MT4C16257DJ-6
Abstract: MT4C16257 MT4C16257DJ-6 pin out mt4c16257dj
Text: 256K x 16 FPM DRAM TECHNOLOGY, INC. MT4C16257 DRAM FEATURES • Industry-standard x16 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process • Single +5V ±10% power supply • All inputs, outputs and clocks are TTL-compatible
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Original
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MT4C16257
512-cycle
40-Pin
MT4C16257DJ-6
MT4C16257
MT4C16257DJ-6 pin out
mt4c16257dj
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PDF
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TC5118160
Abstract: msm-561 TMS444000 msm561 M5M418165 M5M418160 tms44c256 TC5117405 HY514264 HY514260
Text: New Page 1 DRAM 1Meg 1Mx1 256Kx4 FPM FPM Fujitsu MB81C100 MB81C4256 Goldstar GM71C100 GM71C4256 Hitachi HM511000 HM514256 Hyundai HY531000 HY534256 Micron MT4C1024 MT4C4256 Mitsubishi M5M41000 M5M44256 Nec UPD421000 UPD424256 Oki MSM511000 MSM514256 Samsung alt KM41C1000 KM44C256
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Original
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256Kx4
MB81C100
MB81C4256
GM71C100
GM71C4256
HM511000
HM514256
HY531000
HY534256
MT4C1024
TC5118160
msm-561
TMS444000
msm561
M5M418165
M5M418160
tms44c256
TC5117405
HY514264
HY514260
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PDF
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Untitled
Abstract: No abstract text available
Text: m i t i » MT4C16256/7/8/9 L 256K X 1 6 WIDE DRAM MICRON • SEMICONDUCTOR. MC WIDE DRAM 256KX16DRAM LOW POWER, EXTENDED REFRESH FEATURES PIN ASSIGNMENT Top View • Industry-standard xl6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process
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OCR Scan
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MT4C16256/7/8/9
256KX16DRAM
MT4C16257
MT4C16258/9
512-cycle
500mW
T4C1S256/7/VU.
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PDF
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Untitled
Abstract: No abstract text available
Text: '993 Tí* PRELIMINARY MT4C16256/7/8/9 256K X 16 WIDE DRAM MICRON I SCHICONDUCTOR MC WIDE DRAM 256K X 16 DRAM FAST-PAGE-MODE FEATURES OPTIONS PIN ASSIGNMENT Top View 40-Pin SOJ (DC-6) Vcc [ 1 DOl [ 2 D02 E 3 D03 E 4 004 [ 5 • Write Cycle Access _ BYTE or WORD via WE
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OCR Scan
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MT4C16256/7/8/9
40-Pin
C1993
MT4C162S6/7/V9
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PDF
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MT4C16257
Abstract: No abstract text available
Text: MT4C16257 L 256KX 16 DRAM (M IC R O N 256K x 16 DRAM DRAM 5V, FAST PAGE MODE, OPTIONAL EXTENDED REFRESH FEATURES • Industry-standard xl6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process • Single +5V +10% power supply*
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OCR Scan
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MT4C16257
256KX
375mW
512-cycle
12/9S
L1115H7
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PDF
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY MT4C16256/7/8/9 L 256K X 16 WIDE DRAM M IC R O N 256KX16DRAM WIDE DRAM LOW POWER, EXTENDED REFRESH FEATURES PIN ASSIG N M EN T Top View OPTIONS • Write Cycle Access BYTE or WORD via WE - (maskable) BYTE or WORD via CÄS (maskable) • Packages
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OCR Scan
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MT4C16256/7/8/9
256KX16DRAM
40-Pin
MT4C16256/7/8/9L
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PDF
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Untitled
Abstract: No abstract text available
Text: m . i s MT4C16256/7/8/9 256K X 16 WIDE DRAM MICRON • ««ICOHOliCTOR MC WIDE DRAM 256K X 16 DRAM FAST-PAGE-MODE FEATURES • Industry-standard xl6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process • Single +5V ±10% pow er supply*
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OCR Scan
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MT4C16256/7/8/9
512-cycle
MT4C16257/9
MT4C16258/9
Tim93
MT4C162SS/7/I/9
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PDF
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY MT4C16256/7/8/9 256KX 16 WIDE DRAM MICRON WIDE DRAM 256K 16 DRAM X FAST-PAGE-MODE FEATURES • Industry-standard x l6 pinouts, timing, functions and packages • High-perform ance CM OS silicon-gate process • Single +5V ±10% power supply • Low power, 3mW standby; 500m W active, typical
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OCR Scan
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MT4C16256/7/8/9
256KX
512-cycle
40-Pin
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PDF
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BCM 6302
Abstract: micron MT4C database for 4081 ic
Text: OBSOLETE MARCH 1995 D18A 512K X 8, 256K x 16 D R A M D IE I^IICRON 512Kx 8, 256Kx 16 DRAM DRAM DIE MT4C8512D18A and MT4C16257D18A G EN ERAL PHYSICAL SPECIFICATIONS • Wafer thickness =18.5 mils ±0.5 mils. • The backside wafer surface Is polished bare silicon.
