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    MOUNTING PAD PQFP Search Results

    MOUNTING PAD PQFP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPD4164F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=2A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    TPD4163F Toshiba Electronic Devices & Storage Corporation Intelligent power device / VBB=600V / Iout=1A/ Surface mount type / HSSOP31 Visit Toshiba Electronic Devices & Storage Corporation
    BLM15PX121BH1D Murata Manufacturing Co Ltd FB SMD 0402inch 120ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM15PX181SH1D Murata Manufacturing Co Ltd FB SMD 0402inch 180ohm POWRTRN Visit Murata Manufacturing Co Ltd
    BLM21HE802SN1L Murata Manufacturing Co Ltd FB SMD 0805inch 8000ohm NONAUTO Visit Murata Manufacturing Co Ltd

    MOUNTING PAD PQFP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ASTM-B16-85

    Abstract: No abstract text available
    Text: Part No. 44-PQ505-X10 PQFP to PGA .0315 [.80] Pitch Adapter FEATURES: • Convert surface mount PQFP packages to a PGA footprint. • Available with or without .020 [.51] high stand-offs. • Consult factory for panelized form or for mounting of consigned chips.


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    PDF 44-PQ505-X10 C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. 44-PGM08005-30 ASTM-B16-85

    nsmd smd

    Abstract: AN-289 PBGA256
    Text: BGA 256-pin Routing 1RWHV Application Note AN-289 By Paul Snell and John Afonasiev ,QWU ,QWURGXFWLRQ IDT uses the 256 PBGA package for several of its products. Although creating an optimal layout with a PBGA package is more challenging than with peripherally leaded packages such as the PQFP, this extra


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    PDF 256-pin AN-289 nsmd smd AN-289 PBGA256

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    mark A45 sot-23-5

    Abstract: Package Information micrel appendix TO247 7pin package Z241 MICREL MARK H32-1 24pin M3 SOT-23-6
    Text: Appendix A. Package Information Micrel Appendix A Package Information Analog/Ethernet HBW . A-3 N . A-4 (N) . A-4 (N) . A-5


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    PDF O-247 O-247 -LB02) mark A45 sot-23-5 Package Information micrel appendix TO247 7pin package Z241 MICREL MARK H32-1 24pin M3 SOT-23-6

    ASTM-B16-85

    Abstract: No abstract text available
    Text: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.


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    PDF 95-100I25 95-100I25 -or95-100I25-P 100-PGM13069-30 ASTM-B16-85

    carrier chiller

    Abstract: BRIDGE RECTIFIER SMD oscilloscopes manual SOT-353 Mark va ECL Handbook smd diode Cathode is indicated by a blue band mar TO-204aa MICROSEMI PACKAGE OUTLINE Microsemi Catalog 2000 RCA 559 TO3 MECL System Design Handbook
    Text: CASERM/D Rev. 0, Sep-2000 Semiconductor Packaging and Case Outlines ON Semiconductor Reference Manual and Design Guide Semiconductor Packaging and Case Outlines Reference Manual and Design Guide CASERM/D Rev. 0, Sep–2000  SCILLC, 2000 “All Rights Reserved’’


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    PDF Sep-2000 r14525 carrier chiller BRIDGE RECTIFIER SMD oscilloscopes manual SOT-353 Mark va ECL Handbook smd diode Cathode is indicated by a blue band mar TO-204aa MICROSEMI PACKAGE OUTLINE Microsemi Catalog 2000 RCA 559 TO3 MECL System Design Handbook

    IEC 68-2-32

    Abstract: No abstract text available
    Text: Board Level Reliability of Components with Matte Tin Lead Finish L. Nguyen, R. Walberg, L. Zhou*, and T. Koh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore Abstract Manufacturers, suppliers, and industry consortia have all


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    PDF lead-f99, IEC 68-2-32

    SGS-Thomson ball grid array

    Abstract: CB35000 ISB35000 2M x 16 DPRAM signal path designer io out put buffer predriver
    Text: CB35000 SERIES  HCMOS STANDARD CELLS PRELIMINARY DATA FEATURES • ■ ■ ■ ■ ■ ■ 0.5 micron triple layer metal HCMOS5S process featuring retrograde well technology, low resistance salicided active areas, polysilicide gates and thin metal oxide.


