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    MOUNTING PAD PQFP Search Results

    MOUNTING PAD PQFP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    BLM15PX121BH1D Murata Manufacturing Co Ltd FB SMD 0402inch 120ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM15PX181SH1D Murata Manufacturing Co Ltd FB SMD 0402inch 180ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM21HE802SN1L Murata Manufacturing Co Ltd FB SMD 0805inch 8000ohm NONAUTO Visit Murata Manufacturing Co Ltd

    MOUNTING PAD PQFP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    33310

    Abstract: No abstract text available
    Text: SURFBOARDS THE BREADBOARDING MEDIUM FOR R SURFACE MOUNT TM 33000 SERIES APPLICATION SPECIFIC ADAPTERS MODEL 33310 ACCEPTS 10 LEAD .5 mm PITCH DEVICES IDS33310 REV A- 10-2011 PARTIAL LISTING FAIRCHILD 10LD,MICROPAK 1.6MM TEXAS INST. RSE S-PQFP-N10 RUG (S-PQFP-N10)


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    PDF IDS33310 S-PQFP-N10) 33310

    Untitled

    Abstract: No abstract text available
    Text: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: •Convert surface mount PQFP packages to a PGA footprint. •Available with or without .020 [.51] high stand-offs. •Consult factory for panelized form or for mounting of consigned chips.


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    PDF 44-PQ505-X10 QQ-B-626. MIL-T-10727 QQ-N-290. 44-PQ505-X10

    ASTM-B16-85

    Abstract: No abstract text available
    Text: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: • Convert surface mount PQFP packages to a PGA footprint. • Available with or without .020 [.51] high stand-offs. • Consult factory for panelized form or for mounting of consigned chips.


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    PDF 44-PQ505-X10 C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. 44-PGM08005-30 ASTM-B16-85

    amp pga socket

    Abstract: AMS-QQ-N-290
    Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,


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    PDF 97-AQ132D 132-Pin 97-AQ132D-P amp pga socket AMS-QQ-N-290

    Untitled

    Abstract: No abstract text available
    Text: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: • Convert surface mount PQFP packages to a PGA footprint. • Available with or without .020 [.51] high stand-offs. • Consult factory for panelized form or for mounting of consigned chips.


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    PDF 44-PQ505-X10 C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. 44-PQ505-X10 44-PGM08005-30

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-AQ132C - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: •Convert surface mount PQFP packages to an Amp interstitial PGA footprint. •Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board


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    PDF 97-AQ132C -or97-AQ132C-P

    18022

    Abstract: 132 pin PGA socket
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


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    PDF 97-AQ132D -or97-AQ132D-P 18022 132 pin PGA socket

    nsmd smd

    Abstract: AN-289 PBGA256
    Text: BGA 256-pin Routing 1RWHV Application Note AN-289 By Paul Snell and John Afonasiev ,QWU ,QWURGXFWLRQ IDT uses the 256 PBGA package for several of its products. Although creating an optimal layout with a PBGA package is more challenging than with peripherally leaded packages such as the PQFP, this extra


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    PDF 256-pin AN-289 nsmd smd AN-289 PBGA256

    pcb warpage in ipc standard

    Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
    Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)


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    Intel reflow soldering profile BGA

    Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
    Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems


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    IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies

    Abstract: J-STD-003 BGA reflow guide teBGA J-STD-015 SIZE OF 4V7& PADS FOR REFLOW BGA PROFILING PMC-970951 IPC-D-275 JESD22-A113
    Text: APPLICATION NOTE PMC-970951 ISSUE 1 PMC-Sierra,Inc. SURFACE MOUNT ASSEMBLY of PBGA/TEBGA PACKAGES SURFACE MOUNT ASSEMBLY OF PBGA/TEBGA PACKAGES Issue 1: Sept. 1997 PMC-Sierra, Inc. 105-8555 Baxter Place, Burnaby, BC Canada V5A 4V7 604 415 - 6000 PMC-Sierra,Inc.


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    PDF PMC-970951 PMC-970951R1 IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies J-STD-003 BGA reflow guide teBGA J-STD-015 SIZE OF 4V7& PADS FOR REFLOW BGA PROFILING IPC-D-275 JESD22-A113

    Ablebond 8380

    Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
    Text: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that


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    PDF CH12WIP Ablebond 8380 smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping

    ablebond 8380

    Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
    Text: CHAPTER 12 ADVANCED PACKAGE APPLICATIONS TAPE CARRIER PACKAGE INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace Portability of computing and information management is driving the reduction in size from desktop to laptop to notebook to palm top sized


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    PDF IPC-SM-782A J-STD-001 ablebond 8380 land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING

    Ablebond 8380

    Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716
    Text: Advanced Package Applications: Tape Carrier Package 12.1 12 Introduction To The Package Technology As semiconductor devices become more complex they are being introduced into products that cover the spectrum of the marketplace. Portability of computing and information management is


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    PDF ANSI/J-STD-001, Ablebond 8380 X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    mark A15 sot-23-6

