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    MOSAID TECHNOLOGIES Search Results

    MOSAID TECHNOLOGIES Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-SATDRIVEX2-001 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-001 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 1m Datasheet
    CS-SATDRIVEX2-002 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-002 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 2m Datasheet
    CS-SATDRIVEX2-000.5 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-000.5 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 0.5m Datasheet
    CS-SASDDP8282-000.5 Amphenol Cables on Demand Amphenol CS-SASDDP8282-000.5 29 position SAS to SATA Drive Connector Dual Data Lanes Cable 0.5m Datasheet
    CS-SASDDP8282-001 Amphenol Cables on Demand Amphenol CS-SASDDP8282-001 29 position SAS to SATA Drive Connector Dual Data Lanes Cable 1m Datasheet

    MOSAID TECHNOLOGIES Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    MOSAID SYSTEMS

    Abstract: 256MDDRSDRAM MOSAID Technologies
    Text: R MOSAID Technologies Incorporated 256MDDRSDRAM Semiconductor Division 4 Bank 256M DDR SDRAM x4,x8,x16 Features • Double Data Rate Operation • Data Strobe sent/received with data • 3 Design Variations forDifferent I/O width 4Bank x 16M Word x 4 bit


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    256MDDRSDRAM July/98 MOSAID SYSTEMS 256MDDRSDRAM MOSAID Technologies PDF

    64MPC100SDRAM

    Abstract: MOSAID Technologies
    Text: R MOSAID Technologies Incorporated 64MPC100SDRAM Semiconductor Division 4 Bank 64M SDRAM x4,x8,x16 Features • PC100 Compliant • 3 Design Variations for Different I/O width 4Bank x 4195024 x 4 bit 4 Bank x 2097512 x 8 bit 4 Bank x 1048576 x 16 bit •


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    64MPC100SDRAM PC100 66MHz/100MHz April/98 64MPC100SDRAM MOSAID Technologies PDF

    MOSAID Technologies

    Abstract: 16MPC100SDRAM NC639 CKE13
    Text: R MOSAID Technologies Incorporated 16MPC100SDRAM Semiconductor Division 2 Bank 16M SDRAM x4,x8,x16 Features • PC100 Compliant • 3 Design Variations for Different I/O width 2 Bank x 2097512 x 4 bit • 66MHz/100MHz • tAC=6ns for CAS Latency=2,3 •


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    16MPC100SDRAM PC100 66MHz/100MHz April/98 MOSAID Technologies 16MPC100SDRAM NC639 CKE13 PDF

    SLD4M18DR400

    Abstract: sldram dcov MOSAID Technologies general semiconductor marking code GF
    Text: MOSAID Technologies Incorporated Semiconductor Division SLD4M18DR400 4 MEG x 18 SLDRAM FEATURES • • • • • • • • • • • • • • • • • Very High Speed – 400 MHz data rate 800 Mb/s peak I/O Bandwidth-provides very high bandwidth over narrow system memory bus


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    SLD4M18DR400 SLD4M18DR400 sldram dcov MOSAID Technologies general semiconductor marking code GF PDF

    Ternary CAM

    Abstract: mosaid cam ternary content addressable memory dc9288 Content Addressable Memory Priority Encoder CAM Class-ICDC9288 "Content Addressable Memory" ternary
    Text: Class-IC DC9288 Class-IC DC9288 High-Performance Ternary CAM MOSAID Class-IC DC9288 is a fully parallel, 9Mbit per-bit ternary Content Addressable Memory CAM capable of storing 1, 0 and “don’t care” bits. Class-IC supports 128K entries of 72 bit words, 64K entries of 144 bit words or 32K entries of 288 bit words.


