10131318-18221G0LF
Amphenol Communications Solutions
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Black Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
77311-818-29LF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
10131318-1822100LF
Amphenol Communications Solutions
Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Black Color, 18 Positions, Non GW Compatible Nylon66, Tray Packing.
77311-818-26LF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch.
77311-818-27LF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 27 Positions, 2.54 mm Pitch.