56mm carrier tape
Abstract: 28 pin ic TM 1628
Text: u Chapter 13 Packing Methods and Labels CHAPTER 13 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Packing for Jewel Boxes Box Labeling Packages and Packing Publication Revision A 3/1/03
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3027b
56mm carrier tape
28 pin ic TM 1628
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Untitled
Abstract: No abstract text available
Text: MITSUMI Packing Packing Tube Magazine Packing List of Devices per Packing Unit The following table gives the number of devices per packing unit for each package type. Package type DIP SDIP SIP SOP SSOP 8A 8B 14A 16A 16B 18A 28A 28B 28C 22A 24A 30A 30C 32A
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350owing
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WNF008
Abstract: code res pack 8 SO3016 UNE008 spansion tray
Text: Chapter 10 Packing Methods and Labels CHAPTER 10 PACKING METHODS AND LABELS Introduction Quality Pack Program Packing for Tubes Packing for Trays Packing for Tape and Reels Box Labeling Packages and Packing Methodologies Handbook 1 March 2008 10-1 Chapter 10 Packing Methods and Labels
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poly aluminum chloride
Abstract: rubidium radioactive
Text: Chapter 11 Chemical Content of Product Carriers and Packing Materials CHAPTER 11 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Recyclability of Packing Materials and Product Carriers Summary of Hazardous Chemicals Not Present in Packing Materials
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MD300-10A
Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP
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S64F1-CA1
S108S1-YHC
P116S1-YJC
S144S1-YKC
S176S1-2C
S224S1-3C-1
S304S1-6C
S256N7-B6
S352N7-F6-1
S420N7-F6
MD300-10A
QFN tray
tray datasheet bga
SIP 400B
TSOP TRAY 40 PIN
BGA package tray 64
NEC A39A 240
TSOP package tray
6-tsop
TRAY DIMENSIONS 132 PGA
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K660
Abstract: material content amd AMD chemical content 9002-86-2
Text: u Chapter 14 Chemical Content of Product Carriers and Packing Materials CHAPTER 14 CHEMICAL CONTENT OF PRODUCT CARRIERS AND PACKING MATERIALS Introduction Packing Materials Content Tray Recycling Program Recyclability of Packing Materials and Product Carriers
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a1770
Abstract: EVD30 a3x2g7 E41871 B66298 corrugated B66298V1012T1 250 B 340 smd Transistor u cores Wound Toroids Coil
Text: Ferrites and accessories Packing Date: September 2006 Data Sheet EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the information contained therein without EPCOS’ prior express consent is prohibited. Packing Packing Survey of packing modes
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FAL0697-T
FAL0677-E
a1770
EVD30
a3x2g7
E41871
B66298
corrugated
B66298V1012T1
250 B 340 smd Transistor
u cores
Wound Toroids Coil
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SC-82AB
Abstract: packing packing list
Text: MITSUMI Packing Packing List of Packing Types Packing types for each package are given in the following table. Package type TO-92 SOP SSOP VSOP TSOP MMP SOT-25 SOT-26 SC-82AB QFP 3 A 7A 8A 8B 8C 8D 8E 14A 14B 16A 16B 18A 20B 22A 24A 28A 28B 16A 20A 24A 8A
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OT-25
OT-26
SC-82AB
SC-82AB
packing
packing list
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mmelf
Abstract: carton box L0 SOD-123 SOD-323F sod-323f diode ssp sot-363
Text: Packing Code List Of SSP REEL PACKING Reel Inner Box Carton Carton Size Gross Weight Reel Size PCS (PCS) (PCS) (mm) (kgs/ Carton) (inch) 370x350x200 5.6 7 Outline (Package) Green compound Packing code RZ RZG 0503 5,000 30,000 0603 4,000 24,000 96,000 370x350x200
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370x350x200
5x22x23
DO-34/DO-35
370x370x420
DO-35
OD80C
x270x217
mmelf
carton box
L0 SOD-123
SOD-323F
sod-323f diode
ssp sot-363
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tqfp 10x10 tray
Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.
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antistatic epe foam
Abstract: mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
Text: The Operation Instruction of Packing Materials PURPOSE Warehouse and Subcontractors according to the instruction for purchaseing and incoming inspection, formulate the Operation Instruction of Packing Materials. SCOPE Related all packing materials in warehouse.