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    DC9288 DC9288 432-pin Ternary CAM mosaid cam ternary content addressable memory Content Addressable Memory Priority Encoder CAM Class-ICDC9288 "Content Addressable Memory" ternary PDF

    tsmc cmos 0.13 um sram

    Abstract: TSMC 90nm sram ford ppap EMMI microscope TSMC 0.13um process specification PPAP MANUAL for automotive industry Kyocera mold compound semiconductors cross index ISO 9001 Sony foundry metals quality MANUALS
    Text: Integrated Silicon Solution Inc 2012 Q Quality y and Reliability Manual Contents Content Page Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2008 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning


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    PPAP level submission requirement table

    Abstract: PPAP MANUAL for automotive industry foundry metals quality MANUALS result of 200 prize bond INCOMING MATERIAL INSPECTION checklist, PCB TSMC 90nm sram SMD a006 ISO 9001 Sony foundry INCOMING MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION procedure
    Text: Contents Contents i Chapter 1 Quality Management 1.1 Quality Policy 1.2 Quality Organization 1.3 ISO 9001 Year 2000 Revision 1.4 Quality Systems 1.4.1 Process Map 1.4.2 Advanced Product Quality Planning 1.4.3 Quality Assurance in the Project Approval Stage


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    tsmc cmos 0.13 um

    Abstract: "embedded dram" tsmc
    Text: SoC-RAMTM PL Memory Core 0.18µm 3Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank


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    EJTAG Tiny Tools CPLD

    Abstract: TSMC eDRAM ATML U 932 compaq presario ATML 932 Trident plus broadcom Siemens lg Ni1000 temperature sensor Photobit PB-100 irf 3502 SUN HOLD MD-5
    Text: SEMICONDUCTOR TIMES FEBRUARY 1999 FEBRUARY 1999 / 1 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES Radar Scope LTX announced that Accelerix has purchased and taken delivery of a Delta STE, configurable to 512 digital channels, mixed signal instruments and the memory test option. Accelerix, a fabless


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    tsmc cmos 0.13 um

    Abstract: "embedded dram" tsmc D1270 TSMC cmos 0.18um TSMC 0.18Um MOSAID Technologies
    Text: SoC-RAMTM PL Memory Core 0.18µm 8Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank


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    tristate buffer cmos

    Abstract: TSMC 0.18 um CMOS "embedded dram" tsmc tsmc cmos 0.13 um TSMC 0.18um tsmc cmos 0.13 MOSAID Technologies TSMC cmos 0.18um
    Text: SoC-RAMTM PL Memory Core 0.18µm 4.97Mbit embedded DRAM Macrocell Memory Type: Process: Geometry: Configuration: Structure: Synchronous DRAM 0.18µm Generic TSMC Logic Process Memory Density Area Height Width Cell-Efficiency Number of banks Number of pages in a bank


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    97Mbit tristate buffer cmos TSMC 0.18 um CMOS "embedded dram" tsmc tsmc cmos 0.13 um TSMC 0.18um tsmc cmos 0.13 MOSAID Technologies TSMC cmos 0.18um PDF

    DIMM Socket, 184-pin

    Abstract: AN2582 P6860 DDR333 JESD79 MPC8560 TLA700 DDR DIMM pinout micron 184 Signal Path Designer
    Text: Freescale Semiconductor Application Note Document Number: AN2582 Rev. 6, 04/2007 Hardware and Layout Design Considerations for DDR Memory Interfaces by DSD Applications Freescale Semiconductor, Inc. Austin, TX Embedded systems that use double data rate memory DDR


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    AN2582 DIMM Socket, 184-pin AN2582 P6860 DDR333 JESD79 MPC8560 TLA700 DDR DIMM pinout micron 184 Signal Path Designer PDF

    ddr pcb layout

    Abstract: P6860 sdram pcb layout ddr Micron Designline Vol 8 AN2582 ddr pin out dimm pcb layout FAN1655 FAN6555 LP2994
    Text: Freescale Semiconductor, Inc. Application Note AN2582 Rev. 3, 5/2004 Hardware and Layout Design Considerations for DDR Memory Interfaces Freescale Semiconductor, Inc. NCSD Applications Embedded systems that utilize double data rate memory DDR can realize increased


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    AN2582 ddr pcb layout P6860 sdram pcb layout ddr Micron Designline Vol 8 AN2582 ddr pin out dimm pcb layout FAN1655 FAN6555 LP2994 PDF

    70241k

    Abstract: d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P
    Text: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Reliability Report 1997-1998 An ISO 9001 Company 1997 Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc. • 2231 Lawson Lane • Santa Clara, CA 95054


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    R-118 70241k d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P PDF