Untitled
Abstract: No abstract text available
Text: C18 Pad 1 Bonding Pad 4 Pls 16 [0.406] 14 [0.356] SQ. 1 [0.025] Bond only on crosshatched area Pad 2 Pad 3 Pad 4 6 [0.152] 4 [0.102] Back Contact Dimensions in mils [mm] Give us a call at 888-641-SEMI 7364 web: http://www.aeroflex.com/metelics, email: [email protected]
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888-641-SEMI
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USE8530DT23SLF
Abstract: uselectronics
Text: U.S.Electronics Inc. USE8530DT23SLF Magnetic Transducer DIMENSIONS Dummy Pad 8.70 6.60 3.00 4-1.05 8.50 3.25 2.75 Polarity Pad - 1.20 8.50 Polarity pad (+) 3.50 0.80 Sound Emmision Hole 1.20 PAD LAYOUT 1.70 6.20 1.70 3.10 ELECTRICAL SPECIFICATIONS Model NO
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USE8530DT23SLF
USE-8530DT23SLF
USE8530DT23SLF
uselectronics
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QSMO-4610
Abstract: QSMO-4620
Text: SURFACE MOUNT CRYSTAL CLOCK OSCILLATOR QSMO - 4600 SERIES Hy-Q International 5.0 4 CARRIER TAPE AND REEL DIMENSIONS 0.95 1.0 2.54 3 13.5 2.0 TYP. 3.2 1.5 MARKING 2.0 2.0 1 2 Ø21 1.0 PAD CONNECTIONS PAD 1: E/D PAD 2: Vss PAD 3: OUT PAD 4: VDD 120.0˚ 1.4 Ø80
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10mSec.
QSMO-4610
QSMO-4620
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hy-q
Abstract: No abstract text available
Text: SURFACE MOUNT CRYSTAL OSCILLATOR QSMO - 4700 Hy-Q International CARRIER TAPE AND REEL DIMENSIONS 3.2 1.2 1.2 3 4 2 1 MARKING 2.5 9.0 2.0 TYP. 2.0 0.7 2.0 Ø21 1.3 0.4 PAD CONNECTIONS PAD 1: E/D PAD 2: Vss 1.3 120.0˚ 1.3 Ø80 Ø180 1.3 PAD 3: OUT PAD 4: VDD
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100ppm
10mSec.
hy-q
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USEDST-16C3S
Abstract: USE-DST-16C3
Text: U.S.Electronics Inc. USEDST-16C3S Magnetic Transducer DIMENSIONS Dummy Pad 8.80 6.60 1.80 4-1.10 4-0.80 0.53 1.0 6.5 10.0 3.25 3.25 2.5 Polarity Pad - 1.20 8.50 Polarity pad (+) 3.0 0.40 Sound Emmision Hole 0.87 PAD LAYOUT 1.70 4.80 ELECTRICAL SPECIFICATIONS
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USEDST-16C3S
314-423-75503S
USEDST-16C3S
USE-DST-16C3
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USEDST-16C3S-ALF
Abstract: No abstract text available
Text: U.S.Electronics Inc. USEDST-16C3S-ALF Magnetic Transducer DIMENSIONS Dummy Pad 8.80 6.60 0.53 4-0.80 1.80 4-1.10 6.5 10.0 1.0 2.5 Polarity Pad - 1.20 8.50 Polarity pad (+) 0.40 3.0 Sound Emmision Hole 0.87 PAD LAYOUT 1.70 5.80 ELECTRICAL SPECIFICATIONS
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USEDST-16C3S-ALF
USEDST-16C3S
USEDST-16C3S-ALF
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J412
Abstract: TELEDYNE RELAYS j412 j422d J412D J411T ER422DD ER412DD ER134 J116C J422
Text: Appendix A: Spacer Pads Pad designation and bottom view dimensions Height Ø.150 [3.81] REF Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for Centigrid .156 [3.96] (REF) Dim H MAX .256 [6.5] (REF) “M9” Pad for Centigrid®
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ER411T
ER412,
ER412D,
ER412DD
712TN,
RF300,
RF310,
RF320
ER420,
ER422D,
J412
TELEDYNE RELAYS j412
j422d
J412D
J411T
ER422DD
ER134
J116C
J422
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J412
Abstract: ER432T J412D j422d ER412T ER134D er411d j412dd J114D J134
Text: Appendix A: Spacer Pads Pad designation and bottom view dimensions Height Ø.150 [3.81] REF Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for TO-5 Dim H MAX “M4” Pad for Centigrid .156 [3.96] (REF) Dim H MAX .256 [6.5] (REF) “M9” Pad for Centigrid®
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ER411T
ER412,
