FX315P2
Abstract: mX 1524 pin diagram FX315LG FX315 CML marking
Text: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number
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Original
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FX315
FX315LG
24-pin
FX315P2
mX 1524 pin diagram
CML marking
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PDF
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221D
Abstract: PSOP44
Text: Version 1.0 PSOP: 44 LEAD PLASTIC SMALL OUTLINE PACKAGE DRAWING 23 44 A2 C φ E D L DETAIL A 22 1 D 1 A A1 e Y b SEE DETAIL A 44 Lead PSOP Specifications Package Height Standoff Package Body Thickness Lead Width Lead Thickness Package Body Length Package Body Width
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Original
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PDF
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FX315P2
Abstract: FX315 FX315LG
Text: Package Outlines Handling Precautions The FX315 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed below. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number
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Original
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FX315
FX315LG
24-pin
FX315LG
FX315P2
14-pin
FX315P2
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PDF
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transistor equivalent book
Abstract: free transistor equivalent book free download transistor data sheet free transistor equivalent book download transistor data book data sheet ltm240m1-l01 Transistors Diodes Data Book GWX-15 GWX-26
Text: Watch Crystals GWX Specifications GWX-38: 3.1 x 8.2mm cylindrical package GWX-26: 2.1 x 6.2mm cylindrical package GWX-15: 1.5 x 5.1mm cylindrical package Variant Parameters Package: 32.768kHz 5.10 max ±20ppm ±15ppm ±10ppm ±5ppm ˿ ˿
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Original
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GWX-38:
GWX-26:
GWX-15:
768kHz
20ppm
15ppm
10ppm
038ppm/
GWX-15
GWX-26haracteristics
transistor equivalent book
free transistor equivalent book
free download transistor data sheet
free transistor equivalent book download
transistor data book
data sheet
ltm240m1-l01
Transistors Diodes Data Book
GWX-15
GWX-26
|
PDF
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GWX-15
Abstract: GWX-26 GWX-38
Text: Watch Crystals GWX Specifications GWX-38: 3.1 x 8.2mm cylindrical package GWX-26: 2.1 x 6.2mm cylindrical package GWX-15: 1.5 x 5.1mm cylindrical package Variant Parameters Package: 32.768kHz 5.10 max ±20ppm ±15ppm ±10ppm ±5ppm ˿ ˿
|
Original
|
GWX-38:
GWX-26:
GWX-15:
768kHz
20ppm
15ppm
10ppm
038ppm/
GWX-15
GWX-26haracteristics
GWX-15
GWX-26
GWX-38
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PDF
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FX709J
Abstract: FX709 FX709LH
Text: Package Outlines Handling Precautions The FX709 is available in the package styles outlined below. Mechanical package diagrams and specifications are detailed in Section 10 of this document. Pin 1 identification marking is shown on the relevant diagram and pins on all package styles number
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Original
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FX709
FX709J
FX709LH
28-pin
28-lead
FX709J
FX709LH
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PDF
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0555B
Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7
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Original
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44-Lead,
48-Lead,
64-Lead
100-Lead,
144-Lead,
24-Lead,
20-Lead,
0555B
footprint jedec MS-026 TQFP AEB
20D3
48C1
footprint jedec MS-026 TQFP 128
jedec mo-142 footprint
TSOP 1238
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PDF
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20P3
Abstract: MS-001 MS-011 MS-016 MS-018
Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP).7-4
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Original
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28-Lead,
20-Lead,
20P3
MS-001
MS-011
MS-016
MS-018
|
PDF
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MIL-STD-1835
Abstract: 20P3 40D6 MS-011 MS-018
Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm) Plastic Gull Wing Quad Flat Package (TQFP).8-4
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Original
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PDF
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100P6S-A
Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
Text: Under development Preliminary specification Specifications in this manual are tentative and subject to change. Package Dimensions M32C/85 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g
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Original
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M32C/85
LQFP144-P-2020-0
144pin
2020mm
144P6Q-A
100P6S-A
QFP100-P-1420-0
LQFP100-P-1414-0
100P6Q-A
REJ09B0037-0030Z
100P6S-A
PAD108
|
PDF
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Small Signal Amplifiers
Abstract: SST3
Text: Transistors USA / European specification models types FSST3 / PNP type SST3 package FSST3 S SMT3 / PNP type General purpose small signal amplifiers General purpose amplification and switching 86 SST3 package SMT3 package Transistors USA / European specification models types
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Original
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PDF
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100P6S-A
Abstract: LQFP100-P-1414-0 LQFP144-P-2020-0 QFP100-P-1420-0 PAD108
Text: Under development Preliminary specification Specifications in this manual are tentative and subject to change. Package Dimensions M32C/84 Group Package Dimensions Recommended EIAJ Package Code LQFP144-P-2020-0.50 Plastic 144pin 20✕20mm body LQFP Weight g
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Original
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M32C/84
LQFP144-P-2020-0
144pin
2020mm
144P6Q-A
100P6S-A
QFP100-P-1420-0
LQFP100-P-1414-0
100P6Q-A
REJ09B0036-0041Z
100P6S-A
PAD108
|
PDF
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0403 20 PIN SMD IC
Abstract: MS-001-AB SO8C tny264g P08A R0308 eSIP-7C TO-220-7C TO-263-7C tny2* 7 pin
Text: Package Information Package Design Specifications, Tape & Reel and Assembly Information Package Design Specifications TO-220-7C .165 4.19 .185 (4.70) .390 (9.91) .420 (10.67) .146 (3.71) .156 (3.96) .108 (2.74) REF + .045 (1.14) .055 (1.40) .234 (5.94)
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Original
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O-220-7C
O-220
O-220
0403 20 PIN SMD IC
MS-001-AB
SO8C
tny264g
P08A
R0308
eSIP-7C
TO-220-7C
TO-263-7C
tny2* 7 pin
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PDF
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DS15
Abstract: DS-15 DS10 DS26 CYLINDER CALIBRATION
Text: Watch Crystals DS Specifications DS26: 2.0 x 6.1mm cylindrical package DS15: 1.5 x 5.1mm cylindrical package DS10: 1.1 x 4.3mm cylindrical package Variant Parameters 2.00 5.90 ACTUAL SIZE 0.70 DS15 32.768kHz Calibration tolerance: ±20ppm Other values
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Original
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768kHz
20ppm
038ppm/
000Hz
DS26/X)
DS15
DS-15
DS10
DS26
CYLINDER CALIBRATION
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: OBSOLETE - DO NOT USE Watch Crystals DS Specifications DS26: 2.0 x 6.1mm cylindrical package DS15: 1.5 x 5.1mm cylindrical package DS10: 1.1 x 4.3mm cylindrical package Variant Parameters 2.00 5.90 ACTUAL SIZE 0.70 DS15 32.768kHz Calibration tolerance:
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Original
|
768kHz
20ppm
038ppm/
000Hz
DS26/X)
|
PDF
|
SAFEB942MAL0F00
Abstract: SAFEB942 murata saw filter GSM900 murata smd diode marking 325 GSM900 202-5005 murata SAW
Text: SAW FILTER FOR GSM900 Rx Murata part number : SAFEB942MAL0F00 Feature 1. Low Insertion Loss (2.7 dB max.) 2. Ultra Small SMD package (1.35x1.05mm package) Test Circuit 2 50Ω 3 1 5 4 S.S.G. Package Dimensions Specification Item 1.35±0.05 Specification
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Original
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GSM900
SAFEB942MAL0F00
960MHz)
SAFEB942MAL0F00
SAFEB942
murata saw filter
GSM900 murata
smd diode marking 325
GSM900
202-5005
murata SAW
|
PDF
