Untitled
Abstract: No abstract text available
Text: SURFBOARDS THE BREADBOARDING MEDIUM FOR R SURFACE MOUNT TM 33000 SERIES APPLICATION SPECIFIC ADAPTERS MODEL 33310 ACCEPTS 10 LEAD .5 mm PITCH DEVICES IDS33310 REV A- 10-2011 PARTIAL LISTING FAIRCHILD 10LD,MICROPAK 1.6MM TEXAS INST. RSE S-PQFP-N10 RUG (S-PQFP-N10)
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IDS33310
S-PQFP-N10)
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33310
Abstract: No abstract text available
Text: SURFBOARDS THE BREADBOARDING MEDIUM FOR R SURFACE MOUNT TM 33000 SERIES APPLICATION SPECIFIC ADAPTERS MODEL 33310 ACCEPTS 10 LEAD .5 mm PITCH DEVICES IDS33310 REV A- 10-2011 PARTIAL LISTING FAIRCHILD 10LD,MICROPAK 1.6MM TEXAS INST. RSE S-PQFP-N10 RUG (S-PQFP-N10)
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IDS33310
S-PQFP-N10)
33310
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Untitled
Abstract: No abstract text available
Text: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: Convert surface mount PQFP packages to a PGA footprint. Available with or without .020 [.51] high stand-offs. Consult factory for panelized form or for mounting of consigned chips.
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44-PQ505-X10
QQ-B-626.
MIL-T-10727
QQ-N-290.
44-PQ505-X10
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Untitled
Abstract: No abstract text available
Text: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: • Convert surface mount PQFP packages to a PGA footprint. • Available with or without .020 [.51] high stand-offs. • Consult factory for panelized form or for mounting of consigned chips.
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44-PQ505-X10
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
44-PQ505-X10
44-PGM08005-30
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ASTM-B16-85
Abstract: No abstract text available
Text: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: • Convert surface mount PQFP packages to a PGA footprint. • Available with or without .020 [.51] high stand-offs. • Consult factory for panelized form or for mounting of consigned chips.
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44-PQ505-X10
C36000
ASTM-B16-85.
MIL-P-81728
QQ-N-290.
44-PGM08005-30
ASTM-B16-85
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amp pga socket
Abstract: AMS-QQ-N-290
Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,
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97-AQ132D
132-Pin
97-AQ132D-P
amp pga socket
AMS-QQ-N-290
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Untitled
Abstract: No abstract text available
Text: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: • Convert surface mount PQFP packages to a PGA footprint. • Available with or without .020 [.51] high stand-offs. • Consult factory for panelized form or for mounting of consigned chips.
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44-PQ505-X10
C36000
ASTM-B16-85.
MIL-T-10727
MIL-P-81728
QQ-N-290.
44-PQ505-X10
44-PGM08005-30
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Untitled
Abstract: No abstract text available
Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,
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97-AQ132D
132-Pin
C36ending
97-AQ132D-P
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132 pin PGA socket
Abstract: No abstract text available
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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97-AQ132D
-or97-AQ132D-P
132 pin PGA socket
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Untitled
Abstract: No abstract text available
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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97-AQ132D
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mounting pad PQFP
Abstract: No abstract text available
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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97-AQ132D
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mounting pad PQFP
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Untitled
Abstract: No abstract text available
Text: Part No. 97-AQ132C - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board
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97-AQ132C
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amp pga socket
Abstract: DIMENSIONS PQFP 132 ASTM-B16-85 mounting pad PQFP 132 pin PGA socket
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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97-AQ132D
97-AQ132D
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amp pga socket
DIMENSIONS PQFP 132
ASTM-B16-85
mounting pad PQFP
132 pin PGA socket
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18022
Abstract: 132 pin PGA socket
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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97-AQ132D
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18022
132 pin PGA socket
