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    MQFP 52 PACKAGE Search Results

    MQFP 52 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    MQFP 52 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    on 5295

    Abstract: on 5295 transistor MQFP 52 PACKAGE
    Text: a 0.95 0.0374 0.80 (0.0315) 0.65 (0.0256) 52-Lead MQFP Package (S-52) Dimensions shown in millimeters and (inches) 13.45 (0.5295) 13.20 (0.5197) SQ 12.95 (0.5098) 2.45 (0.0965) MAX 39 27 40 SEATING PLANE 26 7.80 (0.3071) REF 10.11 (0.3980) 10.00 (0.3937) SQ


    Original     		PDF 52-Lead on 5295 on 5295 transistor MQFP 52 PACKAGE

    S-52

    Abstract: No abstract text available
    Text: a 1.03 0.88 0.73 52-Lead Plastic Quad Flatpack Package [MQFP] S-52 Dimensions shown in millimeters 13.45 13.20 SQ 12.95 2.45 MAX 39 27 40 SEATING PLANE 26 7.80 REF 10.20 10.00 SQ 9.80 TOP VIEW (PINS DOWN) VIEW A PIN 1 52 14 1 0.23 0.11 13 0.65 BSC 2.20 2.00


    Original     		PDF 52-Lead MO-022AC S-52

    52LEAD

    Abstract: S-52
    Text: a 1.03 0.88 0.73 52-Lead Metric Quad Flat Package [MQFP] S-52 Dimensions shown in millimeters 14.15 13.90 SQ 13.65 2.45 MAX 39 27 40 SEATING PLANE 26 7.80 REF 10.20 10.00 SQ 9.80 TOP VIEW (PINS DOWN) VIEW A PIN 1 52 14 1 0.23 0.11 13 0.65 BSC 2.10 2.00 1.95


    Original     		PDF 52-Lead MO-022-AC-1 52LEAD S-52

    MS-022-AC

    Abstract: s52-1 S521
    Text: a 52-Lead Metric Quad Flat Package [MQFP] S-52-1 Dimensions shown in millimeters 1.03 0.88 0.73 13.45 13.20 SQ 12.95 2.45 MAX 39 SEATING PLANE 27 40 26 7.80 REF TOP VIEW 10؇ 6؇ 2؇ 2.20 2.00 1.80 0.25 0.10 VIEW A ROTATED 90؇ CCW 10.20 10.00 SQ 9.80 (PINS DOWN)


    Original     		PDF 52-Lead S-52-1) MS-022-AC. MS-022-AC s52-1 S521

    s522

    Abstract: No abstract text available
    Text: a 52-Lead Metric Quad Flat Package [MQFP] S-52-2 Dimensions shown in millimeters 1.03 0.88 0.73 14.15 13.90 SQ 13.65 2.45 MAX 39 SEATING PLANE 27 40 26 7.80 REF TOP VIEW 10.20 10.00 SQ 9.80 (PINS DOWN) 10؇ 6؇ 2؇ 2.10 2.00 1.95 0.25 MIN VIEW A 0.23 0.11


    Original     		PDF 52-Lead S-52-2) MO-112-AC-1 s522

    E1 396

    Abstract: 0537
    Text: Package Information Drawing M2 – 52-Pin Metric Quad Flatpack MQFP (Package Type M) D D1 D3 52 1 2 3 Index Mark E3 E1 E C A2 B e1 A α A1 L Family: Metric Quad Flatpack Package Millimeters Symbol Min Max α 0° A Inches Min Max 7° 0° 7° – 3.05 –


    Original     		PDF 52-Pin 030195R7 E1 396 0537

    Bt864AKRF

    Abstract: Bt865AKRF conexant bt864 100138-004 BT856 mallory tsc CCIR601 CCIR656 YC16 Bt864A
    Text: Bt864A/Bt865A YCrCb to NTSC/PAL Digital Video Encoder Data Sheet 100138C February 2003 Ordering Information Model Number Description Package Bt864AKRF YCrCb to NTSC/PAL Digital Video Encoder without Macrovision 52-Pin MQFP Bt865AKRF YCrCb to NTSC/PAL Digital Video Encoder with Macrovision


    Original     		PDF Bt864A/Bt865A 100138C Bt864AKRF 52-Pin Bt865AKRF L865A) 02084A d864er3 100184B) Bt864AKRF Bt865AKRF conexant bt864 100138-004 BT856 mallory tsc CCIR601 CCIR656 YC16 Bt864A