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    PDF CB35000 SGS-Thomson ball grid array ISB35000 2M x 16 DPRAM signal path designer io out put buffer predriver

    ALLOY leadframe C7025 material property

    Abstract: smd code marking 56L 20L SMD SOT-23 9l marking sot23 ALLOY leadframe C7025 lead frame cu C194 marking code 56l 100L C194 C7025
    Text: A Structured Approach To Lead-Free IC Assembly Transitioning L. Nguyen, R. Walberg, Z. Lin*, T. Koh*, YY Bong*, MC Chua*, S. Chuah*, JJ Yeoh* National Semiconductor Corp. P.O. Box 58090 M/S 19-100 Santa Clara, CA 95052-8090 * National Semiconductor, Singapore


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    Untitled

    Abstract: No abstract text available
    Text: CN8478/74A/72A/71A Multichannel Synchronous Communications Controller MUSYCC Data Sheet 28478-DSH-002-C November 2005 Ordering Information Ordering Number Version Package Temperature Range 28475-17 32-Channel 208-Pin Plastic Quad Flat Pack (PQFP) –40 °C to +85 °C


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    PDF CN8478/74A/72A/71A 28478-DSH-002-C 32-Channel 64-Channel 128-Channel 256-Channel 256-Channel

    CN8471AEBG

    Abstract: CN8471AEPF CN8472AEBG CN8472AEPF CN8474AEBG CN8474AEPF CN8478EBG CN8478EPF
    Text: CN8478/74A/72A/71A Multichannel Synchronous Communications Controller MUSYCC Data Sheet 500183B June 2002 Ordering Information Model Number Version Package Temperature Range CN8471AEPF 32-Channel 208-Pin Plastic Quad Flat Pack (PQFP) –40 °C to +85 °C


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    PDF CN8478/74A/72A/71A 500183B CN8471AEPF 32-Channel 208-Pin CN8472AEPF 64-Channel CN8474AEPF 128-Channel CN8471AEBG CN8471AEPF CN8472AEBG CN8472AEPF CN8474AEBG CN8474AEPF CN8478EBG CN8478EPF

    822 smd

    Abstract: MIL-STD-81705 MIL-B-81705 cap intel 815 reflow profile manufacturing process calcium chloride molecular sieve A5753-01 Cu6Sn5 A5760 MOISTURE SENSITIVITY/DESICCANT PACKING/HANDLING OF PSMCs
    Text: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs 8.1 8 Introduction This chapter examines surface mount assembly processes and establishes preconditioning flows which encompass moisture absorption, thermal stress and chemical environments typical in the


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    Untitled

    Abstract: No abstract text available
    Text: TRF3702 www.ti.com SLWS149 – SEPTEMBER 2004 1.5-GHz to 2.5-GHz QUADRATURE MODULATOR FEATURES • • • • • APPLICATIONS • • • • • • • • Cellular Base Transceiver Station Transmit Channel IF Sampling Applications TDMA: GSM, IS-136, EDGE/UWC-136


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    PDF TRF3702 SLWS149 71-dBc 14-dBm IS-136, EDGE/UWC-136 IS-95, CDMA2000

    AOI21

    Abstract: OAI22 32X72 equivalent to TRANSISTOR BC 187 ao21 AN1521 low noise transistor bc 179 OMPAC wirebond die flag lead frame using NAND gate construct an inverter
    Text: Order this Data Sheet by H4CP/D MOTOROLA SEMICONDUCTOR H4CPlus SERIES TECHNICAL DATA Product Data Sheet H4CPlus SERIES CMOS ARRAYS The new H4CPlus Series arrays feature new 3.3V, 5V and mixed-voltage capability, high-speed interfaces, and analog PLLs for chip-to-chip clock skew


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    N8242PC

    Abstract: intel 865 MOTHERBOARD pcb CIRCUIT diagram S82378ZB "intel 8242" 865 intel MOTHERBOARD CIRCUIT diagram PCB-3330-1010-D intel 865 MOTHERBOARD CIRCUIT diagram free circuit diagram of intel 865 motherboard N8242 PC MOTHERBOARD intel 865 circuit diagram
    Text: AlphaPC64 Motherboard User’s Manual Order Number: EC–QLJKB–TE Revision/Update Information: Digital Equipment Corporation Maynard, Massachusetts This document supersedes the AlphaPC64 Motherboard User’s Manual EC–QLJKA–TE . July 1995 Possession, use, or copying of the software described in this publication is authorized only


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    PDF AlphaPC64 N8242PC intel 865 MOTHERBOARD pcb CIRCUIT diagram S82378ZB "intel 8242" 865 intel MOTHERBOARD CIRCUIT diagram PCB-3330-1010-D intel 865 MOTHERBOARD CIRCUIT diagram free circuit diagram of intel 865 motherboard N8242 PC MOTHERBOARD intel 865 circuit diagram

