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    MQFP 14X14 Search Results

    MQFP 14X14 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HSP50214BVI Renesas Electronics Corporation Programmable Downconverter, MQFP-HS, /Tray Visit Renesas Electronics Corporation
    HSP50214BVC Renesas Electronics Corporation Programmable Downconverter, MQFP-HS, /Tray Visit Renesas Electronics Corporation
    ISL54100CQZ Renesas Electronics Corporation TMDS Regenerators with Multiplexers, MQFP, /Tray Visit Renesas Electronics Corporation
    ISL54102CQZ Renesas Electronics Corporation TMDS Regenerators with Multiplexers, MQFP, /Tray Visit Renesas Electronics Corporation
    HSP50415VI Renesas Electronics Corporation Wideband Programmable Modulator (WPM), MQFP-HS, /Tray Visit Renesas Electronics Corporation

    MQFP 14X14 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ipc-SM-782

    Abstract: 14x14-64 MQFP 14X14 AN49 fairchild 245
    Text: www.fairchildsemi.com Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to


    Original     		PDF AN30000049 ipc-SM-782 14x14-64 MQFP 14X14 AN49 fairchild 245

    ipc-SM-782

    Abstract: 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company
    Text: Electronics Semiconductor Division Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to


    Original     		PDF AN30000049 ipc-SM-782 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company

    microprocessors architecture of 8251

    Abstract: microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251 DS4812 CLA200
    Text: CLA200 Series CMOS Gate Arrays Advance Information DS4812 - 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to


    Original     		PDF CLA200 DS4812 microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251

    8251 uart vhdl

    Abstract: microprocessors interface 8086 to 8251 microprocessors architecture of 8251 DS4812 8048 8251 8086 microprocessor kit manual
    Text: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to


    Original     		PDF CLA200 DS4812 8251 uart vhdl microprocessors interface 8086 to 8251 microprocessors architecture of 8251 DS4812 8048 8251 8086 microprocessor kit manual

    zarlink clt

    Abstract: 8251 uart vhdl microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Zarlink CLA200 CLA200 Series UART 8251 DS4812 zarlink asic
    Text: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to


    Original     		PDF CLA200 DS4812 zarlink clt 8251 uart vhdl microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Zarlink CLA200 CLA200 Series UART 8251 DS4812 zarlink asic

    FPQ 208 0.5 10

    Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
    Text: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch


    Original     		PDF AC700V AC500V FPQ-44-0 FPQ-44-0. FPQ 208 0.5 10 FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64

    Untitled

    Abstract: No abstract text available
    Text: SiI 2022 Fibre Channel SerDes Silicon Image's SiI 2022 serializer/deserializer SerDes is capable of transmitting and receiving data at 1.0625 and 2.125 gigabits-per-second (Gbps). Targeted at Fibre Channel applications, the SiI 2022 SerDes is designed for power, performance and price. Making use of a robust,


    Original     		PDF 64-pin, 14x14 SiI2022CM64 SiI-PB-0028

    MCHC908AB32CFUR2

    Abstract: No abstract text available
    Text: Page 1 of 3 MCHC908AB32CFUR2 Information General information Package information Environmental and Compliance information Replacement Parts Information Manufacturing and Qualification information Ordering information Product/Process Change Notice PCN Operating Characteristics


    Original     		PDF MCHC908AB32CFUR2 MCHC908AB32CFUR2 SAG9AB32

    EIA 481 QFN pin 1

    Abstract: smd transistor 5c sot-23 TB347 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1
    Text: Tape and Reel Specification for Integrated Circuits Technical Brief January 5, 2007 TB347.10 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged


    Original     		PDF TB347 EIA-481 EIA 481 QFN pin 1 smd transistor 5c sot-23 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1

    MC14513

    Abstract: DS00784 D52015 MCP1525 TC7135 DM7447A TC7660 74C04 AN784 DS0078
    Text: TC7135 4-1/2 位 A/D 转换器 特性 概述 • • • • • • • • • • • • • TC7135 4-1/2 位 A/D 转换器（A/D Converter，ADC） 的分辨率为 50 ppm （20,000 分之一），最大非线性误 差为 1 个计数。自动调零周期将零误差和零漂移分别降


    Original     		PDF TC7135 TC7135 DS21460D MC14513 DS00784 D52015 MCP1525 DM7447A TC7660 74C04 AN784 DS0078

    MC9S12Dx256

    Abstract: tray qfp 14x14 1.4 tray qfp 14x14 PEAK TRAY qfp 14x14 MC9S12A256CFUE 1K79X peak mqfp 14x14 EAR99 HCS12 HCS12 1k79x
    Text: Page 1 of 4 MC9S12A256BCFU Information General information Package information Environmental and Compliance information Replacement Parts Information Manufacturing and Qualification information Ordering information Product/Process Change Notice PCN Operating Characteristics


    Original     		PDF MC9S12A256BCFU MC9S12A256BCFU HCS12 PQFP-G80 MC9S12Dx256 tray qfp 14x14 1.4 tray qfp 14x14 PEAK TRAY qfp 14x14 MC9S12A256CFUE 1K79X peak mqfp 14x14 EAR99 HCS12 1k79x

    tqfp 7X7X1.4mm

    Abstract: 14x14x1.4mm wlcsp inspection MO-169 TB347 TQFP 48-1 PACKAGE
    Text: Tape and Reel Specification for Integrated Circuits Technical Brief April 13, 2009 TB347.12 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged


    Original     		PDF TB347 EIA-481 NOMINA24) tqfp 7X7X1.4mm 14x14x1.4mm wlcsp inspection MO-169 TQFP 48-1 PACKAGE

    21x21

    Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
    Text: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。


    Original     		PDF P22C100300A1 P8C-100-300B P8CT-100-300B2-1 P8C-100-300A-1 P-DIP8-0300-2 MD300-2A MD300-1A MD300-09A 21x21 MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1

    QFn 64 tape carrier

    Abstract: Techwell 7x7x1 TB347 MO-169 1748 QFN
    Text: Technical Brief 347 Author: Laszlo Nemeth Tape and Reel Specification for Integrated Circuits Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The Intersil Tape and Reel specifications are in compliance with


    Original     		PDF EIA-481 TB347 QFn 64 tape carrier Techwell 7x7x1 MO-169 1748 QFN

    TQFN 48 7X7

    Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
    Text: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2


    Original     		PDF 10x10 25x25 10K/Reel TQFN 48 7X7 QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel

    14x14x1.4mm

    Abstract: No abstract text available
    Text: CS7410 CD/MP3/WMA Audio Controller Features Description Super on-chip Integration for low cost and low count bill of materials 32-Bit RISC Processor performs audio decode and system management functions 16-bit DSP for audio special effects 80 Kbytes internal SRAM, and 256 Kbytes internal ROM


    Original     		PDF CS7410 32-Bit 16-bit IEC-958 ISO96under DS553PP2 14x14x1.4mm

    MB89371A

    Abstract: mb89371AH mb89371 MB89195A 8 bit dip switch nec 16f MB90P263PF MB90P263 MB2142-01 detailed vfd circuit diagram for motor
    Text: To Top / Lineup / Index Product Line-up Microcomputers Microcontrollers 8-bit Proprietary F2MC-8L Family Support tools 16-bit Proprietary F2MC-16L Family F2MC-16LX Family F2MC-16F Family Support tools 32-bit FR Family Support tools Microcontroller product list


    Original     		PDF 16-bit F2MC-16L F2MC-16LX F2MC-16F 32-bit 10-bit MB90V241 MB2140A MB90F243 MB89371A mb89371AH mb89371 MB89195A 8 bit dip switch nec 16f MB90P263PF MB90P263 MB2142-01 detailed vfd circuit diagram for motor

    Untitled

    Abstract: No abstract text available
    Text: Technical Brief 347 Tape and Reel Specification for Integrated Circuits Introduction Many Surface Mounted Devices SMDs are being packaged for shipment in embossed tape and wound onto reels. The Intersil tape and reel specifications are in compliance with


    Original     		PDF EIA-481 TB347

    T444

    Abstract: 100-PIN CS7410 CS7410-CM CS7410-CQ
    Text: CS7410 CD/MP3/WMA Audio Controller Description Features l Super on-chip Integration for low cost and low count bill of materials l 32-Bit RISC Processor performs audio decode and system management functions l 16-bit DSP for audio special effects l 80 Kbytes internal SRAM, and 256 Kbytes internal ROM


    Original     		PDF CS7410 32-Bit 16-bit IEC-958 DS553PP1 100-PIN 20X14X2 T444 CS7410 CS7410-CM CS7410-CQ

    100-PIN

    Abstract: CS7410 CS7410-CM CS7410-CQ
    Text: CS7410 CD/MP3/WMA Audio Controller Features Description Super on-chip Integration for low cost and low count bill of materials 32-Bit RISC Processor performs audio decode and system management functions 16-bit DSP for audio special effects 80 Kbytes internal SRAM, and 256 Kbytes internal ROM


    Original     		PDF CS7410 32-Bit 16-bit IEC-958 100-Pin 14X14X1 DS553PP1 CS7410 CS7410-CM CS7410-CQ

    JSTD-020

    Abstract: DM035 26438
    Text: RELIABILITY MONITOR DS1232L JAN '01 MONITOR REVISION DATE CD LOT NUMBER PINS PACKAGE 0051 DK038265AAC 8 C2-L SOIC PROCESS Single Poly, Single Metal 0.8 µm Standard Process DEVICE DS1232 WIDTH ASSEMBLY SITE 150x1.4 ATP Anam, PI JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original     		PDF DS1232L DK038265AAC DS1232 J-STD-020 85C/85% 14x20x DS80CH11 DS80CH11 DN034351AA JSTD-020 DM035 26438

    1f1-1717-a19

    Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
    Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O


    Original     		PDF 60WMBG 60M/54WBGA-8 10X15 10-8X12-A LA69-00635A 48TBGA 48-TBGA-10 0-8X16-O LA69-00267A ADS11981 1f1-1717-a19 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9

    Untitled

    Abstract: No abstract text available
    Text: CLA200 Series M IT E L CMOS Gate Arrays Advance Information SEMICONDUCTOR DS4812 -1 .3 July 1997 IN TR O D U C TIO N The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to


    OCR Scan     		PDF CLA200 DS4812

    d2zd

    Abstract: No abstract text available
    Text: — z VA RIA TIO N S D D1 - D2- - s L MIN. MAX. MIN. D A 3.00 O fU 3.00 0.10 0.25 0.10 0.25 2.55 2.75 2.55 2.75 17.20 BSC. 17.20 BSC. 14.00 BSC. 14.00 BSC. 12.00 BSC. 12.00 BSC. 1.00 REF. 1.00 REF. 17.20 BSC. 17.20 BSC. 14.00 BSC. 14.00 BSC. 12.00 BSC.


    OCR Scan     		PDF MD-108 MS-022 254nn MS-022. 14X14nn d2zd