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OCR Scan
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114x114
512Kx
256Kx
MT4C8512D18A
MT4C16257D18A
150mm
BCM 6302
micron MT4C
database for 4081 ic
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PDF
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Untitled
Abstract: No abstract text available
Text: m ' i PRELIMINARY MT4C16256/7/8/9 L 256K X 16 WIDE DRAM MICRON I SEMICONDUCTOR MC WIDE DRAM 256K x 16 DRAM LOW POWER, EXTENDED REFRESH FEATURES • In d u stry -stan d ard x l6 pinouts, tim ing, functions a n d packages • H igh-perform ance CMOS silicon-gate process
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OCR Scan
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MT4C16256/7/8/9
T4C16257/9
T4C16258/9
512-cyde
500mW
MT4C162S6/7/W
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PDF
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MT4C16257DJ-6
Abstract: No abstract text available
Text: 256K X 16 FPM DRAM MICRON I TECHNOLOGY, INC. DRAM MT4C16257 FEATURES • In d u stry -sta n d a rd x l6 p in o u ts, tim ing, functions an d packages • H igh-perform ance CM OS silicon-gate process • Single +5V +10% p o w er su p p ly • All in p u ts, o u tp u ts an d clocks are TTL-com patible
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OCR Scan
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MT4C16257
512-cycle
40-Pin
MT4C16257DJ-6
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PDF
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MT4C16257
Abstract: No abstract text available
Text: p iC R MT4C16257 L 256K X 16 DRAM O N DRAM 256K x 16 DRAM 5V, FAST PAGE MODE, OPTIONAL EXTENDED REFRESH FEATURES • In d u stry-stan d ard x l 6 p in o u ts, tim in g , fu n ctio n s an d p ackages • H ig h -p erfo rm a n ce C M O S silico n -g a te p ro cess
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OCR Scan
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MT4C16257
512-cy
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PDF
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T4C16257
Abstract: MT4C16256
Text: MT4C16256/7 256K X 16 DRAM M IC R O N D R A M X 2 5 6 K 1 6 D R A M FAST PAGE MODE FEATURES • Industry-standard x l6 pinouts, tim ing, functions and packages • High-perform ance CM OS silicon-gate process • Single +5V ±10% power supply* • Low power, 3m W standby; 375m W active, typical
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OCR Scan
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MT4C16256/7
512-cycle
T4C16257
40-Pin
40/44-Pin
S1994,
MT4C16256
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PDF
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Untitled
Abstract: No abstract text available
Text: MICRON MT4C16257 256K X 16 DRAM I ,lt— DRAM 256K x 16 DRAM 5V, FAST PAGE M O DE PIN ASSIGNMENT Top View • In d u stry -sta n d a rd x l 6 p in o u ts, tim in g , fu n ctio n s an d packages • H ig h -p erfo rm a n ce C M O S silico n -g ate process
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OCR Scan
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MT4C16257
12-cy
40-Pin
00122A2
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PDF
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY MT4C16256/7/8/9 S 256K X 16 WIDE DRAM I^ IIC Z R O N WIDE DRAM 256K x 16 DRAM FEATURES • SE L F REFRESH , or "S lee p M o d e " • In d ustry -stan dard x l6 pin ou ts, tim ing, functions an d p a ck a g e s • H igh -perform an ce C M O S silicon-gate process
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OCR Scan
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MT4C16256/7/8/9
500mW
512-cycle
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PDF
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AU 6256 28
Abstract: 4043 cmos rs latch
Text: PRELIMINARY MT4C16256/7/8/9 L 256K X 16 WIDE DRAM M IC R O N 256K x 16 DRAM WIDE DRAM FEATURES PIN ASSIGNMENT Top View • In d u stry -stan d a rd x l 6 p in o u ts, tim in g , fu n ctio n s an d p ack ag es • H ig h -p e rfo rm a n ce C M O S silico n -g a te process
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OCR Scan
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MT4C16256/7/8/9
12-cy
AU 6256 28
4043 cmos rs latch
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PDF
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MT4C16257
Abstract: RCD 2226 MT4C16256 256K 16bit DRAM zip
