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    PACKAGE QFP 68 Search Results

    PACKAGE QFP 68 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    8501002YC Rochester Electronics LLC Microprocessor, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    8501001YA Rochester Electronics LLC Microprocessor, 16-Bit, 8MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    NG82370-16 Rochester Electronics LLC Multifunction Peripheral, CMOS, PQFP100, PLASTIC, QFP-100 Visit Rochester Electronics LLC Buy
    MQ80C196KB-12 Rochester Electronics LLC Microcontroller, 16-Bit, 6MHz, CMOS, CQFP68, CERAMIC, QFP-68 Visit Rochester Electronics LLC Buy
    TMC2081KBC Rochester Electronics LLC Consumer Circuit, PQFP128, METRIC, PLASTIC, QFP-128 Visit Rochester Electronics LLC Buy

    PACKAGE QFP 68 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: PA711D3-QFP Data Sheet 44 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring Using this adapter, the Motorola 68HC711D3 in the QFP package can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device


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    PDF PA711D3-QFP socket/28 68HC711D3 27C256 711D3QFP

    an 819

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN CERAMIC To Top / Package Lineup / Package Index FPT-68C-A01 68-pin ceramic QFP Lead pitch 1.00 mm Lead shape Gullwing Sealing method Metal seal FPT-68C-A01 68-pin ceramic QFP (FPT-68C-A01)


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    PDF FPT-68C-A01 68-pin FPT-68C-A01) F68001SC-1-2 an 819

    81901

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN CERAMIC To Top / Package Lineup / Package Index FPT-68C-A02 68-pin ceramic QFP Lead pitch 1.00 mm Lead shape Gullwing Sealing method Metal seal FPT-68C-A02 68-pin ceramic QFP (FPT-68C-A02)


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    PDF FPT-68C-A02 68-pin FPT-68C-A02) F68002SC-1-2 81901

    Untitled

    Abstract: No abstract text available
    Text: PA552-QFP Data Sheet 80 pin QFP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring This adapter allows programming of the Philips 87C552 and 87C554 in a QFP package on 40 pin DIP programmers capable of programming the 87C51Fx. The following chart shows the connections from the QFP device


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    PDF PA552-QFP socket/40 87C552 87C554 87C51Fx. 87C552 87C554 OT318-2) 87C51FA 87C51FB

    P40G-80-F-2

    Abstract: P44G-80-22 P48GH-80-2A5-4
    Text: e Mounting pad of QFP The nominal dimensions of QFP (quad flat package) are determined by the dimensions of the plastic body. For example, “64-pin 14 x 20 QFP” means that the body dimensions are 14 mm × 20 mm. In designing the mounting pads of this package, therefore, the body dimensions and pin dimensions


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    PDF 64-pin P120GD-80-5BB-3 P120GD-80-LBB, P136GD-65-5BC-3 P160GD-65-5BD-3 P160GD-65-LBD, S160GD-65-LGD, P184GN-65-LGT-1 S208GL-65-6GL-1 C10943X) P40G-80-F-2 P44G-80-22 P48GH-80-2A5-4

    FPT-144P-M05

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M05 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.45mm MAX FPT-144P-M05 144-pin plastic QFP (FPT-144P-M05)


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    PDF FPT-144P-M05 144-pin FPT-144P-M05) F144006S-2C-3 FPT-144P-M05

    Untitled

    Abstract: No abstract text available
    Text: QUAD FLAT L-LEADED PACKAGE 32 PIN CERAMIC FPT-32C-C02 Lead pitch 50mil Package width x package length 450 × 550mil Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80mm 32-pin ceramic QFP FPT-32C-C02 32-pin ceramic QFP (FPT-32C-C02)


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    PDF FPT-32C-C02 50mil 550mil 32-pin FPT-32C-C02)

    QFP144

    Abstract: QFP144-P-2020-1
    Text: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M03 EIAJ code : ∗QFP144-P-2020-1 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M03 144-pin plastic QFP (FPT-144P-M03)


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    PDF FPT-144P-M03 QFP144-P-2020-1 144-pin FPT-144P-M03) QFP144 QFP144-P-2020-1

    sd3-75

    Abstract: FDC37C67X FDC37C93X cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference
    Text: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and


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    PDF FDC37C67x/FDC37C93x FDC37C67x FDC37C93x. FDC37C67x FDC37C93x FDC37C67x. sd3-75 cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference

    GP62

    Abstract: GP15 126-150 GP61 GP22 GP65 gp6*5 GP10 SA10 SA12
    Text: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data


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    PDF FDC37C68x/FDC37C93x FDC37C68x FDC37C93x. FDC37C93x FDC37C68x. 14CLK 39NTIES, GP62 GP15 126-150 GP61 GP22 GP65 gp6*5 GP10 SA10 SA12

    footprint plcc 208

    Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
    Text: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC


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    PDF SXT6051 SXT6251 SXT6282 144-Pin LXT300Z/301Z 28-Pin LXT304A footprint plcc 208 PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs

    GP11

    Abstract: No abstract text available
    Text: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data


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    PDF FDC37C68x/FDC37C93x FDC37C68x FDC37C93x. FDC37C93x FDC37C68x. 14CLK FDC37C68x, GP11

    SERIRQ

    Abstract: cross PD6
    Text: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and FDC37C93x data sheets for more information.