    CS42888

    Abstract: CS42448
    Text: MULTICHANNEL CODECS CS424XX CS42448/888 64-pin LQFP Package –95 / –98 DACs; –95 / –98 ADCs 192 Multichannel CODEC, 6/8 DACs, 4/6 ADCs, TDM I/F 52 MQFP 192 SingleVA = 3.3 or 5; Ended or MultiDifferential VD = 3.3 or 5; channel VL = 1.8 to 5


    Original     		PDF CS424XX CS42448/888 64-pin CS42432/35/ CS42888 0142-1008-PB CS42448

    MQUAD

    Abstract: No abstract text available
    Text: MECHANICAL DATA MMQF010 – OCTOBER 1994 METAL QUAD MQUAD FLATPACK MEP (S-MQFP-G208) 156 105 104 157 0,27 0,17 0,08 M 0,50 53 208 1 0,16 NOM 52 25,50 TYP 27,74 SQ 27,54 Gage Plane 30,80 SQ 30,40 0,25 0,25 MIN 3,30 TYP 0°– 7° ā 0,60 0,40 Seating Plane


    Original     		PDF MMQF010 S-MQFP-G208) MQUAD

    MQUAD

    Abstract: No abstract text available
    Text: MECHANICAL DATA MMQF010 – OCTOBER 1994 METAL QUAD MQUAD FLATPACK MEP (S-MQFP-G208) 156 105 104 157 0,27 0,17 0,08 M 0,50 53 208 1 0,16 NOM 52 25,50 TYP 27,74 SQ 27,54 Gage Plane 30,80 SQ 30,40 0,25 0,25 MIN 3,30 TYP 0°– 7° ā 0,60 0,40 Seating Plane


    Original     		PDF MMQF010 S-MQFP-G208) MQUAD

    Untitled

    Abstract: No abstract text available
    Text: MECHANICAL DATA MMQF009 – OCTOBER 1994 METAL QUAD MQUAD FLATPACK (DIE-DOWN) MEO (S-MQFP-G208) 156 105 104 157 0,27 0,17 0,08 M 0,50 53 208 1 0,16 NOM 52 25,50 TYP 27,74 SQ 27,54 Gage Plane 30,80 SQ 30,40 0,25 0,25 MIN 3,30 TYP 0°– 7° 0,60 0,40 Seating Plane


    Original     		PDF MMQF009 S-MQFP-G208)

    MO-112

    Abstract: MS-029 MATRIX TRAY MS-022 LD240
    Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced


    Original     		PDF

    MO-112

    Abstract: MS-022 MS-029 DS250G JEDEC standard 033
    Text: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,


    Original     		PDF

    LD 337

    Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
    Text: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material


    Original     		PDF

    CRM-1076DJ-G

    Abstract: CRM*1076 CRM-1076 SUMITOMO g600f CRM1076DJ sumitomo crm 1076dj ABLEBONd 84-1 sumitomo crm
    Text: 52-Lead Quad Flat Pack QFP Package Change & Transfer Product Change Notice PCN1103 (v1.0) December 01, 2011 Overview This notice describes the package changes to the 52 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC 429, MILSTD 1553, and LCD Display Driver family of devices.


    Original     		PDF 52-Lead PCN1103 QR-1003 100-Lead QR-1131 44-Lead CRM-1076DJ-G CRM*1076 CRM-1076 SUMITOMO g600f CRM1076DJ sumitomo crm 1076dj ABLEBONd 84-1 sumitomo crm

    CXD1160aq

    Abstract: VL82C486-FC2 VL82C486FC NCR53C720 vl82c486 cxd1160 74HC125 EPM7128 d75304gf A1280
    Text: Issued March 1997 232-5109 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.


    Original     		PDF A1240-2 A1240A-2 A1280 A1425 A1460 CXD1160aq VL82C486-FC2 VL82C486FC NCR53C720 vl82c486 cxd1160 74HC125 EPM7128 d75304gf A1280

    MD300-10A

    Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
    Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA

    VL82C486-FC2

    Abstract: NCR53C720 XCS3201FN SN74ACT8818 NCR53C700 cxd1160 VL82C316 CL-GD6440 xc3042-100pq100c CXD1160AQ
    Text: Issued November 1994 018-994 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.