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
MIL-M-38510
MIL-STD-883
LGA 1156 PIN OUT diagram
QSJ-44403
LGA 1150 Socket PIN diagram
LGA 1155 Socket PIN diagram
IC107-26035-20-G
LGA 1151 PIN diagram
REFLOW lga socket 1155
IC107-3204-G
TB 2929 H alternative
LGA 1155 pin diagram
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matrix 2088ab
Abstract: 2088AB led matrix torque settings chart for metric stainless bolts led matrix 2088ab 2088AB* led matrix PHASE CONTROL THYRISTOR MODULE TT 56 N SIL-PAD to-247 Ultrasonic humidifier circuit full wave BRIDGE RECTIFIER 1044 2088AB
Text: Soldering and Mounting Techniques Reference Manual SOLDERRM/D Rev. 5, January−2007 SCILLC, 2007 “All Rights Reserved” SOLDERRM FULLPAK, ICePAK, MicroIntegration, MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC SCILLC . Cho−Therm is a registered trademark of Chromerics, Inc. Grafoil is a registered trademark of
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January-2007
matrix 2088ab
2088AB led matrix
torque settings chart for metric stainless bolts
led matrix 2088ab
2088AB* led matrix
PHASE CONTROL THYRISTOR MODULE TT 56 N
SIL-PAD to-247
Ultrasonic humidifier circuit
full wave BRIDGE RECTIFIER 1044
2088AB
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2088AB* led matrix
Abstract: led matrix 2088ab 2088AB led matrix led matrix 8x8 mini circuits 2088AB matrix 2088ab Ultrasonic humidifier circuit torque settings for metric cap head screws TRANSISTOR C 6090 EQUIVALENT CV 7311
Text: Soldering and Mounting Techniques Reference Manual SOLDERRM/D Rev. 3, May−2006 SCILLC, 2006 “All Rights Reserved” SOLDERRM FULLPAK, ICePAK, MicroIntegration, MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC SCILLC . Cho−Therm is a registered trademark of Chromerics, Inc. Grafoil is a registered trademark of
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May-2006
2088AB* led matrix
led matrix 2088ab
2088AB led matrix
led matrix 8x8 mini circuits
2088AB
matrix 2088ab
Ultrasonic humidifier circuit
torque settings for metric cap head screws
TRANSISTOR C 6090 EQUIVALENT
CV 7311
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PBGA 256 reflow profile
Abstract: bga 196 land pattern Intel reflow soldering profile BGA BGA PACKAGE TOP MARK intel BGA PACKAGE thermal profile A5825-01 BGA and QFP Package BGA OUTLINE DRAWING bga Shipping Trays land pattern BGA 0.75
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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pcb warpage in ipc standard
Abstract: Intel reflow soldering profile BGA a5764 "BGA Rework Practices", corner relief carrier tape Intel reflow soldering profile BGA LEAD FREE bga 196 land pattern fine line bga thermal cycling reliability JEDEC bga 63 tray fine BGA thermal profile
Text: Plastic Ball Grid Array PBGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads)
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Intel reflow soldering profile BGA
Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Text: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems
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IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies
Abstract: J-STD-003 BGA reflow guide teBGA J-STD-015 SIZE OF 4V7& PADS FOR REFLOW BGA PROFILING PMC-970951 IPC-D-275 JESD22-A113
Text: APPLICATION NOTE PMC-970951 ISSUE 1 PMC-Sierra,Inc. SURFACE MOUNT ASSEMBLY of PBGA/TEBGA PACKAGES SURFACE MOUNT ASSEMBLY OF PBGA/TEBGA PACKAGES Issue 1: Sept. 1997 PMC-Sierra, Inc. 105-8555 Baxter Place, Burnaby, BC Canada V5A 4V7 604 415 - 6000 PMC-Sierra,Inc.
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PMC-970951
PMC-970951R1
IPC-D-275 Design standard for Rigid Printed Boards and Rigid Printed Board Assemblies
J-STD-003
BGA reflow guide
teBGA
J-STD-015
SIZE OF 4V7& PADS FOR REFLOW
BGA PROFILING
IPC-D-275
JESD22-A113
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smema
Abstract: land pattern for TSOP ultrasonic bond tensile-strength soft solder die bonding IPC-SM-780 TO metal package aluminum kovar dual beam laser land pattern for SOP material composition of chip capacitors
Text: CHAPTER 13 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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IPC-SM-780
Abstract: No abstract text available
Text: 2 Glossary 1/17/97 11:08 AM GLOSSARY.DOC INTEL CONFIDENTIAL until publication date 2 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide(s) access to the surface of the land in one or more layers of the board.
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Glossary-13
IPC-SM-780
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CERAMIC PIN GRID ARRAY wire lead frame
Abstract: IPC-SM-780 nickel corrosion electroplating
Text: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.
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Glossary-11
CERAMIC PIN GRID ARRAY wire lead frame
IPC-SM-780
nickel corrosion electroplating
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