and, on top, either the same metallization scheme or an alumunium layer


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    Untitled

    Abstract: No abstract text available
    Text: IXYS Assembly Instructions for bipolar Chips Assembly Instructions for MOS/IGBT Chips Assem bling Recommended Solder System IXYS bipolar semiconductor chips have a soft-solderable, multi­ layer metallization Ti/Ni/Ag on the bottom side and, on top, either the same metallization scheme or an alumunium layer


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    PDF