Text: MICRON TECHNOLOGY INC ADVANCE MICRON • TECHWfìl OGV INC. S5E » ■ b lllS H T MT4C16256/7/8/9 256KX 16 DRAM DÜD4S3T TTT ■ URN 2 5 6 K X 1 6 DRAM DRAM FAST PAGE MODE Zj-j'y • Industry standard xl6 pinouts, timing, functions and packages • High-performance, CMOS silicon-gate process
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OCR Scan
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MT4C16256/7/8/9
256Kx
500mW
MT4C16257/9
MT4C16258/9
T-46-23-17
CYCLE24
MT4C10256/7/8/9
MT4C16257
RCD 2226
MT4C16256
256K 16bit DRAM zip
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PDF
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Untitled
Abstract: No abstract text available
Text: ADVANCE MT4C16256/7/8/9 L 256KX 16 DRAM MICRON I r iCH NOLOGY. IN2 MICRON TECHNOLOGY INC 55E P DRAM • LlllSM'î 0G04Sbl IMS HIMRN JEW 256K X16 DRAM LOW POWER, EXTENDED REFRESH — - :- S -1 7 - PIN ASSIGNMENT Top View
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OCR Scan
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MT4C16256/7/8/9
256KX
0G04Sbl
MT4C16257/9
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PDF
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Untitled
Abstract: No abstract text available
Text: M ICRON SEM ICONDUCTOR INC b 'iE D m b i l l 5 HT G D G cì cì f i 3 B i MRN MT4C16256/7 L 256K X 16 DRAM MICRON I TTh SEPiCO ND'J CIO FiU JC. 256K x 16 DRAM LOW POWER, EXTENDED REFRESH FEATURES • Industry-standard xl6 pinouts, timing, functions and packages
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OCR Scan
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MT4C16256/7
512-cycle
MT4C16257
MT4C162Se/7L
MT4C162SOTL
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PDF
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Untitled
Abstract: No abstract text available
Text: MICRON SEMICOND UCT OR INC bTE D • b l l l S M 11! DDÜTTbö 7ÖT ■ MRN M ir D H M 1 semiconductor inc. MT4C16256/7 256K X 16 DRAM 2 5 6 K X 16 DRAM DRAM FAST PAGE MODE FEATURES • Industry-standard xl6 pinouts, timing, functions and packages • High-performance CMOS silicon-gate process
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OCR Scan
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MT4C16256/7
512-cycle
MT4C16257
MT4C162S6/7
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PDF
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MT4C16257
Abstract: No abstract text available
Text: PRELIMINARY |viic:noN 256K MT4C16256/7/8/9 16 WIDE DRAM X 256K X 16 DRAM WIDE DRAM FAST-PAGE-MODE FEATURES • Industry-standard xl6 pinouts, tim ing, functions and packages • H igh-perform ance CMOS silicon-gate process • Single +5V ±10% pow er supply
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OCR Scan
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MT4C16256/7/8/9
512-cycle
MT4C16257/9
MT4C16258/9
40-Pin
MT4C16257
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PDF
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Untitled
Abstract: No abstract text available
Text: MICRON SEMICONDUCTOR INC b?E D • b 1 1 1 5 MT 000^7=57 711 ■ MRN OBSOLETE JUNE 94 D18A 512K X 8, 256K X 16 DRAM DIE M IC R O N B SEMiCONO'JCTOa INC. 512Kx8, 256Kx16 DRAM DRAM DIE MT4C8512D18A and MT4C16257D18A GENERAL PHYSICAL SPECIFICATIONS • • •
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OCR Scan
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114x114
512Kx8,
256Kx16
MT4C8512D18A
MT4C16257D18A
150mm
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PDF
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Untitled
Abstract: No abstract text available
Text: ADVANCE MICRON MT4LC16257 S I 2256KX 5 6 K X 16 DRAM DRAM 256K x 16 DRAM 3.3V, FAST PAGE MODE, OPTIONAL SELF REFRESH PIN ASSIGNMENT (Top View) • Industry-standard x l6 pinouts, timing, functions and packages • High-perform ance CMOS silicon-gate process
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OCR Scan
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MT4LC16257
256KX
512-cycle
MT4LC16257)
T4LC16257S)
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PDF
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Untitled
Abstract: No abstract text available
Text: MT2D25632, MT4D51232 256K, 512K x 32 DRAM MODULE MICRON I TECHNOLOGY. INC DRAM MODULE 256K, 512K x 32 1, 2 MEGABYTE, 5V, FAST PAGE MODE FEATURES PIN ASSIGNMENT Front View OPTIONS 72-Pin SIMM (DD-5) 256K x 32 (DD-6) 512K x 32 o imïïïïirrffrrmmy^^ 1 PIN#
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OCR Scan
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MT2D25632,
MT4D51232
72-Pin
41ucts
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PDF
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