    Original     		PDF A1240-2 A1240A-2 A1280 A1425 A1460 VL82C486-FC2 NCR53C720 XCS3201FN SN74ACT8818 NCR53C700 cxd1160 VL82C316 CL-GD6440 xc3042-100pq100c CXD1160AQ

    JESD51-7

    Abstract: 100L JESD51-2 STATS ChipPAC Techpoint
    Text: MQFP Metric Quad Flat Pack • 10 x 10mm to 32 x 32mm body sizes • 44 to 240 lead counts • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 10 x 10mm to 32 x 32mm STATS ChipPAC’s Metric Quad Flat Pack MQFP is a leadframe based, plastic encapsulated package with gull


    Original     		PDF 80mmC JESD51-7 100L JESD51-2 STATS ChipPAC Techpoint

    MO-108

    Abstract: No abstract text available
    Text: QFP/MQFP PACKAGE 2.00 mm. Nom. Body Thickness JEDEC Variation SYMBOL N A A1 A2 b c D D1 D2 E E1 E2 e L θ ccc AA-1 MIN / MAX 44 - / 2.70 0.25 / 0.50 1.80 / 2.20 0.29 / 0.45 0.11 / 0.23 13.20 BASIC 10.00 BASIC 8.00 Ref. 13.20 BASIC 10.00 BASIC 8.00 Ref.


    Original     		PDF MO-108 MO-108

    ADUC836

    Abstract: MQFP MQFP 52 PACKAGE AD7706 AD7731 AD7853
    Text: uCONVETERS MODEL ADuC812 ADuC831 ADuC832 ADuC824 ADuC834 ADuC816 ADuC814 ADuC814 ADuC836 Core Core Processor A/D 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 Date Printed 8/20/02 AD7853 8ch AD7853 8ch AD7853 8ch AD7731+AD7706 AD7731+AD7706


    Original     		PDF ADuC812 ADuC831 ADuC832 ADuC824 ADuC834 ADuC816 ADuC814 ADuC836 AD7853 ADUC836 MQFP MQFP 52 PACKAGE AD7706 AD7731

    HI-7159

    Abstract: ICL7135 HI3276 HI-5701 HI5714 HI5746 HI-574A HI5766 HI5767 ISL51002
    Text: Data Converters 5 2008 P RODUCT S ELECTION GUIDE Data Converters pg. 5-1 1-Channel (ADCs) (pg. 5-2) 1-Channel (DACs) (pg. 5-4) 2-Channel (ADCs) (pg. 5-3) 2-Channel (DACs) (pg. 5-5) Integrating Display Output (A-D) Data Converters (pg. 5-3) Non-Volatile DACs


    Original     		PDF 1-888-INTERSIL HA-2425 HA-5320 HA-5330 HA5351 HI-7159 ICL7135 HI3276 HI-5701 HI5714 HI5746 HI-574A HI5766 HI5767 ISL51002

    g796

    Abstract: DIAGRAM IC an 7582 MT9075 MT9075AP MO-112 MT9075AL PCM30 pcm ami
    Text: MT9075  E1 Single Chip Transceiver Advance Information Features Combined PCM 30 framer, Line Interface Unit LIU and link controller in a 68 pin PLCC or 100 pin MQFP package Selectable rate data link access with optional Sa bits HDLC controller (HDLC0) and channel


    Original     		PDF MT9075 MT9075 g796 DIAGRAM IC an 7582 MT9075AP MO-112 MT9075AL PCM30 pcm ami

    transistor npn 4-071

    Abstract: SIN16 Power MOSFET Selection Guide TRANSISTOR FOR 10GHz oscillator CA3081 CFB600 mosfet selection guide CA3146 NPN
    Text: A/D CONVERTERS PART NO. DESCRIPTION RESO­ CONVER­ LUTION SION RATE BITS (MIN) (MSPS) BAND­ WIDTH (MHz) SINAD A T f,„ (dB) DIFF. GAIN (%) DIFF. PHASE (DEG.) POWER DISSIPATION (mW) LOGIC TYPE SUPPLY VOLTAGE PACKAGE OPTIONS (V) (NOTE 1) (NOTE 2) TEMP. AnswerFAXSM EVAL


    OCR Scan     		PDF HI5710A HI5746 HI5703 HI5766 HI5800 HI5804 HIS805 HI5808 12-Bit 10MHz transistor npn 4-071 SIN16 Power MOSFET Selection Guide TRANSISTOR FOR 10GHz oscillator CA3081 CFB600 mosfet selection guide CA3146 NPN