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    Untitled

    Abstract: No abstract text available
    Text: PRODUCT CHANGE NOTICE Refer to: PCN00061 Date: 7/19/00 Intersil Agreement with ChipPAC • Intersil Completes Multi-year Supply Agreement With ChipPAC • Sale of Kuala Lumpur, Malaysia Based Semiconductor Assembly and Test Operations to ChipPAC I N T E R S I L C O R P O R A T I O N Ã ÃÃ| Post Office Box 883 | Melbourne, FL USA 32902-0883 | Telephone 407-724-7000 | www.intersil.com


    Original     		PDF PCN00061

    HCA8001AIB

    Abstract: hca8001 HCA8001IB ca3080e HIP51222 CDP65C51AE2 HAA9P-51635R2869 hip51222db CDP68HC68R2E HIP6008CB
    Text: PRODUCT CHANGE NOTICE Refer to: PCN00067 Date: 8/25//00 Intersil’s Agreement with ChipPAC Notice of Qualification of ChipPAC Sites for Commercial SOIC, PLCC and PDIP Products I N T E R S I L C O R P O R A T I O N Ã ÃÃ| Post Office Box 883 | Melbourne, FL USA 32902-0883 | Telephone 407-724-7000 | www.intersil.com


    Original     		PDF PCN00067 PCN00061) HC55185ECM96R4854 HC55185ECMR4854 HC55185FCM HC55185FCM96 HC55185X HC5523IM HC5523IMR4706 HC5523IMR4722 HCA8001AIB hca8001 HCA8001IB ca3080e HIP51222 CDP65C51AE2 HAA9P-51635R2869 hip51222db CDP68HC68R2E HIP6008CB