MOUNTING PAD PQFP Search Results
MOUNTING PAD PQFP Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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TPD4164F |
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Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 | |||
TPD4163F |
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Intelligent power device / VBB=600V / Iout=1A/ Surface mount type / HSSOP31 | |||
BLM15PX121BH1D | Murata Manufacturing Co Ltd | FB SMD 0402inch 120ohm POWRTRN | |||
BLM15PX181SH1D | Murata Manufacturing Co Ltd | FB SMD 0402inch 180ohm POWRTRN | |||
BLM21HE802SN1L | Murata Manufacturing Co Ltd | FB SMD 0805inch 8000ohm NONAUTO |
MOUNTING PAD PQFP Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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33310
Abstract: No abstract text available
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IDS33310 S-PQFP-N10) 33310 | |
Untitled
Abstract: No abstract text available
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44-PQ505-X10 QQ-B-626. MIL-T-10727 QQ-N-290. 44-PQ505-X10 | |
ASTM-B16-85
Abstract: No abstract text available
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44-PQ505-X10 C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. 44-PGM08005-30 ASTM-B16-85 | |
amp pga socket
Abstract: AMS-QQ-N-290
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97-AQ132D 132-Pin 97-AQ132D-P amp pga socket AMS-QQ-N-290 | |
Untitled
Abstract: No abstract text available
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44-PQ505-X10 C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. 44-PQ505-X10 44-PGM08005-30 | |
Untitled
Abstract: No abstract text available
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97-AQ132C -or97-AQ132C-P | |
18022
Abstract: 132 pin PGA socket
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97-AQ132D -or97-AQ132D-P 18022 132 pin PGA socket | |
nsmd smd
Abstract: AN-289 PBGA256
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256-pin AN-289 nsmd smd AN-289 PBGA256 | |
pcb warpage in ipc standard
Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
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Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
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IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies
Abstract: J-STD-003 BGA reflow guide teBGA J-STD-015 SIZE OF 4V7& PADS FOR REFLOW BGA PROFILING PMC-970951 IPC-D-275 JESD22-A113
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PMC-970951 PMC-970951R1 IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies J-STD-003 BGA reflow guide teBGA J-STD-015 SIZE OF 4V7& PADS FOR REFLOW BGA PROFILING IPC-D-275 JESD22-A113 | |
Ablebond 8380
Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
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CH12WIP Ablebond 8380 smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping | |
ablebond 8380
Abstract: land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING
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IPC-SM-782A J-STD-001 ablebond 8380 land pattern PQFP 132 smema Ablestik 8380 ablestik ablebond shoulder angle foot length lead solder joint reliability nozzle heater gold embrittlement Ablebond cut template DRAWING | |
Ablebond 8380
Abstract: X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716
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ANSI/J-STD-001, Ablebond 8380 X3304 ablestik ablebond Ablestik 8380 A5700 shoulder angle foot length lead solder joint reliability smema control IPC-SM-780 tms 3615 A5716 | |
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
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mark A15 sot-23-6
Abstract: mark A45 sot-23-5 on 408/10 transistor TO247 7pin package a40 5pin
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14-Pin 16-Pin 18-Pin mark A15 sot-23-6 mark A45 sot-23-5 on 408/10 transistor TO247 7pin package a40 5pin | |
mark A45 sot-23-5
Abstract: Package Information micrel appendix TO247 7pin package Z241 MICREL MARK H32-1 24pin M3 SOT-23-6
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O-247 O-247 -LB02) mark A45 sot-23-5 Package Information micrel appendix TO247 7pin package Z241 MICREL MARK H32-1 24pin M3 SOT-23-6 | |
AN-450 surface mounting methods
Abstract: PLCC20 SO16W SO20W SO24W SO28W VSO40 VSO56 SMD ic catalogue Packaging trends
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Untitled
Abstract: No abstract text available
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95-100I25 100-PGM13069-30 | |
powerso-36 and pcb footprint
Abstract: powerso-20 and pcb footprint ST Microelectronics, mold compound MO-166 POWERSO36 shape outline of the heat slug for JEDEC AN668 POWERSO20 PSO-36 powerso-20
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AN668 PowerSO-20TM PowerSO-36 MO-166. PowerSO-20 MO-166 PowerSO-20TM powerso-36 and pcb footprint powerso-20 and pcb footprint ST Microelectronics, mold compound POWERSO36 shape outline of the heat slug for JEDEC AN668 POWERSO20 PSO-36 | |
ASTM-B16-85
Abstract: No abstract text available
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95-100I25 95-100I25 -or95-100I25-P 100-PGM13069-30 ASTM-B16-85 | |
CDA 194
Abstract: jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108
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D2863-77, CDA 194 jedec mo-142 footprint jedec ms-024 D2863-77 leadframe C7025 ALJ- 1300 footprint WSON leadframe Cu C7025 MO-052 MO-108 | |
AN2639
Abstract: top-side marking STMicroelectronics LQFP SM817 TOPSIDE MARKING PDIP STMicroelectronics AN2034 J-STD-020D J-STD-020d.1 disadvantages of microcontroller JESD22A111 VFQFPN thermal resistance
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AN2639 AN2639 top-side marking STMicroelectronics LQFP SM817 TOPSIDE MARKING PDIP STMicroelectronics AN2034 J-STD-020D J-STD-020d.1 disadvantages of microcontroller JESD22A111 VFQFPN thermal resistance | |
carrier chiller
Abstract: BRIDGE RECTIFIER SMD oscilloscopes manual SOT-353 Mark va ECL Handbook smd diode Cathode is indicated by a blue band mar TO-204aa MICROSEMI PACKAGE OUTLINE Microsemi Catalog 2000 RCA 559 TO3 MECL System Design Handbook
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Sep-2000 r14525 carrier chiller BRIDGE RECTIFIER SMD oscilloscopes manual SOT-353 Mark va ECL Handbook smd diode Cathode is indicated by a blue band mar TO-204aa MICROSEMI PACKAGE OUTLINE Microsemi Catalog 2000 RCA 559 TO3 MECL System Design Handbook |