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    PDF FDC37C67x/FDC37C93x FDC37C67x FDC37C93x. FDC37C93x FDC37C67x. SERIRQ cross PD6

    icx060ak

    Abstract: sdfw0xxx CCD SENSORS OPB 715 44n30
    Text: PRELIMINARY KS7213 CCD TIMING GENERATOR GENERAL DESCRIPTION 80-QFP-1212 The KS7213 is a timing generator IC which generates the timing pulses necessary for color CCD image sensors. ORERING INFORMATION Device KS7213 FEATURES Package 80-QFP-1212 Operating Temperature


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    PDF KS7213 80-QFP-1212 KS7213 VID-96-P002-R2 icx060ak sdfw0xxx CCD SENSORS OPB 715 44n30

    FPT-68C-A02

    Abstract: package QFP 68
    Text: QUAD FLAT L-LEADED PACKAGE 68 PIN CERAMIC FPT-68C-A02 68-pin ceramic QFP Lead pitch 1.00mm Lead shape Gullwing Sealing method Metal seal FPT-68C-A02 68-pin ceramic QFP (FPT-68C-A02) 1.65±0.30 (.065±.012) 1.40±0.15 (.055±.006) 0.41(.016)MIN 19.61±0.25


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    PDF FPT-68C-A02 68-pin FPT-68C-A02) F68002SC-1-2 FPT-68C-A02 package QFP 68

    Untitled

    Abstract: No abstract text available
    Text: PA711D3-QD Data Sheet 44 pin QFP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, the Motorola 68HC711D3 in the QFP package can be programmed on 40 pin DIP programmers. The adapter is made up of 3 sub-assemblies. They assemble via


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    PDF PA711D3-QD socket/40 68HC711D3 68HC711E9 711D3QD

    Untitled

    Abstract: No abstract text available
    Text: 80C196KB10/83C196KB10/80C196KB12/83C196KB12 PACKAGING The 80C196KB is available in a 68-pin PLCC package, an 80-pin QFP package and a 68-pin PGA package. Contact your local sales office to determine the exact ordering code for the part desired. Package Designators: N = 68-pin PLCC, S = 80-pin QFP and A = 68-pin PGA.


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    PDF C196KB10/83C196KB10/80C196KB12/83C196KB12 80C196KB 68-pin 80-pin OrdKB/80C196KB 4fl2bl75

    PALM LCD

    Abstract: KS0084 KS0083 single chip computer lcd scientific calculator
    Text: LCD PRODUCTS DEVICE KS0083 PACKAGE 100 QFP or Bare chip FUNCTION Dot matrix LCD common/segment driver with 80 channel output KS0084 100 QFP or Bare chip KS0086 100 QFP or Bare Chip Dot matrix LCD common/segment driver with 80 channel output Dot Matrix LCD


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    PDF KS0083 KS0084 50x8x4 PALM LCD KS0084 KS0083 single chip computer lcd scientific calculator

    Untitled

    Abstract: No abstract text available
    Text: HDD BUS INTERFACE 1C FOR PERSONAL COMPUTERS SEMICONDUCTOR Ne w s 16 STANDARD LOGIC ICs HOUSED IN A SINGLE 68-PIN QFP PACKAGE CONTRIBUTES TO CONSIDERABLE PCB SPACE SAVING M66802FP previously 16 standard logic ICs in a single 68-pin QFP package, thus re d u c­


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    PDF 68-PIN 16-pin 68P6S

    instruction set tms320c50

    Abstract: TMS320C50 TMS320C51 VSS11
    Text: Chapter 2 Pinouts and Signal Descriptions Both the TMS320C50 and the TMS320C51 are available in a 132-pin Quad Flat Pack QFP package and have identical pin-to-slgnal relationship. The QFP package conforms to JEDEC specifications for electrical/electronic com­


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    PDF TMS320C50 TMS320C51 132-pin TMS320C5x instruction set tms320c50 VSS11

    UEI 15 SP 020

    Abstract: 691 OHD 3 - 115 M VMUX to3a SAA7140A SAA7140B new 60 ypf UEI 20 SP 010
    Text: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS 1 FEATURES SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 3 ORDERING INFORMATION


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    PDF SAA7140A) SAA7140B) 16-bit SAA7140A; SAA7140B UEI 15 SP 020 691 OHD 3 - 115 M VMUX to3a SAA7140A SAA7140B new 60 ypf UEI 20 SP 010

    UEI 20 SP 010

    Abstract: bord SAA7140A SAA7140B FEY G4 LQFP128 VR029 SAA7196 t3044 UL705
    Text: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION


    OCR Scan
    PDF SAA7140A; SAA7140B SAA7140A) SAA7140B) 711062b UEI 20 SP 010 bord SAA7140A SAA7140B FEY G4 LQFP128 VR029 SAA7196 t3044 UL705

    Untitled

    Abstract: No abstract text available
    Text: HDD BUS INTERFACE 1C FOR PERSONAL COMPUTERS bSl *1111 2 16 STANDARD LOGIC ICs HOUSED IN A SINGLE 68-PIN QFP PACKAGE CONTRIBUTES TO CONSIDERABLE PCB SPACE SAVING M66802FP p re vio u sly 16 stan dard logic ICs in a sin gle 6 8 -p in QFP package, th u s re d u c ­


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    PDF 68-PIN M66802FP 16-pin 66802FP,

    T02I

    Abstract: HP 1121 G1 SAA7140A SAA7140B TT 2222 Horizontal Output voltage horizontal prescaling LQFP128 SAA7140 VR029 VR07 135
    Text: Philips Semiconductors Objective specification SAA 7140 A; SAA 7140 B High Performance Scaler HPS CONTENTS PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION


    OCR Scan
    PDF SAA7140A; SAA7140B SAA7140A) SAA7140B) 7110fl5fci T02I HP 1121 G1 SAA7140A SAA7140B TT 2222 Horizontal Output voltage horizontal prescaling LQFP128 SAA7140 VR029 VR07 135