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CERAMIC LEADLESS CHIP CARRIER LCC 24
Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
Text: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)
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Original
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PDF
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GSM1900
Abstract: murata saw filter SAFEB smd diode marking 325 SAFEB1g96 SAFEB1G9 murata SAW
Text: SAW FILTER FOR GSM1900 Rx Murata part number : SAFEB1G96AA0F00 Feature 1. Low Insertion Loss (2.7 dB max.) 2. Ultra Small SMD package (1.35x1.05mm package) Test Circuit 2 50Ω 3 1 5 4 S.S.G. Package Dimensions Specification Item 1.35±0.05 Specification
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Original
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GSM1900
SAFEB1G96AA0F00
1960MHz
1990MHz)
GSM1900
murata saw filter
SAFEB
smd diode marking 325
SAFEB1g96
SAFEB1G9
murata SAW
|
PDF
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footprint jedec MS-026 TQFP
Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat
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Original
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32-lead,
44-lead,
48-lead,
64-lead
100-lead,
0555D
11/99/xM
footprint jedec MS-026 TQFP
atmel 0328
PQFP chip size
CERAMIC LEADLESS CHIP CARRIER 68
MS-026-AED
ATMEL 740
64 CERAMIC LEADLESS CHIP CARRIER LCC
8 lead side brazed
ATMEL 342
atmel 545
|
PDF
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LQFP80-P-1212-0
Abstract: No abstract text available
Text: Under development Preliminary specification Specifications in this manual are tentative and subject to change. M16C/28 Group 20. Package 20. Package Recommended EIAJ Package Code LQFP64-P-1010-0.50 Plastic 64pin 10✕10mm body LQFP Weight g – Lead Material
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Original
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M16C/28
LQFP64-P-1010-0
64pin
1010mm
80pin
1212mm
LQFP80-P-1212-0
64P6Q-A
REJ09B0047-0060Z
|
PDF
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FF1152
Abstract: UG002 BG728 BF957 FG676 led flip-chip CS144 FG256 BGA Package
Text: R Chapter 4: PCB Design Considerations Package Specifications This section contains specifications for the following Virtex-II packages: 426 • "CS144 Chip-Scale BGA Package 0.80 mm Pitch " on page 427 • "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)" on page 428
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Original
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FG256
FG456
FG676
BG575
BG728
FF896
FF1152
FF1517
CS144
UG002
UG002
BF957
led flip-chip
BGA Package
|
PDF
|
PCN0119
Abstract: Nitto-HC100 HC100 shin-etsu nitto hc100 Nitto HC 672-BALL Compound Nitto EP20K200E
Text: PROCESS CHANGE NOTICE PCN0119 FineLine BGA Package Molding Compound Change Change Description: ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100. This change will not affect the package thickness specification, overall
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Original
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PCN0119
HC-100.
HC-100
EPF10K100E
484-Ball
EPF10K130E
EP20K200E
484-Ball
PCN0119
Nitto-HC100
HC100
shin-etsu
nitto hc100
Nitto HC
672-BALL
Compound
Nitto
|
PDF
|
Untitled
Abstract: No abstract text available
Text: H B B I Halogen Free S.A.W. Filter SMD PRODUCTS ISF (SMD S.A.W. FUter Series) Part Number: ISF - Frequency - Pass Bandwidth - Package Example: ISF-434.000-2-SA •Specification 1Part No. ISF - Frequency - Pass bandwidth - Package Specification Package Frequency Range
|
OCR Scan
|
ISF-434
000-2-SA
|
PDF
|
2SC4911
Abstract: 2SC5073 2SC5072 equivalent 2sc3722k T147 2SC4619 2SC3082K 2SC4723 2sc4997 equivalents 2sa1455k
Text: Transistors From very small EM3 type package to high power PSD package the power dissipation is equivalent to TO-220, Pc=35W transistors. EM3 • UNIT • SMT Three types are available to allow the most suitable package depending on size specifications.
|
OCR Scan
|
O-220,
2SA1037AKLN
2SA1455K
2SC2412KLN
2SC3722K
2SC4911
2SC5073
2SC5072
equivalent 2sc3722k
T147
2SC4619
2SC3082K
2SC4723
2sc4997
equivalents 2sa1455k
|
PDF
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