SIGNETICS
Abstract: 10X10MM TQFN 72-QFN
Text: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFN Sawn Signetics TQFN, WQFN, and UQFN The Signetics QFN package is a low cost, lead frame packaging solution that offers excellent thermal and electrical performance with minimal costs. Electrical performance
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10x10MM
C/-65
C/100%
15PSIG,
168hrs
SIGNETICS
10X10MM
TQFN
72-QFN
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FG676
Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
TQ100
TQ128
TQ144
TQ176
VQ100
FG676
PCB footprint cqfp 132
741 smd ic
cb228 footprint
PCB footprint cqfp 100
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Untitled
Abstract: No abstract text available
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
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MS-034-AAn-1
Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
BF957
BG225
BG256
BG352
BG432
BG492
BG560
BG575
BG728
MS-034-AAn-1
ak 957
MS-034 1152 BGA
BGA 31 x 31 mm
MO-047
MS026-ACD
MO-113-AA-AD
MS-034-AAU-1
MO-151 AAL-1
OPD0002
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EIA-556-A
Abstract: xilinx packaging label polystyrene EIA-556A
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
equipmQ100
TQ144
VQ100
EIA-556-A
xilinx packaging label
polystyrene
EIA-556A
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ipc-sm-786A
Abstract: No abstract text available
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
J-STD-020
ipc-sm-786A
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EFTEC-64
Abstract: OPQ0014
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
HQ160
HQ208
HQ240
HQ304
MO-108DDI
OPQ0021
143-FA
OPQ0020
MO-143-GA
EFTEC-64
OPQ0014
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PDF
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reflow soldering profile BGA
Abstract: FC-5312
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
FC5312
reflow soldering profile BGA
FC-5312
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ppga package
Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and
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outline of the heat slug for JEDEC
Abstract: outline of the heat sink for JEDEC power led heat sink diode databook diode databook package outline heat slug for JEDEC intel pin grid array package ppga package datasheet CPGA large cavity Intel CPGA with 68 pins
Text: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and
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LS 2027
Abstract: ic LM 356 equivalent 811 0305 01 LM 2545 ic LM 356
Text: Package Electrical Characterization National Semiconductor maintains a package group which specializes in the electrical characterization of IC packages. This group has access to a complete measurement lab consisting of network analyzers, TDR’s time domain reflection ,
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SUNSPARC10
SUN630MP
parame80
LS 2027
ic LM 356 equivalent
811 0305 01
LM 2545
ic LM 356
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Untitled
Abstract: No abstract text available
Text: Finisar Product Specification SW Detector 2Gbps, PIN+Pre-amp, TO-46 HFD3081-108 PRODUCT FEATURES • Low electrical parasitic TO-46 package • High performance GaAs PIN photodiode with separate transimpedance amplifier • Low electrical parasitic TO46 package
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HFD3081-108
155Mbps
HFD3081-108
850nm.
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AUGAT DIP SOCKETS
Abstract: No abstract text available
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Socket Manufacturers Table 1 lists manufacturers known to offer sockets for Xilinx Package types. This summary does not
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AUGAT DIP SOCKETS
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signetics
Abstract: No abstract text available
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics STBGA Signetics Tape Ball Grid Array Package STBGA is a cavity-down package that uses a tape-based substrate mounted to a copper heat spreader. The package offers superior electrical performance by the
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40x40MM
100um
192hr,
C/-65
C/100%
15PSIG,
168hrs
signetics
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signetics
Abstract: epbga EBGA epbga 304 signetics data book
Text: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics EPBGA Signetics Enhanced Performance Ball Grid Array Package EPBGA is a cavity-down package that uses a laminate substrate mounted to a copper heat spreader. The package offers superior electrical and thermal performance by the
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100um
31x31MM
192hr,
C/-65
C/100%
15PSIG,
168hrs
signetics
epbga
EBGA
epbga 304
signetics data book
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PDF
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AL0150
Abstract: AL0220 AL0330 AL0470 AL0680 AL0820 AL1000
Text: Low Power Inductor AL SERIES ° ° ° ° ° Designed for switch mode power converters & filters Compact Package Rugged Design Extended Operating temperature range DC Current Rating for 40°C temperature rise Electrical Data Electrical Characteristics at 25ºC
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AL0150
AL0220
AL0330
AL0470
AL0680
AL0820
AL1000
AL0150
AL0220
AL0330
AL0470
AL0680
AL0820
AL1000
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Untitled
Abstract: No abstract text available
Text: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and
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MSWS3T-1004
17ion
A17140
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Untitled
Abstract: No abstract text available
Text: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal
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MSWS3T-1004
A17140
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PDF
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Untitled
Abstract: No abstract text available
Text: MSWS3T-1004 PIN DIODE SWITCH ELEMENT PIN #10 PIN #13 PIN #8 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP3T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal
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MSWS3T-1004
A17140
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PDF
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Untitled
Abstract: No abstract text available
Text: MSWS4T-1004 PIN DIODE SWITCH ELEMENT PIN #13 PIN #8 PIN #16 PIN #5 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP4T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal
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MSWS4T-1004
A17141
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PDF
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Untitled
Abstract: No abstract text available
Text: MSW4T-1004 PIN DIODE SWITCH ELEMENT PIN #13 PIN #8 PIN #16 PIN #5 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP4T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and Thermal
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MSW4T-1004
A17141
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PDF
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Untitled
Abstract: No abstract text available
Text: MSWS4T-1004 PIN DIODE SWITCH ELEMENT PIN #13 PIN #8 PIN #16 PIN #5 PIN #2 Plastic Molded 16L 3x3 QFN Package paddle electrical & thermal ground Description Features A SP4T switch in a plastic 16L 3x3 QFN package. Each port is Electrical Series / Shunt Diode and
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MSWS4T-1004
A17141
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INTEL740
Abstract: GPI04 md44 MD56 MD57 AB22-AB23 AB24-AB25
Text: Electrical, Pinout, and Package Information intei Electrical, Pinout, and Package Information This chapter contains Intel740 graphics accelerator absolute maximum ratings, thermal characteristics, and DC characteristics. Pinout and package information are also provided.
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Intel740â
INTEL740
GPI04
md44
MD56
MD57
AB22-AB23
AB24-AB25
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ti486
Abstract: TI-486
Text: Chapter 5 Electrical Specifications Electrical specifications for the T I486 are provided in this chapter. The specifications include electrical connection requirements for all package pins, maximum ratings, recommended operating conditions, dc electrical, and ac
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TI486DLC/E
TI486DLC/E-V
D31-D0
A31-A2
ti486
TI-486
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