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200mm
150mm
118MIL
150MIL
300MIL
antistatic epe foam
mark JS sot-25
V7100
sot89 MARK JB
150MIL
300MIL
600MIL
SOT-25 JB
QFP Shipping Trays
TTO-220
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EPX10
Abstract: corrugated cardboard EPCOS LABEL
Text: Packing Packing Survey of packing modes Ferrites Type Packing Para. RM cores RM 4 to RM 10 RM 12, RM 14 Blister tapes Standard trays 3.2 2.2.1 170 168 PM cores PM 50/39 to PM 114/93 Standard trays 2.2.1 168 P cores all P cores P 9 x 5 to P 22 × 13 Standard trays
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TIMING DIAGRAM OF INT R
Abstract: C6000 SPRU190 TMS320C6000 programming tms320c6000
Text: Application Report SPRA551 TMS320C6000 McBSP: Data Packing Rebecca Ma Digital Signal Processing Solutions Abstract This document describes how to use the multi-channel buffered serial port McBSP in the Texas Instruments (TIä) TMS320C6000 digital signal processor (DSP) for data packing. Data packing
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SPRA551
TMS320C6000
16/24/32-bit
16-bit
32-bit
TIMING DIAGRAM OF INT R
C6000
SPRU190
programming tms320c6000
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MSOP-08
Abstract: 1206 melf MELF dimensions DFN1006 SOT-263
Text: Packing Code List of SSP REEL PACKING Outline Package Reel Inner Box Carton Carton Size (PCS) (PCS) (PCS) (mm) (Kgs/Carton) (inch) Packing code Green compound Packing Gross Weight Reel Size 0503 5,000 30,000 150,000 370x350x200 5.6 7 RZ RZG 0603
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370x350x200
395x220x235
2510P10
385x270x217
DO34/DO35
DFN1006
MSOP-08
1206 melf
MELF dimensions
DFN1006
SOT-263
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Untitled
Abstract: No abstract text available
Text: OS-CON Line-up Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Characteristics 1. OS-CONElectrical characteristics 1-1. Frequency characteristics
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6V/56Î
6V/47Î
RC-2003
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Untitled
Abstract: No abstract text available
Text: SVPFSeries Surface mount type OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data
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120Hz
10kHz
100kHz
500kHz
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Untitled
Abstract: No abstract text available
Text: SEPFSeries Radial lead type OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Specifications
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120Hz/20â
100kHz
16SEPF1000M
35SEPF82M
16SEPF180M
35SEPF22M
32SEPF22M
120Hz
10kHz
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Untitled
Abstract: No abstract text available
Text: OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data Series system diagram Selection guide
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J-STD-020
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Untitled
Abstract: No abstract text available
Text: OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data Series system diagram Selection guide
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120Hz/20â
120Hzâ
10kHz
10kHzâ
100kHz
100kHzâ
500kHz
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Untitled
Abstract: No abstract text available
Text: OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data Series system diagram Selection guide
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63SXE33M
100kHz
300kHz/20â
100kHz
100SXE15M
120Hzâ
10kHz
10kHzâ
100kHzâ
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Untitled
Abstract: No abstract text available
Text: OS-CON Line-up Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data Series system diagram Selection guide
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120Hz/20â
120Hzâ
10kHz
10kHzâ
100kHz
100kHzâ
500kHz
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smd marking E9
Abstract: SMD e9 SEPC Series 16SEPC100M 2SEPC820MW 6SEPC560MW SMD MARKING CODE C9 16SEPC270MX List of Marking
Text: SEPCSeries Radial lead type OS-CON Line-up Update Image of case size Products list Packing specifications （SMD type） Packing specifications （Radial lead type） Recommended soldering condition Fundamental structure Characteristics Reliability Technical data
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120Hz/20
100kHz
300kHz/20
100kHz,
Z/Z20
Specifi44
120Hz
10kHz
smd marking E9
SMD e9
SEPC Series
16SEPC100M
2SEPC820MW
6SEPC560MW
SMD MARKING CODE C9
16SEPC270MX
List of Marking
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TE85R
Abstract: TE85L
Text: 12. Packing M e th o d 12. Packing Method 12.1 List o f Packing Forms Sm all Su p e r M in i Type SSM Packing Form Tapine Spec.Marked Applicable Package Packing Dimensions (U nit:m m ) Packing U nit Appearance TE85L a , /SlQiSS i ( Emboss system TE85R (SSM)
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TE85L
TE85R
TE85N
TE12L.
TE12R.
TE85R
TE85L
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smd transistor 2f
Abstract: 330 smd transistor 2sk 168 K2663 smd TRANSISTOR code 2F 2SJ 162 m 147 smd transistor s4vb 10 73 SMD CODE TRANSISTOR 2SK smd transistor 1Z
Text: Basic Ordering and Packing Form Explanation of Packing Lists I.Type No. Exam ple 1 D 1N □ Exam ple 2 2 S K 2663 - Reverse voltage X l/1 0 . I -JEITA No. -JEITA Classification. 2SA, 2SB, 2SC, 2SD: Transistor 2SJ, 2SK: M OSFFT 2.C ode No. The code specify each packing form.
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Tap15
FTO-220
S10VB
S15VB
S15VBA
S25VB
S50VB
S10WB
S15WB
S20WB
smd transistor 2f
330 smd
transistor 2sk 168
K2663
smd TRANSISTOR code 2F
2SJ 162
m 147 smd transistor
s4vb 10 73
SMD CODE TRANSISTOR 2SK
smd transistor 1Z
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