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    MS8150 Search Results

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    MS8150 Price and Stock

    Microchip Technology Inc MS8150-P2613

    GAAS SCHOTTKY NON HERMETIC FLIP
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    DigiKey MS8150-P2613 Tray
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    Microchip Technology Inc MS8150-P2613 18 Weeks
    • 1 $12.83
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    • 100 $11.57
    • 1000 $10.43
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    NAC MS8150-P2613 135
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    Microchip Technology Inc MS8150-6498

    GaAs Schottky Non Hermetic Flip Chip, Projected EOL: 2044-08-15
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    Microchip Technology Inc MS8150-6498 52 16 Weeks
    • 1 $15.09
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    Onlinecomponents.com MS8150-6498
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    NAC MS8150-6498 1
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    Microsemi Corporation MS8150-P2613

    RF SCHOTTKY DIODE
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    Richardson RFPD MS8150-P2613 1
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    MS8150 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MS8150

    Abstract: MS8150-P2613 P2613
    Text: GaAs Schottky Devices Low RS Flip Chip TM MS8150 - P2613 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features ● Capacitance 65 fF Typ. ● Low Series Resistance (3  Typ.) ● Cut-off Frequency > 500 GHz ● Large Gold Bond Pads


    Original     		PDF MS8150 P2613 MS8150-P2613 x10-13 P2613

    Untitled

    Abstract: No abstract text available
    Text: GaAs Schottky Devices Low RS Flip Chip TM MS8150 - P2613 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features ● Capacitance 65 fF Typ. ● Low Series Resistance (3  Typ.) ● Cut-off Frequency > 500 GHz ● Large Gold Bond Pads


    Original     		PDF MS8150 P2613 MS8150-P2613 x10-13

    Untitled

    Abstract: No abstract text available
    Text: GaAs Schottky Devices Low RS Flip Chip TM MS8150 - P2613 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features Capacitance 65 fF Typ. Low Series Resistance (3  Typ.) Cut-off Frequency > 500 GHz Description Large Gold Bond Pads


    Original     		PDF MS8150 P2613 MS8150-P2613 dev508 x10-13

    DC-37PTI

    Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
    Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.


    Original     		PDF C-865 UT-304 FCT-551 FCT-552 DC-37PTI ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500

    5-176-3 terminal block

    Abstract: mini circuits 15542 MS14141 DIN 18541 8-32X3 s31512 mini 15542 P-306-CCE 5-140-Y E61245
    Text: COMMERCIAL Barrier Blocks Circular Mini DIN BNC Jones Plugs Edge Connectors Commercial [.050” 1.27mm Density Solder Introduction Cup/Wire D-Microminiature] Cinch Commercial Products, consisting of Jones Plugs and Sockets, Barrier Blocks, Edge Cards, Two-Piece Commercial Dins,


    Original     		PDF

    LE79Q2281

    Abstract: 1N6761-1 2N2369AU 2N2907AUB BR17 datasheet transistor SI 6822 Dimming LED aplications Dimming LED Driver aplications GC4600 IC ZL70572
    Text: Product Portfolio 2013-2014 ng-edge Embed Power Matters. About Microsemi Microsemi Corporation is a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. The company concentrates on providing solutions for applications where power matters, security


    Original     		PDF

    DIN 41529

    Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
    Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.


    Original     		PDF C-865 UT-304 FCT-551 FCT-552 DIN 41529 bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb

    BACC63CB

    Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
    Text: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.


    Original     		PDF C-865 UT-304 FCT-551 FCT-552 BACC63CB bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft

    MS-5-150

    Abstract: MS4150
    Text: .688 Density, 10-32 x 5/16" BH Screw, Open Bottom, Double Row Barrier Blocks Series 150 Electrical Characteristics Voltage Rating: 250 VAC RMS maximum Current Rating: 40 Amps maximum Maximum Watts Per Terminal: 10,000 Mechanical Characteristics Maximum Wire Size: #10 AWG


    Original     		PDF 1-150-Y 2-150-Y 3-150-Y 4-150-Y 5-150-Y 6-150-Y 7-150-Y 8-150-Y 9-150-Y 10-150-Y MS-5-150 MS4150

    MS8151

    Abstract: MS8150-P2613 P2613
    Text: GaAs Schottky Devices Low CT Flip Chip TM MS8151 - P2613 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features ● Capacitance 45 fF Typ. ● Low Series Resistance (7  Typ.) ● Cut-off Frequency > 500 GHz ● Large Gold Bond Pads


    Original     		PDF MS8151 P2613 MS8151-P2613 x10-13 MS8150-P2613 P2613

    MG1007-42

    Abstract: MG1020-M16 MSC1075M 1004mp MG1052-30
    Text: Power Matters. RF & Microwave Diode and Transistor Products Microsemi RFIS Integrated Solutions RF & Microwave Diode and Transistor Products Within this short form catalog are the combined product selection guides for Microsemi RF Integrated Solutions RFIS business unit RF & microwave diodes and power transistors. RFIS diode products are


    Original     		PDF MS4-009-13 MG1007-42 MG1020-M16 MSC1075M 1004mp MG1052-30

    mini circuits 15542

    Abstract: chocolate vending machine 16161L mdc-8p13 25541 DIN 18541 MSX-10 302-RP 50-12SN-3 Cinch fanning strip 10-160b-r
    Text: COMMERCIAL Barrier Blocks Circular Mini DIN BNC Jones Plugs Edge Connectors Commercial [.050” 1.27mm Density Solder Introduction Cup/Wire D-Microminiature] Cinch Commercial Products, consisting of Jones Plugs and Sockets, Barrier Blocks, Edge Cards, Two-Piece Commercial Dins,


    Original     		PDF