    Abstract: mark A45 sot-23-5 on 408/10 transistor TO247 7pin package a40 5pin
    Text: Micrel Appendix A. Package Information Appendix A Package Information Analog (Ethernet) (HBW) Mounting Information . A-3 8-Pin Plastic DIP . (N) . A-4


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    PDF 14-Pin 16-Pin 18-Pin mark A15 sot-23-6 mark A45 sot-23-5 on 408/10 transistor TO247 7pin package a40 5pin

    mark A45 sot-23-5

    Abstract: Package Information micrel appendix TO247 7pin package Z241 MICREL MARK H32-1 24pin M3 SOT-23-6
    Text: Appendix A. Package Information Micrel Appendix A Package Information Analog/Ethernet HBW . A-3 N . A-4 (N) . A-4 (N) . A-5


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    PDF O-247 O-247 -LB02) mark A45 sot-23-5 Package Information micrel appendix TO247 7pin package Z241 MICREL MARK H32-1 24pin M3 SOT-23-6

    AN-450 surface mounting methods

    Abstract: PLCC20 SO16W SO20W SO24W SO28W VSO40 VSO56 SMD ic catalogue Packaging trends
    Text: Issued July 1995 020-420 Data Pack H An introduction to surface mounting Data Sheet What is surface mounting? What are SMDs? In conventional board assembly technology the component leads are inserted into holes through the PCB and connected to the solder pads by wave soldering


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    Untitled

    Abstract: No abstract text available
    Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


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    PDF 95-100I25 100-PGM13069-30

    powerso-36 and pcb footprint

    Abstract: powerso-20 and pcb footprint ST Microelectronics, mold compound MO-166 POWERSO36 shape outline of the heat slug for JEDEC AN668 POWERSO20 PSO-36 powerso-20
    Text: AN668 APPLICATION NOTE A New High Power IC Surface Mount Package Family: PowerSO-20 & PowerSO-36 Power IC Packaging from Insertion to Surface Mount ing by P. Casati & C. Cognetti A new, high power IC surface mount package family is introduced in this note. It is called PowerSO family and


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    PDF AN668 PowerSO-20TM PowerSO-36 MO-166. PowerSO-20 MO-166 PowerSO-20TM powerso-36 and pcb footprint powerso-20 and pcb footprint ST Microelectronics, mold compound POWERSO36 shape outline of the heat slug for JEDEC AN668 POWERSO20 PSO-36

    ASTM-B16-85

    Abstract: No abstract text available
    Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


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    PDF 95-100I25 95-100I25 -or95-100I25-P 100-PGM13069-30 ASTM-B16-85

    CDA 194

    Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
    Text: ‹ Chapter 2 Package Design CHAPTER 2 PACKAGE DESIGN Flammability Rating Oxygen Index Fine-Pitch Ball Grid Array Leadframe Packages Packages and Packing Methodologies Handbook 17 Oct 2008 2-1 ‹ Chapter 2 Package Design FLAMMABILITY RATING The UL Rating for all Spansion products is 94 V-0.


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    PDF D2863-77, CDA 194 jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108

    AN2639

    Abstract: top-side marking STMicroelectronics LQFP SM817 TOPSIDE MARKING PDIP STMicroelectronics AN2034 J-STD-020D J-STD-020d.1 disadvantages of microcontroller JESD22A111 VFQFPN thermal resistance
    Text: AN2639 Application note Soldering recommendations and package information for Lead-free ECOPACK microcontrollers Introduction STMicroelectronics microcontrollers support various types of Lead-free ECOPACK® package to meet customer requirements. The mounting technologies are Surface mount technology SMT , and Through hole


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    PDF AN2639 AN2639 top-side marking STMicroelectronics LQFP SM817 TOPSIDE MARKING PDIP STMicroelectronics AN2034 J-STD-020D J-STD-020d.1 disadvantages of microcontroller JESD22A111 VFQFPN thermal resistance

    carrier chiller

    Abstract: BRIDGE RECTIFIER SMD oscilloscopes manual SOT-353 Mark va ECL Handbook smd diode Cathode is indicated by a blue band mar TO-204aa MICROSEMI PACKAGE OUTLINE Microsemi Catalog 2000 RCA 559 TO3 MECL System Design Handbook
    Text: CASERM/D Rev. 0, Sep-2000 Semiconductor Packaging and Case Outlines ON Semiconductor Reference Manual and Design Guide Semiconductor Packaging and Case Outlines Reference Manual and Design Guide CASERM/D Rev. 0, Sep–2000  SCILLC, 2000 “All Rights Reserved’’


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    PDF Sep-2000 r14525 carrier chiller BRIDGE RECTIFIER SMD oscilloscopes manual SOT-353 Mark va ECL Handbook smd diode Cathode is indicated by a blue band mar TO-204aa MICROSEMI PACKAGE OUTLINE Microsemi Catalog 2000 RCA 559 TO3 MECL System Design Handbook