ER412D,
ER412DD
712TN,
RF300,
RF310,
RF320
ER420,
ER422D,
J412
ER432T
J412D
j422d
ER412T
ER134D
er411d
j412dd
J114D
J134
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13,56 MHz RFID antenna
Abstract: RFID power supply mini laptop 13.56 MHz RFID tag rfid 13.56 MHz RFID specifications RFID Tracking Pad how to design 13.56 MHz RFID tag mini usb RFID interface
Text: Mini RFID Tracking Pad 3M Mini RFID Tracking Pad The 3M Mini RFID Tracking Pad is the latest RFID Tracking Pad from 3M. Designed ™ for compatibility, the mini tracking pad will work with systems that already have a 3M tracking pad. With enhanced aesthetics, the new mini tracking pad looks great
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200mW
225-4N-14
13,56 MHz RFID antenna
RFID
power supply mini laptop
13.56 MHz RFID tag
rfid 13.56 MHz
RFID specifications
RFID Tracking Pad
how to design 13.56 MHz RFID tag
mini usb
RFID interface
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ADN2845
Abstract: 18-PAD
Text: a 18-Pad Bare Die Dimensions shown in micrometers and millimeters 1 ADN2845 PAD PITCH: 200m DIE SIZE: 1140m ؎20m ؋ 1340m (؎20m) DIE THICKNESS: 0.25mm SINGLE PAD SIZE: 92m ؋ 92m DOUBLE PAD SIZE: 151m ؋ 92m 1140m (؎20m)
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18-Pad
ADN2845
1140m
1340m
ADN2845
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16.8Mhz oscillator
Abstract: "Crystal Oscillator" 4mhz CRYSTAL 8MHZ
Text: Hy-Q International 7.0 1.0 1.7 4 5.0 VOLTAGE CONTROLLED TEMPERATURE COMPENSATED CRYSTAL OSCILLATOR VCTCXO QSMO - 5100 3 3 2 1.2 4 MARKING 1 6.0 2 1 2.54 0.8 1.5 SUGGESTED PAD LAYOUT PAD CONNECTIONS PAD 1: Vcontrol PAD 3: OUTPUT PAD 2: GROUND PAD 4: VCC Ø1.5 TYP.
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13MHz,
20MHz
//10pF
15ppm
16.8Mhz oscillator
"Crystal Oscillator" 4mhz
CRYSTAL 8MHZ
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MRGF
Abstract: LP73 UR73D LA73 LT73 NT73 RF73 RK73 RN73 SG73
Text: Appendix E pad dimensions standard soldering pad dimensions The optimum soldering pad dimensions may differ depending on soldering conditions, however, the following land dimensions are generally recommended. WK73 RK73 SG73 RN73 RN73H SR73 LT73 NT73 PT72 LA73
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RN73H
SDT73
MRGF
LP73
UR73D
LA73
LT73
NT73
RF73
RK73
RN73
SG73
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4510
Abstract: HY-Q 4510 datasheet 4540 top marking QSMO-4510 QSMO-4520 QSMO-4530 QSMO-4540
Text: SURFACE MOUNT CLOCK OSCILLATOR QSMO - 4500 Hy-Q International 3.2 MAX 5.08±0.2 14.0 MAX 4 9.8 MAX 1.2±0.1 TYP. 3 3 5.08±0.2 6.2±0.2 MARKING 1 SUGGESTED PAD LAYOUT TOP VIEW 4 2 1 2 3 4 5.08 ±0.2 PAD CONNECTIONS 1 SERIES NUMBER PAD 1 PAD 2 PAD 3 PAD 4
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QSMO-4510
QSMO-4530
QSMO-4540
QSMO-4520
4510
HY-Q
4510 datasheet
4540 top marking
QSMO-4510
QSMO-4520
QSMO-4530
QSMO-4540
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CTC 1351
Abstract: CTC 1351 transistor transistor ctc 1351 CTC 1351 data sheet smooth l725 Oriole Alcoa full tension sleeve STR S 6531 L726 P724
Text: BURNDY Transmission TABLE OF CONTENTS ACSR Conductor Accessories Deadends Single Pad . . . . . . . . . . . . . . . . . . I-3 Deadends Double Pad . . . . . . . . . . . . . . . . . I-4 Deadends Single Pad EHV . . . . . . . . . . . . . . I-5 Deadends Double Pad EHV . . . . . . . . . . . . . I-6
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QSMO-6110
Abstract: QSMO-6120 QSMO-6130 QSMO-6140 QSMO-6150
Text: SURFACE MOUNT VOLTAGE CONTROLLED CRYSTAL OSCILLATOR VCXO QSMO - 6100 SERIES Hy-Q International 7.5 5 6 5.0 1.8 4 MARKING 1 2 SUGGESTED PAD LAYOUT 1.4 TYP. 1.9 4 3 6 1 5 2 2.6 2.0 TYP. 3 4.2 PAD CONNECTIONS PAD 3: VSS PAD 1: Vcont PAD 2: E/D or NC PAD 4: OUT