    G061

    Abstract: IS-136 TRF3702 TRF3702IRHC TRF3702IRHCR s0010
    Text: TRF3702 www.ti.com SLWS149 – SEPTEMBER 2004 1.5 GHz to 2.5 GHz QUADRATURE MODULATOR FEATURES • • • • • APPLICATIONS • • • • • • • • Cellular Base Transceiver Station Transmit Channel IF Sampling Applications TDMA: GSM, IS-136, EDGE/UWC-136


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    PDF TRF3702 SLWS149 IS-136, EDGE/UWC-136 IS-95, CDMA2000 14-dBm G061 IS-136 TRF3702 TRF3702IRHC TRF3702IRHCR s0010

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data Document Number: MMG3005NT1 Rev. 2, 5/2006 Heterojunction Bipolar Transistor Technology InGaP HBT MMG3005NT1 Broadband High Linearity Amplifier The MMG3005NT1 is a General Purpose Amplifier that is internally prematched and designed for a broad range of Class A, small- signal, high


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    PDF MMG3005NT1 MMG3005NT1

    S1D15719

    Abstract: S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B
    Text: CMOS LSIs Product Catalog 2009 SEIKO EPSON CORPORATION CMOS LSIs Contents Configuration of product number . 2 1 ASICs Application Specific IC 1-1 Gate Arrays . 4


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    PDF S1L70000 S1L60000 S1L50000 S1L30000 16-bit 32-bit S1D15719 S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B

    hk-001 94v-0

    Abstract: sec d 5072 transistor D 5038 Transistor Horizontal equivalent of transistor sec 5027 8011-8G7 LSG-1DG17-14 508-AG10D augat 510AG92D20ES Catalog 1307612 augat 8136
    Text: Catalog 1307612 Courtesy of Steven Engineering, Inc. Ÿ 230 Ryan Way, South San Francisco, CA, 94080-6370 Ÿ Main Office: 650 588-9200 Ÿ Outside Local Area: (800) 258-9200 Ÿ www.stevenengineering.com Sockets Revised 7-01 Table of Contents DIP Sockets Solder Tail Dual Leaf (DL) Contact …………………………………………5002-5007


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    PDF 8046-1G1 8046-1G2 8046-1G3 8046-1G4 8046-1G5 8046-1G6 8046-1G7 8046-1G8 8046-1G9 8046-1G10 hk-001 94v-0 sec d 5072 transistor D 5038 Transistor Horizontal equivalent of transistor sec 5027 8011-8G7 LSG-1DG17-14 508-AG10D augat 510AG92D20ES Catalog 1307612 augat 8136

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    Untitled

    Abstract: No abstract text available
    Text: ACT 3 3.3 Volt Field Programmable Gate Arrays F eatu res • 3.3V Functionality specifications fully compliant with JEDEC Replaces up to 250 TTL Packages Replaces up to 100 20-pin PAL Packages • Highly Predictable Performance with 100% Automatic Placement and Routing


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    PDF 20-pin

    Untitled

    Abstract: No abstract text available
    Text: M G 802C 512 ♦ : M U L T R A L O W L A T E N C Y , H IG H P E R F O R M A N C E o Sys 5 1 2 K X 3 2 SGRAM Features High bandwidth 100MHz-200MHz operation Reduced Latency - 1 3ns access, 25ns cycle Improved critical timing parameter limits 2/4 Internal Banks for hiding Row Precharge


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    PDF 100MHz-200MHz 512Kx32 100-pin

    dilmon 28

    Abstract: transistor DA 218
    Text: be!E D • 37bfi522 DD1770R RflO m P L S B PSLU4I G E C P L E S S E Y GEC PLESSEY SEMICONDS S E M I C O N D U C T O R S DS2349-2.2 ULA DA SERIES ANALOG/DIGITAL MIXED SIGNAL ARRAY FAMILY Supersedes June 1990 Edition The ULA DA Series is a family of 8 arrays developed to


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    PDF 37bfi522 DD1770R DS2349-2 dilmon 28 transistor DA 218

    Untitled

    Abstract: No abstract text available
    Text: ♦ _ M G 8 Q 2 C 5 1 2 U l t r a L o w L a t e n c y , H ig h P e r f o r m a n c e 51 2 K X 3 2 S G R A M M o Sys PR ELIM IN A R Y IN FO R M A TIO N a O _ o 3 „ n S C J S a a p o o o o o o o o o o j n a a i d > û û > z z z z z z z z z z > û û ;


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    PDF 100MHz-200M 512Kx32 00-pin MG802C512