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QSMO-6110
QSMO-6120
QSMO-6130
QSMO-6140
QSMO-6150
52MHz
25ppm
50ppm
36MHz
QSMO-6150
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Untitled
Abstract: No abstract text available
Text: Mounting Pads and Kits DF1 PAD 0.020" Typ. 0.015" Typ. SF1 PAD 0.015" Typ. 0.020" Typ. 0.015" Typ. 0.078" 0.035" DF2 PAD 0.035" 0.035" 0.026" Typ. 0.026" TFR1 PAD 0.010" SF2 PAD 0.030" 0.026" Typ. 0.026" Typ. 0.026" Typ. 0.010" 0.108" 0.075" 0.050" 0.050"
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TLM563D
Abstract: No abstract text available
Text: Package Details - TLM563D Mechanical Drawing Lead Code: Reference individual device data sheet. Part Marking: 2-3 Character Alpha/Numeric Code *Exposed pad P1 common to pin 6 *Exposed pad P2 common to pin 3 Mounting Pad Geometry Dimensions in mm Central
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TLM563D
EIA-481-1-A
20x18x5
23x23x13
23x23x23
21x9x9
53x23x23
27x9x17
69x23x43
TLM563D
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Geometries Dimensions in mm. DPAK Cuitral Mmleandaccor Corp. b— 420 H Mounting Pad Geometries (Dimensions in mm.) HD DIP PAD GEOM 421 Central Mounting Pad Geometries (Continued) (Dimensions in mm.) SMA * 2 .0 ► \_ I -i-
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OD-323
OT-143
OT-223
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FR4 SUBSTRATE SHEET
Abstract: 0343
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
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DS1822X
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. UNDERFILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. LAND PAD CONNECTIONS AND CENTER COORDINATES
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DS1822X
DS1822X
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0660H
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES. SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR FR4 SUBSTRATE APPLICATION 5. SPECIAL NOTE: OFFSET PAD DESIGN DO NOT SHRINK OR GROW LAND PAD
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175-O
41-A9502-000
IE/06/1999
DS9502X
DS9502X
0660H
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Untitled
Abstract: No abstract text available
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND PAD CENTER CONNECTIONS, SEE TABLE 1 4. U N D ER FILL OR GLOBTOP RECOMMENDED FOR FR4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1. NUMBER LAND PAD CONNECTIONS AND CENTER COORDINATES
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DS1820X
DS1820X
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DS2430AX
Abstract: FR4 substrate 0537
Text: NOTES: 1. DIMENSIONS: MM [IN C H ] 2. LASER MARK 3. LANDING PAD NOT DEFINED BY SOLDER MASK; FOR PAD CONNECTIONS AND COORDINATES, SEE TABLE 1 4. UNDERFILL RECOMMENDED FOR F R 4 SUBSTRATE APPLICATION TABLE 1. PAD CONNECTIONS AND CENTER COORDINATES MILLIMETERS
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DS2430AX
IS2430AX
022GE
DS2430AX
FR4 substrate
0537
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FR4 SUBSTRATE SHEET
Abstract: DS75X 3ao2
Text: NOTES: 1. DIMENSIONS: MM [INCH] 2. LASER MARK 3. NON-SOLDER MASK DEFINED LANDING PAD 4. UNDERFILL OR GLOB TOP RECOMMENDED FOR F R - 4 OR EQUIVALENT SUBSTRATE APPLICATIONS TABLE 1: SUBSTRATE CONNECTIONS AND PAD COORDINATES MILLIMETERS INCHES PAD# NAME CENTER X
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DS75X
DS75X
FR4 SUBSTRATE SHEET
3ao2
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